JP2000207060A - 電子機器 - Google Patents
電子機器Info
- Publication number
- JP2000207060A JP2000207060A JP11011726A JP1172699A JP2000207060A JP 2000207060 A JP2000207060 A JP 2000207060A JP 11011726 A JP11011726 A JP 11011726A JP 1172699 A JP1172699 A JP 1172699A JP 2000207060 A JP2000207060 A JP 2000207060A
- Authority
- JP
- Japan
- Prior art keywords
- top cover
- circuit board
- keyboard
- shield plate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 19
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 12
- 239000004917 carbon fiber Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 238000003780 insertion Methods 0.000 description 15
- 230000037431 insertion Effects 0.000 description 15
- 230000005855 radiation Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 5
- 230000002708 enhancing effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011726A JP2000207060A (ja) | 1999-01-20 | 1999-01-20 | 電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011726A JP2000207060A (ja) | 1999-01-20 | 1999-01-20 | 電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000207060A true JP2000207060A (ja) | 2000-07-28 |
| JP2000207060A5 JP2000207060A5 (enrdf_load_stackoverflow) | 2005-12-02 |
Family
ID=11786049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11011726A Pending JP2000207060A (ja) | 1999-01-20 | 1999-01-20 | 電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000207060A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002073209A (ja) * | 2000-08-31 | 2002-03-12 | Toshiba Corp | パーソナルコンピュータ |
| US7310236B2 (en) | 2003-07-30 | 2007-12-18 | Sony Corporation | Electronic device |
| JP2009080800A (ja) * | 2007-09-03 | 2009-04-16 | Panasonic Corp | 情報処理装置 |
| JP2010160575A (ja) * | 2009-01-06 | 2010-07-22 | Fujitsu Ltd | 電子機器 |
| JP2012137884A (ja) * | 2010-12-24 | 2012-07-19 | Toshiba Corp | 電子機器 |
| JP2012209587A (ja) * | 2012-07-17 | 2012-10-25 | Toshiba Corp | 電子機器 |
| US8358512B2 (en) | 2009-11-25 | 2013-01-22 | Kabushiki Kaisha Toshiba | Electronic device |
| JP2019161187A (ja) * | 2018-03-16 | 2019-09-19 | クラリオン株式会社 | 電子機器及び電子機器の製造方法 |
| JP2021040103A (ja) * | 2019-09-05 | 2021-03-11 | 富士通クライアントコンピューティング株式会社 | 電子機器 |
-
1999
- 1999-01-20 JP JP11011726A patent/JP2000207060A/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002073209A (ja) * | 2000-08-31 | 2002-03-12 | Toshiba Corp | パーソナルコンピュータ |
| US7310236B2 (en) | 2003-07-30 | 2007-12-18 | Sony Corporation | Electronic device |
| JP2009080800A (ja) * | 2007-09-03 | 2009-04-16 | Panasonic Corp | 情報処理装置 |
| JP2010160575A (ja) * | 2009-01-06 | 2010-07-22 | Fujitsu Ltd | 電子機器 |
| US8358512B2 (en) | 2009-11-25 | 2013-01-22 | Kabushiki Kaisha Toshiba | Electronic device |
| JP2012137884A (ja) * | 2010-12-24 | 2012-07-19 | Toshiba Corp | 電子機器 |
| US8520379B2 (en) | 2010-12-24 | 2013-08-27 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| JP2012209587A (ja) * | 2012-07-17 | 2012-10-25 | Toshiba Corp | 電子機器 |
| JP2019161187A (ja) * | 2018-03-16 | 2019-09-19 | クラリオン株式会社 | 電子機器及び電子機器の製造方法 |
| JP2021040103A (ja) * | 2019-09-05 | 2021-03-11 | 富士通クライアントコンピューティング株式会社 | 電子機器 |
| US11175701B2 (en) | 2019-09-05 | 2021-11-16 | Fujitsu Client Computing Limited | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051017 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051017 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080122 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080321 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080415 |