JP2000183534A - Manufacture of wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply fill non-penetrating holes by, after supplying insulating resin to the surface of a substrate, compressing it toward the bottom of the non-penetrating holes and thereby solidifying it. SOLUTION: A compressing body 30 made of rigid material has its portion corresponding to insulating resin 22 at an area on the surface of a substrate 10 where a non-penetrating hole 12 is exposed before the insulating resin 22 is supplied, formed into protruded shape. The compressing body 30 is brought into contact with the insulting resin 22, supplied to the surface of the substrate 10, under pressure. When the insulating resin 22 is compressed toward the bottom of the non-penetrating hole 12, form E remaining in the non-penetrating through hole 12 is pressed out, and the interior of the non-penetrating hole 12 is filled with the insulating resin 22. Then the insulating resin 22 is heated and solidified to form an insulating layer. Thus the interior of the non- penetrating hole is simply filled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer wiring board having non-through holes.

[0002]

2. Description of the Related Art Conventionally, a multilayer wiring board is formed by forming a conductive circuit for an inner layer by etching a metal foil on a surface of a metal foil-clad laminate, and then forming the conductive circuit on the front and back of the inner layer substrate on which the conductive circuit is formed. By stacking a required number of prepregs impregnated with a thermosetting resin such as an epoxy resin on the base material, and arranging and laminating a metal foil such as a copper foil on one or both sides thereof, and then molding by heating and pressing After manufacturing multilayer laminates,
After forming a through hole through the multi-layer laminate by drilling, and then performing plating etc. on the wall surface of the through hole to make an electrical connection between the conductor circuit for the inner layer and the metal foil of the outer layer, It is manufactured by a method of forming a conductive circuit for an outer layer by etching an outer metal foil.

With the recent demand for higher density and higher productivity of wiring boards, an insulating layer made of a resin alone without using a base material is generally formed between a conductor circuit for an inner layer and a conductor circuit for an outer layer. A multilayer wiring board called a build-up wiring board is being studied. This build-up wiring board is a wiring board that penetrates between conductor circuits of an arbitrary layer and uses a non-penetrating through hole in the entire wiring board, and is not limited to the thickness of the base material, so that the thickness of the insulating layer can be reduced. There are features and the feature that the conductor circuit can be miniaturized by a plating process, and it is increasing.

As a method of manufacturing this build-up wiring board, for example, as described in Japanese Patent Application Laid-Open No. 4-148590, an insulating resin is formed on the surface of an inner layer substrate on which a conductive circuit and a non-through through hole are formed. A step of applying, a step of solidifying the applied insulating resin to form an insulating layer, a step of removing a part of the insulating layer to form a non-through through hole, a surface of the insulating layer and a non-through through hole The process of forming a conductor circuit by plating on the wall surface of the resin is repeated a required number of times, so that an insulating layer made of a resin alone and a conductor layer are alternately stacked and manufactured.

However, in this method, the applied insulating resin may not be sufficiently buried inside the non-through-hole, and the obtained wiring board may be swollen at the non-through-hole in a heat resistance test. There is a problem that this may occur, and there is a problem that a recess is formed in the insulating layer formed on the surface portion of the non-through through hole, and the reliability of component mounting and the reliability of the conductor circuit may be reduced.

Therefore, for example, Japanese Patent Laid-Open No. 6-31488
JP-A No. 7-115279 describes a method of filling an opening portion inside a non-through through hole with a plating metal and then applying an insulating resin to form an insulating layer as described in JP-A No. Such a method has been proposed in which an opening portion inside a non-through through hole is filled with a conductive powder and a cured resin, and then an insulating resin is applied to form an insulating layer.

However, these methods require a plating metal or conductive powder to fill the inside of the non-through-hole, which leads to an increase in cost and an increase in the number of steps, resulting in an increase in the wiring board obtained. There was a problem that the yield was reduced.

Further, as described in JP-A-9-232758, the inner wall of the concave portion of the non-through-hole is wetted with a solvent to promote the replacement of the applied insulating resin, and the inside of the non-through-hole is reduced. A method of filling with an insulating resin has also been proposed. However, this method has a problem that it is difficult to control the amount of the solvent applied. As described above, in the case of the conventionally proposed method, there are problems such as an increase in the number of steps, an increase in cost, and difficulty in managing conditions.
There is a need for a method of manufacturing a wiring board that can fill the inside of a non-through hole with a simpler method.

[0009]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an insulating film having a non-through-hole formed on the surface thereof. A method of manufacturing a wiring board in which a resin is supplied to form an insulating layer and a conductive circuit is formed on the surface of the insulating layer, and the inside of the non-through-hole is filled by a simple method. It is an object of the present invention to provide a possible method of manufacturing a wiring board.

[0010]

According to a first aspect of the present invention, there is provided a method of manufacturing a wiring board, wherein an insulating layer is formed by supplying an insulating resin to a surface of a substrate having a non-through through hole formed on the surface. In addition, in a method of manufacturing a wiring board for manufacturing by forming a conductive circuit on the surface of the insulating layer, the method of forming the insulating layer on the surface of the substrate is as follows. The method is characterized in that the resin is pressed toward the bottom side of the non-through hole, and then the insulating resin is solidified to form the resin.

According to a second aspect of the present invention, in the method for manufacturing a wiring board according to the first aspect, the method of pressing the insulating resin comprises supplying the insulating resin from the surface of the insulating resin. The method is characterized in that a portion of the insulating resin where the non-through through-hole is exposed on the surface of the substrate before is pressed at a higher pressure than other portions of the surface of the insulating resin.

According to a third aspect of the present invention, in the method for manufacturing a wiring board according to the first or second aspect, the method of pressing the insulating resin is preferably made of a flexible material or a rigid material. The method is a method in which a pressurizing member made of a resin is brought into pressure contact with an insulating resin.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a wiring board according to the third aspect, wherein a portion of the pressurizing body which is in contact with the insulating resin has non-adhesiveness to the insulating resin. Characterized in that the surface treatment is performed.

According to a fifth aspect of the present invention, in the method for manufacturing a wiring board according to the first or second aspect, the method for pressurizing the insulating resin comprises the steps of: Wherein at least one kind of substance selected from the group consisting of

According to a sixth aspect of the present invention, in the method of manufacturing a wiring board according to any one of the first to fifth aspects, the method of pressurizing the insulating resin comprises: The method is characterized in that a non-adhesive sheet material is disposed at a portion in contact with the insulating resin, and the insulating resin is pressed through the sheet material.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a wiring board according to the present invention will be described with reference to the drawings. 1 to 3 are process diagrams illustrating one embodiment of a method for manufacturing a wiring board according to the present invention, and FIG. 4 is a process diagram illustrating another embodiment of the method for manufacturing a wiring board according to the present invention. FIG. 5 is a cross-sectional view partially illustrating the method of manufacturing a wiring board according to still another embodiment of the present invention.
It is sectional drawing explaining a part of process.

In one embodiment of the method for manufacturing a wiring board according to the present invention, as shown in FIG. 1A, a non-through through hole 12 is formed on the surface and a conductor circuit 14 for an inner layer is formed on the surface. The formed substrate 10 is used. As a method for manufacturing the substrate 10, for example, it is manufactured in a process as shown in FIG. 3, and by etching a predetermined portion of the metal foil using a metal foil-clad laminate, as shown in FIG. As shown, an inner layer plate 16 having an inner layer conductor circuit 14a formed on its surface is manufactured. The surface of the inner layer plate 16 on which the metal foil is not stretched is plated with metal to form the inner layer conductor circuit 14a.
May be formed.

The metal foil-clad laminate or the inner layer plate 16 not covered with a metal foil is made of, for example, epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin or the like. If necessary, a metal foil may be applied to the surface of a sheet made of a curable resin, a thermoplastic resin such as polyvinyl chloride or polyethylene, or a resin in which an inorganic filler is blended with these resins. Plates, inorganic fibers such as glass, polyester, polyamide, cloth of organic fibers such as cotton, and a substrate such as paper are adhered with the above-mentioned thermosetting resin or the above-mentioned thermoplastic resin, and if necessary. A plate or the like having a metal foil stretched on its surface may be used. Note that a conductor circuit may also be provided on the inner layer of the metal foil-clad laminate or the inner layer plate 16 on which the metal foil is not provided.

Next, as shown in FIG. 3 (b), after supplying the insulating resin 22 to the surface of the inner layer plate 16 having the inner layer conductor circuit 14a formed on the surface, as shown in FIG. 3 (c),
Heating is performed to solidify the insulating resin 22 to form the insulating layer 20, and a part of the insulating layer 20 is removed to form the non-through through hole 12 at a predetermined position.
As shown in (d), by performing metal plating to form a metal film on the wall surface of the non-penetrating through hole 12 and to form the inner layer conductor circuit 14 at a predetermined position on the surface of the insulating layer 20, The substrate 10 having the non-through through-holes 12 formed on the surface and the inner layer conductor circuits 14 formed on the surface is manufactured.

The non-penetrating through-holes 12 may be formed by, for example, removing the unexposed portions of the insulating layer 20 with a chemical solution using a photo process, or forming a laser beam. A method of forming the insulating layer 20 by irradiating the insulating layer 20 may be used. The non-through through hole 12 may be formed by providing a portion to which the insulating resin 22 is not supplied. Also, although not shown, using a metal foil-clad laminate or an inner layer plate on which the metal foil is not stretched,
A non-penetrating through hole may be formed on the surface by a method of drilling by adjusting the cutting depth of the drill bit.

A non-penetrating through hole 1 is formed on this surface.
When a wiring board is manufactured using the substrate 10 on which the through holes 2 are formed, as shown in FIG. 1B, an insulating resin 22 is supplied to the surface of the substrate 10 to insulate the surface of the non-through-hole 12. Cover with resin 22. As the insulating resin 22,
For example, thermosetting resins in general are used, such as epoxy resins, phenol resins, polyimide resins, unsaturated polyester resins, polyphenylene ether resins, and the like, alone, modified products, and mixtures. The insulating resin 22 may contain an inorganic filler such as silica, calcium carbonate, aluminum hydroxide, talc, or glass fiber, if necessary. In addition, when the insulating resin 22 is an epoxy resin type, it is preferable because the electrical characteristics and the adhesiveness of the obtained wiring board are well balanced. When the insulating layer 20 is removed using a photo process, a photosensitive resin is used.

Even if the insulating resin 22 is supplied to the surface of the substrate 10, the insulating resin 22 is provided inside the non-through through-hole 12 exposed on the surface of the substrate 10 before supplying the insulating resin 22. There is a case where the bubbles E are not sufficiently supplied and the bubbles E remain.

Therefore, as shown in FIG. 1C, the portion of the insulating resin 22 where the non-through through-holes 12 were exposed on the surface of the substrate 10 before the insulating resin 22 was supplied.
By pressing a pressurizing member 30 made of a rigid material having a protruding shape at a portion corresponding to the pressure contact with the insulating resin 22 supplied to the surface of the substrate 10, the insulating resin 22 passes through the non-through-hole. When pressurized toward the bottom side of 12,
Even after the bubbles E remaining in the non-penetrating through-hole 12 are extruded, the inside of the non-penetrating through-hole 12 is filled with the insulating resin 22, and the pressing body 30 is separated from the insulating resin 22,
As shown in FIG. 1D, the state where the inside of the non-through through hole 12 is filled with the insulating resin 22 is maintained.

Next, the insulating resin 22 is heated and solidified to form an insulating layer 20 as shown in FIG. At this time, if the bubbles E remain inside the non-through-hole 12, the bubbles E expand when heated or the insulating resin 22 flows to the bottom side of the non-through-hole 12. According to the present invention, since the inside of the non-through through hole 12 is filled with the insulating resin 22, the insulating layer 20 having a substantially smooth surface is formed. You.

Next, a new non-through hole 12a is formed on the surface by removing the insulating layer 20 at a predetermined position. As a method of forming the new non-penetrating through hole 12a, similarly to the above, a method of removing the unexposed portion of the insulating layer 20 with a chemical solution using a photo process, or a method of forming a laser beam Irradiation of the insulating layer 20 to remove the insulating layer 20 is provided.
May be formed.

Next, as shown in FIG. 2B, metal plating is performed to form the newly formed non-penetrating through hole 12.
a, by forming a metal film on the wall surface and forming a conductor circuit 24 at a predetermined position on the surface of the insulating layer 20,
A wiring board having the conductor circuit 24 in which the inside of the non-through through hole is filled and whose surface is substantially smoothed is obtained. Therefore, even without a step of filling the inside of the non-through-hole with plating metal or the like, it is possible to obtain a wiring board in which the inside of the non-through-hole is filled, and to fill the inside of the non-through-hole with a simple method. Is a method of manufacturing a wiring board. The metal forming the conductor circuit 24 and the like is preferably copper from the viewpoint of electrical reliability.

In the above embodiment, the insulating resin 22 is added to the portion of the surface of the insulating resin 22 where the non-through through-holes 12 are exposed on the surface of the substrate 10 before the insulating resin 22 is supplied. The pressure body 30 is brought into contact with the pressure and the other parts are not brought into contact with each other, so that the portion of the surface of the insulating resin 22 where the non-through through-hole 12 is exposed on the surface of the substrate 10 before the insulating resin 22 is supplied. Insulating resin 22
Is pressed at a higher pressure than other portions of the surface of the insulating resin 22. Therefore, the inside of the non-penetrating through hole 12 can be efficiently filled with a small pressure.

As shown in FIG. 4A, the insulating resin 22 may be pressed by using a pressing member 30 made of a flexible material. When the pressurizing body 30 made of a flexible material is used, the flexible material is deformed and presses the insulating resin 22 in the non-through-hole 12, so that the unevenness followability is excellent, and the non-through-hole 12 is more reliably formed. Since the bubbles E remaining inside are extruded, the inside of the non-penetrating through hole 12 is more reliably filled with the insulating resin 22, which is preferable.

Further, as shown in FIG. 4B, pressure may be applied by a method in which the particulate matter 32 collides with the surface of the insulating resin 22. Also in this case, since the particulate matter 32 presses the insulating resin 22 in the non-through-hole 12, the air bubbles E remaining in the non-through-hole 12 are extruded as described above, and The inside is filled with the insulating resin 22. In addition, the particulate matter 32
Alternatively, a liquid substance or gas may be caused to collide with the insulating resin 22. In this case, similarly, the inside of the non-through-hole 12 is filled with the insulating resin 22.

It is to be noted that at least one substance selected from the group consisting of the particulate substance 32, the liquid substance and the gas is
When colliding with the insulating resin 22, a sheet-like substance 34 having a non-adhesive material or a non-adhesive surface treatment with respect to the insulating resin 22 is disposed at a portion in contact with the insulating resin 22, and the sheet When the insulating resin 22 is pressurized through the sheet material 34 by colliding the material 34 with at least one kind of material selected from the group consisting of the particulate material 32, the liquid material, and the gas, It is preferable that the substance 32 and the like adhere to and remain on the insulating resin 22 because it hardly occurs.

Similarly, when the pressing member 30 is brought into contact with the insulating resin 22 under pressure, the same non-adhesive sheet material 3 is used.
When the insulating resin 22 is pressurized through the insulating resin 4, the insulating resin 22 hardly adheres to the pressurized body 30, so that it is possible to reduce the cleaning work and the adhesion of the cleaning liquid to the surface of the insulating resin 22, which is preferable. In addition, a portion of the pressing body 30 that is in contact with the insulating resin 22 may be subjected to a non-adhesive surface treatment with respect to the insulating resin 22. Also in this case, the cleaning work and the adhesion of the cleaning liquid to the surface of the insulating resin 22 can be reduced, which is preferable.

Although the above embodiment has been described with reference to the embodiment in which the conductive circuit 24 is formed on the surface of the insulating layer 20 by performing metal plating, the insulating resin 22 is coated on the surface of the metal foil. The insulating resin 22 is supplied to the surface of the substrate 10 by a method of pressing the insulating resin-coated metal foil to the substrate 10 by using the resin-coated metal foil, and then heated to form the insulating resin 2.
2 may be solidified to form the insulating layer 20. Also in this case, the insulating resin 22 is applied via the metal foil toward the bottom side of the non-through-hole 12 between the time when the metal foil with the insulating resin is pressed on the substrate 10 and the time when the insulating resin 22 is solidified. When pressed, the inside of the non-penetrating through hole becomes insulating resin 22
And the inside of the non-through-hole can be filled by a simple method.

[0033]

EXAMPLES Example 1 5000 parts by weight of Ciba-Geigy "Provimer 52", 1600 parts by weight of a matting agent "DW91T", 1000 parts by weight of a curing agent "XJ9001" by Ciba-Geigy as insulating resin. Thinner (cyclohexanone 25% by weight and methyl cellosolve 75% by weight
Was mixed and mixed to prepare an epoxy resin-based photosensitive insulating resin liquid.

The photosensitive insulating resin liquid is applied to one side of an inner layer plate having an inner conductor circuit formed on the surface by etching a predetermined portion of copper foil using an epoxy resin copper-clad laminate. Is applied using a curtain coater, and then dried at 90 ° C. for 20 minutes.
An insulating layer having a thickness of 40 μm was formed. An insulating layer having a thickness of 40 μm was formed on the other side of the inner layer plate in the same manner.

Next, after a positive type mask was arranged on the surface of the insulating layer and exposed, development was performed to form a non-through hole having a diameter of 150 μm. Thereafter, a conductor circuit for the inner layer is formed on the surface of the insulating layer by panel plating, and a metal film is formed on the wall surface of the non-through through hole, so that a non-through through hole is formed on the surface, and the inner layer is formed on the surface. A substrate on which a conductor circuit was formed was manufactured.

Next, the photosensitive insulating resin solution was applied to the surface of the substrate using a curtain coater, and then air-dried for 10 minutes. Thereafter, as shown in FIG. 1C, a rigid structure having a convex structure corresponding to a portion of the surface of the insulating resin where the non-through through hole was exposed on the surface of the substrate before supplying the insulating resin. A pressing body made of a material was brought into pressure contact with the insulating resin, and the insulating resin was pressed toward the bottom surface of the non-through-hole. In addition, both surfaces of the substrate were pressed. This pressurizing body is composed of a stainless steel cylindrical portion having a diameter of 500 μm and a height of 5 mm, and is provided at a position corresponding to a portion where a non-through through hole is exposed on the surface of the substrate before supplying the insulating resin. Correspondingly, they are arranged to protrude from the flat plate.

Next, after the pressing body is separated from the insulating resin, it is dried at 90 ° C. for 20 minutes to have a thickness of 40 μm.
m insulating layers were formed on the front and back of the substrate.

Next, after a positive type mask was arranged on the surface of the insulating layer and exposed, development was performed to form a non-through hole having a diameter of 150 μm. Thereafter, a conductive circuit was formed on the surface of the insulating layer by a panel plating method, and a metal film was formed on the wall surface of the non-through through hole exposed on the surface to obtain a wiring board.

(Example 2) Except for using a pressurized body having a non-adhesive surface treatment to the insulating resin by coating a portion of the pressurized body that is in contact with the insulating resin with a fluororesin. A wiring board was obtained in the same manner as in Example 1.

(Example 3) A pressurizing member made of a flexible material was used in which a portion of the pressurizing member that contacts the insulating resin was a butyl rubber column having a diameter of 1000 µm and a height of 5 mm. A wiring board was obtained in the same manner as in Example 1.

(Example 4) Instead of pressing the insulating resin with a stainless steel pressing body, as shown in FIG.
Before supplying the insulating resin 22, the substrate 10 has an opening 38 at a plane position corresponding to a portion where the non-through through hole 12 is exposed on the surface, and a silicone rubber film 36 is provided on the surface opposite to the substrate 10. Bonded stainless steel mask 37
Is placed on the insulating resin 22, water 35 is supplied onto the mask 37, water pressure is applied from above, and the silicone rubber film 36 is projected through the opening 38 to form the insulating resin 22.
Pressurizes the portion of the insulating resin 22 where the non-penetrating through-hole 12 was exposed on the surface of the substrate 10 before supplying the insulating resin 22 toward the bottom surface of the non-penetrating through-hole 12. A wiring board was obtained in the same manner as in Example 1 except for the above.

(Example 5) Instead of pressing the insulating resin with a stainless steel pressing body, as shown in FIG.
Before supplying the insulating resin 22, a thin stainless steel mask 37 having an opening 38 at a plane position corresponding to a portion where the non-through-hole 12 was exposed on the surface of the substrate 10 was set on the insulating resin 22. Thereafter, a nitrogen gas 39 is supplied from above the mask 37 to supply the insulating resin 22 with the nitrogen gas 3.
9, the portion of the insulating resin 22 where the non-through through-hole 12 was exposed on the surface of the substrate 10 before the supply of the insulating resin 22 was pressed toward the bottom surface of the non-through through hole 12. Except for this, a wiring board was obtained in the same manner as in Example 1.

(Comparative Example 1) A wiring board was obtained in the same manner as in Example 1 except that the insulating resin was heated without pressurizing the insulating resin with a pressurizing body to form an insulating layer.

(Evaluation and Results) With respect to the wiring boards obtained in Examples and Comparative Example 1, a heat resistance test was performed to evaluate the filling property inside the non-through-hole. The method is as follows: the obtained wiring board is kept at 121 ° C. and 100% RH for 30 minutes.
After performing a minute pressure cooker test, the wiring board was immersed in a 260 ° C. solder bath for 10 seconds, and the appearance of the wiring board was visually observed.

As a result, the wiring board obtained in each of the examples did not show any abnormal appearance, but the wiring board obtained in the comparative example 1 had a non-through hole portion in the insulating layer. Swelling was observed, and it was confirmed that the wiring board obtained in each of the examples was superior to the wiring board obtained in Comparative Example 1 in filling the inside of the non-through-hole.

[0046]

According to the method of manufacturing a wiring board of the present invention, after supplying an insulating resin to the surface of a substrate, the supplied insulating resin is pressed toward the bottom side of the non-through-hole, and then the insulating resin is supplied. The wiring board filled with the inside of the non-penetrating through hole can be obtained without the step of filling the inside of the non-penetrating through hole with plating metal or the like. A method of manufacturing a wiring board capable of filling the inside of a through hole is provided.

According to the method of manufacturing a wiring board according to the second aspect of the present invention, in addition to the above effects, it is possible to efficiently fill the inside of the non-through through hole with a small pressure.

[Brief description of the drawings]

FIG. 1 is a process diagram illustrating one embodiment of a method for manufacturing a wiring board according to the present invention.

FIG. 2 is a process diagram illustrating one embodiment of a method for manufacturing a wiring board according to the present invention.

FIG. 3 is a process diagram illustrating one embodiment of a method for manufacturing a wiring board according to the present invention.

FIG. 4 is a cross-sectional view illustrating a part of a process in another embodiment of the method for manufacturing a wiring board according to the present invention.

FIG. 5 is a cross-sectional view illustrating a part of a process in still another embodiment of the method for manufacturing a wiring board according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 12 Non-through through hole 14 Conductor circuit for inner layer 16 Inner layer plate 20 Insulating layer 22 Insulating resin 24 Conductor circuit 30 Pressed body 32 Particulate matter 34 Sheet material 35 Water 36 Silicone rubber film 37 Mask 38 Opening 39 Nitrogen gas E bubbles

Claims (6)

[Claims] 1. A wiring board manufactured by supplying an insulating resin to form an insulating layer on a surface of a substrate having a non-through through hole formed on the surface, and forming a conductive circuit on the surface of the insulating layer. In the manufacturing method, the method of forming an insulating layer on the surface of the substrate is such that after supplying the insulating resin to the surface of the substrate, the supplied insulating resin is pressed toward the bottom side of the non-through-hole, A method for manufacturing a wiring board, wherein the method is a method of solidifying a wiring board. 2. A method of pressurizing an insulating resin, comprising the steps of: removing a portion of the insulating resin from which a non-through through hole is exposed on the surface of the substrate before supplying the insulating resin; 2. The method for manufacturing a wiring board according to claim 1, wherein said method is a method of applying a pressure higher than other parts. 3. The method for pressurizing an insulating resin is a method in which a pressurizing member made of a flexible material or a rigid material is brought into pressure contact with the insulating resin.
The method for manufacturing the wiring board according to the above. 4. The method for manufacturing a wiring board according to claim 3, wherein a portion of the pressurizing body that is in contact with the insulating resin is subjected to a surface treatment that does not adhere to the insulating resin. 5. The method for pressurizing an insulating resin is a method in which at least one substance selected from the group consisting of a particulate substance, a liquid substance, and a gas is caused to collide with the insulating resin. A method for manufacturing a wiring board according to claim 1. 6. A method of pressurizing an insulating resin, wherein a sheet-like substance which is not adhered to the insulating resin is disposed at a portion in contact with the insulating resin, and the insulating resin is pressed through the sheet-like substance. The method for manufacturing a wiring board according to any one of claims 1 to 5, wherein