JP2013211431A - Electronic component to be built in printed wiring board and manufacturing method of component built-in printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a component built-in printed wiring board having high long term reliability, in which a chip component can be held surely without increasing the manufacturing cost.SOLUTION: The electronic component to be built in a printed wiring board, in which the surface of an electrode terminal is formed of copper and the electrode terminal is coated with resin, is manufactured. A hole is formed in an organic resin substrate added with a glass material, and the electronic component to be built in a printed wiring board is inserted into the hole. Subsequently, a prepreg of semi-cured resin is hot pressed and hardened thus holding the electronic component to be built in a printed wiring board surely, without causing poor adhesion to the prepreg due to oxidation of the electrode terminal.

Description

  The present invention relates to a method for manufacturing a component-embedded printed wiring board having a multilayer wiring layer and incorporating a chip component, and a printed wiring board-embedded electronic component suitable for the method for manufacturing a component-embedded printed wiring board.

  2. Description of the Related Art In recent years, a printed wiring board on which a semiconductor device is mounted has been required due to the development of semiconductor mounting technology, and a multilayer printed wiring board having a high-density and high-precision wiring layer is required. As one method for realizing high density, a component-embedded printed wiring board incorporating an integrated circuit chip or a passive component chip component has been developed.

  In the prior art, the method for manufacturing a component-embedded printed wiring board is disclosed in Patent Document 1, in which a core substrate having an accommodation hole opening in the core main surface and at least the component side surface is covered with a resin coating layer, Some parts are not covered with a resin coating layer. With the core main surface and the component main surface facing the same side and with the inner wall surface of the receiving hole and the side of the component facing each other, the component is received in the receiving hole, and the interlayer insulating layer and conductor layer are placed on the core main surface. And laminated on the main surface of the component. The component is fixed by filling a gap between the inner wall surface of the accommodation hole and the surface of the resin coating layer covering the side surface of the component with a part of the interlayer insulating layer in contact with the core main surface.

  The thickness of the insulating coating layer is 200 μm or more and 800 μm or less, and the insulating coating layer of 500 μm is suitable from the viewpoint of housing the component in the housing hole and filling the gap between the housing hole and the component.

  In the technology of Patent Document 2, there is a core substrate having a receiving hole portion opened on the back surface of the core, and a component having a plurality of protruding conductors on the component back surface, and at least the component back surface is covered with a resin coating layer, Do not cover the protruding conductor surface. The component is accommodated in the accommodating hole with the core back surface and the component back surface facing the same side. After the housing, the inner wall surface of the housing hole and the side surface of the component are filled with resin, and the component is fixed. The top surface of the plurality of projecting conductors and the surface of the conductor layer formed on the back surface of the core are ground to the same height.

JP 2008-270776 A JP 2008-306173 A

  The technique of the printed wiring board with built-in components of Patent Document 1 has the following problems.

  (Problem 1) The back surface of the component is not covered with the resin coating layer, and there is a problem that the electrode terminal on the back surface side of the component is oxidized. In particular, when the component electrode terminal is a copper component, the electrode terminal is significantly oxidized. When the component electrode terminal is oxidized, there is a problem that it becomes defective as a printed wiring board with a built-in component such as a starting point of delamination due to insufficient adhesion with resin around the component when the component is built in.

(Problem 2) The thickness of the insulating coating layer is 200 μm or more and 800 μm or less, and is considerably thicker than the dimensions of the 0603 chip component and 0402 chip component generally used for internal use. The part dimensions are further greatly increased. For this reason, there is a problem in that various conditions for incorporation, such as the dimensions of the accommodation hole, must be changed from the case of incorporating a normal chip component without an insulating coating layer. When the component size is increased, the dimensional variation also increases, so that the positioning accuracy at the time of built-in deteriorates, and the manufacturing yield of the component built-in printed wiring board deteriorates.

  The technology of the printed wiring board with a built-in component disclosed in Patent Document 2 has the following problems. That is, similarly to Patent Document 1, there is a problem that the back surface of the component is not covered with the resin coating layer, and the electrode terminal on the back surface side of the component is oxidized. In particular, when the component electrode terminal is a copper component, the electrode terminal is significantly oxidized. When the component electrode terminal is oxidized, there is a problem that it becomes defective as a printed wiring board with a built-in component such as a starting point of delamination due to insufficient adhesion with resin around the component when the component is built in.

  The present invention was devised in view of the above problems, has an excellent mass productivity without increasing the manufacturing cost, and ensures close contact between the chip component and the resin around the component, and has high long-term reliability. It is an object to obtain a component built-in printed wiring board having the following.

  In order to solve the above-mentioned problems, the present invention is an electronic component with a built-in printed wiring board, wherein the surface of the electrode terminal is made of copper and the electrode terminal is covered with a resin.

  The present invention is also the above-described printed wiring board built-in electronic component, wherein the electrode terminal is coated with a resin having a thickness of 1 μm or more and 30 μm or less. It is a part.

  Further, the present invention is the above-described electronic component for incorporating a printed wiring board, wherein the surface of the electrode terminal is roughened with an average roughness Ra of 180 nm or more and 400 nm or less. Electronic parts.

  In addition, the present invention provides a process for manufacturing an electronic component with a built-in printed wiring board in which a surface of an electrode terminal is formed of copper and the electrode terminal is coated with a resin having a thickness of 1 μm or more and 30 μm or less; Holes are formed in the organic resin substrate, and the four corners of the holes are formed with gaps from the four corners of the printed circuit board built-in electronic component, and the four sides of the holes are printed in the holes. A process of forming the printed circuit board built-in electronic component in a shape that protrudes inward so that the gap is narrower than the size of the electronic component built in the wiring board, and friction on the wall surface projecting inside the four sides of the hole A step of holding the printed wiring board built-in electronic component by bringing the four sides into close contact with the outer surface of the resin covering the printed wiring board built-in electronic component. This is a method of manufacturing a component-embedded printed wiring board.

  Further, the present invention is a method of manufacturing the above-described component built-in printed wiring board, wherein after the step of holding the printed wiring board built-in electronic component, the glass-filled organic resin substrate and the printed wiring board built-in electronic A step of covering the component with an interlayer insulating resin layer from above and below and forming a hole reaching the electrode terminal through the interlayer insulating resin layer and the resin covering the printed wiring board built-in electronic component by laser drilling. A method of manufacturing a component built-in printed wiring board, comprising: forming a component electrode connection via hole by metal plating in the hole.

  Further, the present invention is a method for manufacturing the above-described component built-in printed wiring board, wherein the surface of the electrode terminal is subjected to wet barrel polishing so that the average roughness Ra is 180 nm or more and 400 nm or less. It is the manufacturing method of the component built-in printed wiring board characterized by having a process to convert.

In the manufacturing method of the component built-in printed wiring board 10 of the present invention, even if the chip size is a 0603 size chip component or a 0402 size chip component, the electrode terminal 5 of the chip component is used.
The printed wiring board built-in electronic component 50 in which the entire surface of 1 and other surfaces is coated with the resin 52 is manufactured. Then, the holes 31 are formed in the component-embedded printed wiring board 10 in such a manner that the holes 31 and the four side portions 31b of the holes 31 protrude into the holes 31 in an arc shape or a shape similar to an arc, The gap of the protruding portion having a circular arc shape similar to the circular arc into the air hole 31 is formed to be narrower than the dimension of the electronic component 50 for incorporating the printed wiring board.

  As a result, when the electronic component 50 with a built-in printed wiring board is inserted into the hole 31 of the printed wiring board 10 with a built-in component, the side wall surfaces of the four side portions 31b in the hole 31 and the electronic component 50 with a built-in printed wiring board. By rubbing the resin 52, a part of the resin 52 covered with the printed wiring board built-in electronic component 50 and a part of the material of the side wall surface of the four side portion 31 b in the hole 31 are scraped off. The shape of 52 and the shape of the cut four-sided portion 31b are brought into close contact in parallel. Accordingly, there is an effect that the printed wiring board built-in electronic component 50 is firmly held by the side wall surfaces of the four side portions 31b in the air holes 31 of the component built-in printed wiring board 10 at the contact surface.

  In addition, since the electrode terminal 51 of the printed wiring board built-in electronic component 50 is already covered with the resin 52, the space between the printed wiring board built-in electronic component 50 and the hole 31 of the component built-in printed wiring board 10 is provided. Affinity with the filling resin to be filled is high, and there is an effect that it can be completely adhered and filled. As a result, there is an effect of eliminating the gap and obtaining the component built-in printed wiring board 10 having high long-term reliability.

  As described above, according to the present invention, the dedicated printed wiring board built-in electronic component 50 used by being embedded in the hole 31 of the component built-in printed wiring board 10 has its electrode terminal 51 cured to an appropriate thickness of 1 μm to 30 μm. By covering and protecting with the resin 52, the oxidation of the electrode terminal 51 can be prevented over a long period of time.

  In addition, since the printed wiring board built-in electronic component 50 is coated with a cured resin 52 having an appropriate thickness of 1 μm or more and 30 μm or less, the printed wiring board built-in electronic component 50 is generally used in a small 0603 size. Even a chip part of 0402 size or a chip part of 0402 size is sufficiently thinner than the dimensions of the part. Therefore, it is not necessary to change various conditions for incorporation, such as the dimensions of the accommodation hole portion in the normal chip component built-in without an insulating coating layer, and the built-in printed circuit board 10 that can increase the mass productivity of the component built-in printed wiring board 10 There is an effect that the electronic component 50 is obtained.

It is a sectional side view explaining the manufacturing method of the electronic component for built-in printed wiring boards of the 1st Embodiment of this invention. It is a sectional side view explaining the manufacturing method of the component built-in printed wiring board of the 1st Embodiment of this invention (the 1). It is a sectional side view explaining the manufacturing method of the component built-in printed wiring board of the 1st Embodiment of this invention (the 2). (J) It is a top view which shows the void | hole formed in the component built-in printed wiring board of the 1st Embodiment of this invention. (K) It is a sectional side view of the void | hole formed in the component built-in printed wiring board. It is a sectional side view explaining the manufacturing method of the component built-in printed wiring board of the 1st Embodiment of this invention (the 3). It is a sectional side view explaining the manufacturing method of the component built-in printed wiring board of the 1st Embodiment of this invention (the 4). (A) It is sectional drawing of the plane of the component built-in printed wiring board of the 1st Embodiment of this invention. (B) It is side sectional drawing of the component built-in printed wiring board of the 1st Embodiment of this invention. It is a sectional side view explaining the manufacturing method of the component built-in printed wiring board of the 2nd Embodiment of this invention (the 1). It is a sectional side view explaining the manufacturing method of the component built-in printed wiring board of the 2nd Embodiment of this invention (the 2). It is a sectional side view explaining the manufacturing method of the component built-in printed wiring board of the 2nd Embodiment of this invention (the 2). (M) It is a sectional side view of the component built-in printed wiring board of the 2nd Embodiment of this invention. (N) It is sectional drawing of the plane of the component built-in printed wiring board of the 2nd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<First Embodiment>
In the present embodiment, as shown in FIG. 1, the printed wiring board built-in electronic component 50 is manufactured prior to manufacturing the printed wiring board. In the following, first, a method for manufacturing the electronic component 50 with a built-in printed wiring board will be described with reference to the side sectional view of FIG. The printed wiring board built-in electronic component 50 is a chip component such as a chip capacitor having a chip size of 0603 (length 0.6 mm, width 0.3 mm, height 0.6 mm, etc.), for example, as shown in FIG. As shown in the sectional side view of FIG. 1, the chip parts having the copper electrode terminals 51 are manufactured as follows.

(Manufacturing method of electronic components for embedded printed wiring boards)
First, as shown in the sectional side view of FIG. 1B, the surface of the copper electrode terminal 51 of the printed wiring board built-in electronic component 50 is roughened. In the roughening treatment, wet barrel polishing is desirably performed in order to control the average roughness of the surface of the electrode terminal 51 to an appropriate value. As a result, the roughness of the roughened surface formed is desirably 180 nm or more and 400 nm or less with an average roughness Ra specified in JIS B0601. When the average roughness Ra is smaller than 180 nm, the adhesion between the electrode terminal 51 and the resin 52 becomes weak. Further, when the average roughness Ra is larger than 400 nm, the resin 52 bites the bubbles, and the electrode terminals 51 cannot be covered evenly with the resin 52.

  As another roughening treatment, a blackening treatment by a copper oxidation-reduction treatment of the material of the electrode terminal 51 can be used. Alternatively, a chemical roughening process such as a soft etching process using a mixed solution of dilute sulfuric acid and hydrogen peroxide can be used.

  Alternatively, an imidazole copper (II) complex that chemically improves the adhesion between the copper electrode terminal 51 and the resin 52 formed thereon without physically roughening the surface of the copper electrode terminal 51. Further, it is possible to use MEC etch bond manufactured by MEC, which is a treatment liquid composed of glycolic acid and potassium chloride.

  Next, as shown in FIG. 1C, the printed wiring board built-in electronic component 50 is covered with a resin 52 on the entire electrode terminals 51 and other component main body portions 50 b. As the resin 52 used for coating, a thermosetting resin or an ultraviolet curable resin is used, and in particular, a resin 52 which is an epoxy resin and a mixture of an epoxy resin and another resin is desirable. As another material of the resin 52, a resin 52 mainly composed of an acrylic resin, a polyimide resin, or a PPE resin can be used. Further, the resin 52 may be mixed with a filler such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide.

  The method of coating the printed wiring board built-in electronic component 50 with the resin 52 is performed by coating or spraying the printed wiring board built-in electronic component 50. At this time, it is desirable to cover the printed wiring board built-in electronic component 50 with a soft resin 52 so that the stress generated by expansion and contraction when the resin 52 is cured is not destroyed. After coating the resin 52 by coating or spraying, if it is a thermosetting resin, it is cured in a high temperature bath, and if it is an ultraviolet curable resin, it is further cured in a high temperature bath after irradiation with ultraviolet rays.

The thickness of the resin 52 is preferably 1 μm or more and 30 μm or less. If the thickness of the resin 52 is greater than 30 μm, the built-in electronic component 50 becomes thicker due to the thickness of the resin 52, and there is a problem that the thickness of the embedded component printed wiring board 10 is increased. If the thickness of the resin 52 is less than 1 μm, the function of the electrode terminal 51 as an oxidation protection film is sufficient, but the resin terminal 52 cannot be covered evenly when a pinhole occurs in the resin 52, and as a result, the electrode terminal 51 is oxidized. There is a problem that cannot be prevented.

  In this embodiment, since the entire surface of the electrode terminal 51 of the printed wiring board built-in electronic component 50 is covered with the resin 52, the oxidation of the electrode terminal 51 of the component can be prevented. Accordingly, there is an effect that it is possible to strongly maintain the adhesive force with the resin around the component when the component is embedded, and it is possible to reduce the occurrence of delamination from the electrode terminal 51 of the electronic component 50 for embedded printed wiring board.

  In the present embodiment, the thickness of the resin 52 covering the entire surface of the electrode terminal 51 of the printed wiring board built-in electronic component 50 is set to 30 μm or less, so that the dimensions of the 0603 chip component and 0402 chip component generally used for the built-in are reduced. Compared to thin enough. For this reason, it is not necessary to change various conditions for incorporation, such as the dimensions of the receiving hole in the case of incorporating a normal chip component without an insulating coating layer, and therefore the mass productivity of the component built-in printed wiring board 10 is high.

(Manufacturing method of printed wiring board with built-in components)
Below, with reference to FIGS. 2-6, the manufacturing method of the component built-in printed wiring board 10 of the 1st Embodiment of this invention is demonstrated.

(Inner layer wiring board manufacturing method)
First, the manufacturing method of the organic resin core board | substrate 30 containing a glass material which comprises the component built-in printed wiring board 10 is demonstrated.

(Process 1)
As shown in FIG. 2A, double-sided copper having thin copper foils 2a on both sides of glass fiber or organic resin substrate 1 containing glass material such as epoxy resin or polyimide resin containing glass filler as a material for forming air holes 31. A tension substrate 2 is prepared.

  The following can be further used as the organic resin substrate 1. A glass fiber-containing bismaleimide-triazine resin (hereinafter referred to as BT resin) material and a glass fiber-containing PPE resin material can be used.

  As the reinforcing material, the following can be used instead of glass fiber. Aramid nonwoven fabric, aramid fiber, and polyester fiber can be used.

(Process 2)
Next, as shown in FIG. 2B, thin copper is applied to one surface of the double-sided copper-clad substrate 2 by irradiating laser light for drilling using a laser drilling device such as a carbon dioxide laser or UV-YAG laser. For an inner via hole having an opening with a diameter of 80 μm in the glass-filled organic resin substrate 1 penetrating the foil 2a and having a frustoconical wall with a diameter of 50 μm, the opening on the other side being about 30 μm smaller than the opening. The through hole 3a is drilled.

(Process 3)
Next, catalyst nuclei are imparted to the entire surface of the double-sided copper-clad substrate 2 and further immersed in an electroless copper plating bath to form an electroless copper plating film having a thickness of 0.1 μm to several μm. Next, as shown in FIG. 2 (c), using an electrolytic copper plating solution to which a smoothing agent is added, the plating bath is well stirred, and the flow rate of the copper plating bath on both sides of the double-sided copper-clad substrate 2 is increased. Electrolytic copper plating. Thereby, the smoothing agent suppresses the growth of the copper plating layer on both surfaces of the double-sided copper-clad substrate 2, while the growth of the electrolytic copper plating layer filling the through hole 3a for the inner via hole is not suppressed. Therefore, the inner via hole 3 is formed by filling the inner via hole through hole 3a with electrolytic copper plating, while the thickness of the copper plating layer formed on the first both surfaces of the double-sided copper-clad substrate 2 is set to the inner via hole 3a. It can be formed thinner than the radius of the hole through hole 3a.

  By the above processing, the inner via hole 3 is formed by embedding the inner via hole through hole 3a with copper plating, and the both sides of the double-sided copper-clad board 2 are 40% thicker than the radius of the inner via hole through hole 3a. A copper plating layer having a thickness of about 16 μm is formed.

(Process 4)
Next, as shown in FIG. 2D, a photosensitive resist, for example, a dry film etching resist is attached to the copper plating layer of the double-sided copper-clad substrate 2 by roll lamination, and exposed and developed to expose portions other than the circuit pattern. Let The exposed portion of copper is removed by etching. An aqueous ferric chloride solution or the like can be used as an etching solution. The etching resist of the dry film is peeled off, and the land of the inner via hole 3 and a wiring pattern (not shown) are formed.

  Next, a roughening process is performed on the land of the inner via hole 3 and the surface of the wiring pattern. As the roughening treatment, a chemical roughening treatment or a mechanical roughening treatment such as a blackening treatment by oxidation-reduction treatment of copper or a soft etching treatment using a mixed solution of dilute sulfuric acid and hydrogen peroxide is performed.

(Process 5)
Next, as shown in FIG. 2 (e), a prepreg 21 such as a semi-cured epoxy resin or a polyimide resin containing glass fiber or glass filler is laminated on both sides of the substrate, and a thin copper foil 22 is laminated on the outside thereof. The prepreg 21 is cured by heating and pressing to form a cured resin layer 21a, and an organic resin core substrate 30 with a glass material as shown in FIG. The thickness of the glass resin-containing organic resin core substrate 30 is equal to or greater than the thickness of the thickest printed wiring board built-in electronic component 50 built therein.

Furthermore, the following can be used as a prepreg. Glass fiber-containing bismaleimide-triazine resin (hereinafter referred to as BT resin) material, glass fiber-containing PPE resin material.
As the reinforcing material, the following can be used instead of glass fiber. Aramid nonwoven fabric, aramid fiber, and polyester fiber can be used.

  The following organic resins can be used as the resin material for the interlayer insulating layer. In addition, these resins can be used alone, or a combination of resins such as mixing a plurality of resins or preparing a compound can be used. Epoxy resin, BT resin, polyimide, PPE, phenol resin, PTFE resin, silicon resin, polybutadiene resin, polyester resin, melamine resin, urea resin, PPS resin, and PPO resin can be used.

  What added the filler to resin can also be used. As the filler, the following inorganic fillers can be used. Silica, barium sulfate, talc, clay, glass, calcium carbonate, titanium oxide. Instead of the inorganic filler, the following organic filler may be used, or an organic-inorganic mixed filler may be used. A phenol resin or a polymethacrylic acid polymer can be used.

(Step 6)
Next, as shown in FIG. 3G, a laser drilling device is used to irradiate a laser beam for drilling toward the inner via hole 3 from the surface of the organic resin core substrate 30 containing the glass material. Then, a via hole 23a that penetrates through the cured resin layer 21a and reaches the inner via hole 3 is formed. The via hole 23a has a diameter of about 50 μm to 150 μm.

(Step 7)
Next, the substrate is immersed in a desmear solution to perform a desmear process on the via hole 23a. In the desmear treatment, the resin is swollen with a strong alkali, and then the resin is decomposed and removed using an oxidizing agent such as chromic acid or a permanganate aqueous solution. Further, it may be removed by wet blasting or plasma treatment with an abrasive. Next, the substrate is immersed in an electroless copper plating solution, and an electroless copper plating film is formed on the wall surface of the via hole 23a.

(Process 8)
Next, as shown in FIG. 3 (h), the cathode of the electrolytic copper plating apparatus is connected to the thin copper foil 22 underlying the substrate, and the substrate is immersed in an electrolytic copper plating bath and electrolytic copper plating is performed on the entire surface of the substrate. Perform panel plating. Thereby, the via hole 23a of the substrate is filled in a columnar shape by copper plating to form the blind via hole 23.

(Step 9)
Next, as shown in FIG. 3I, the copper plating layer on the surface of the substrate is protected with an etching resist pattern. For example, a photosensitive film etching resist for dry film is attached by roll lamination, and exposed and developed to expose portions other than the circuit pattern. The exposed portion of copper is removed by etching. An aqueous ferric chloride solution or the like can be used as an etching solution. Strip the dry film etching resist. Thereby, lands 23b are formed on the surfaces of the columnar blind via holes 23 in the cured resin layer 21a, and other wiring patterns are formed.

  In particular, the wiring pattern on the lower surface side of the substrate forms a pattern of component support lands 23c having land opening holes 23d having a diameter of 30 μm to 60 μm at positions where the electrode terminals 51 of the printed circuit board built-in electronic component 50 are installed. . The diameter of the land opening hole 23d is formed such that the copper surface of the component support land 23c around the land opening hole 23d is exposed by the laser drilling when laser drilling is performed in the subsequent step 13. . Further, the shape of the component support land 23c is formed so as to protrude from the region of the hole 31 formed by laser ablation as shown in FIG. 4 (j). Also, the component support land 23c is created separately for each corresponding electrode terminal 51.

  Here, the glass resin-containing organic resin core substrate 30 may use the glass material-containing organic resin substrate 1 itself as the glass material-containing organic resin core substrate 30. In addition, it is preferable that the organic resin core substrate 30 with glass material is capable of higher-density wiring if each layer is connected by the inner via hole 3 or the blind via hole 23.

(Chip component integration method)
Next, as described below, a hole 31 is formed in the organic resin core substrate 30 with glass material, the printed wiring board built-in electronic component 50 is built in, and the interlayer insulating resin layer 40 is further formed to incorporate the component. The printed wiring board 10 is manufactured.

(Process 10)
As shown in the plan view of FIG. 4 (j) and the side view of FIG. 4 (k), the glass-filled organic resin core substrate 30 with the wiring pattern of the component support lands 23c formed on the lower surface is directed from the upper surface side to the lower surface. Then, by irradiating and processing laser ablation laser light L such as a carbon dioxide laser or a UV-YAG laser, a hole 31 for accommodating the electronic component 50 for built-in printed wiring board is formed. The wiring board portion 32 of the core board 30 is left outside the hole 31. As shown in the side view of FIG. 4K, the inner surface (upper surface) of the component support land 23 c on the lower surface of the organic resin core substrate 30 is exposed on the bottom surface (lower surface side) of the hole 31. Further, a laser ablation laser beam L is passed through the land opening hole 23d of the component support land 23c to form a hole. Parts support land 2
3c is formed so as to protrude from the region of the hole 31 formed by laser ablation, so that the protruding portion is in close contact with the lower surface of the organic resin core substrate 30 and integrated with the organic resin core substrate 30. Yes.

(Hole shape)
Further, as shown in FIG. 4 (j), the shape of the hole 31 in plan view is that the four four corner portions 31 a of the hole 31 are inserted into the four printed circuit board built-in electronic components 50 into which the holes 31 are inserted. It is formed to be 10 μm or more larger than the outer shape of the printed wiring board built-in electronic component 50 so as to open a gap from the corner. Preferably, the four corner portions 31a are formed to be larger than the outer shape of the printed wiring board built-in electronic component 50 by 20 μm or more.

  Then, as shown in a plan view of FIG. 4J, the four side portions 31b of the hole 31 are projected into the hole 31 in an arc shape or a shape similar to an arc. The gap between the four side portions 31b of the holes 31 is about 30 μm smaller than the outer dimension of the printed wiring board built-in electronic component 50 from a value smaller than the outer dimension of the printed wiring board built-in electronic component 50 inserted into the hole 31. Form dimensions within the range up to a large value.

(Step 11)
Next, a roughening process is performed on the surface of the copper pattern on the substrate. As the roughening treatment, a chemical roughening treatment or a mechanical roughening treatment such as a blackening treatment by oxidation-reduction treatment of copper or a soft etching treatment using a mixed solution of dilute sulfuric acid and hydrogen peroxide is performed.

(Step 12)
Next, as shown in FIG. 5L, the printed wiring board built-in electronic component 50 is inserted into the hole 31 from the upper surface side of the glass-filled organic resin core substrate 30, and the printed wiring board is built in the component support land 23c. The electronic component 50 is brought into contact, and the printed wiring board built-in electronic component 50 is supported from below by the component support land 23c.

  The component support land 23c supports the printed wiring board built-in electronic component 50 from the lower side, so that there is an effect that the printed wiring board built-in electronic component 50 can be securely held and the component can be prevented from falling off.

  In addition, when the electronic component 50 with a built-in printed wiring board is inserted, the electronic component 50 with a built-in printed wiring board rubs against the side wall surfaces of the four side portions 31 b in the holes 31, and the electronic component 50 with a built-in printed wiring board. A part of the resin 52 covered with is scraped off, and a part of the material of the side wall surface of the four side portion 31b in the hole 31 is scraped off. Thus, when the printed wiring board built-in electronic component 50 is inserted, the shape of the shaved resin 52 of the printed wiring board built-in electronic component 50 and the shape of the shaved four-side portion 31b are formed in close contact with each other. The In this way, by forming a shape in close contact with each other, the printed circuit board built-in electronic component 50 is formed on the contact surface side of the four-side portion 31b in the hole 31 of the component built-in printed circuit board 10. There is an effect of being firmly held by the wall surface.

(Step 13)
Next, as shown in FIG. 5 (n), the embedding property between the circuit patterns on the both surfaces of the glass-filled organic resin core substrate 30 in which the printed wiring board built-in electronic component 50 is held in the holes 31, and after lamination. A 40 μm thick sheet of prepreg 40a having a melt viscosity of 5000 Pa · s or less at a glass transition temperature of dynamic viscoelasticity (DMA) excellent in surface smoothness and a thin copper foil 40b of 12 μm thickness are combined and heated and pressed. Thus, the prepreg 40a is cured by heating and pressurizing with a vacuum laminating press to form an interlayer insulating resin layer 40 as shown in FIG.

(Modification 1)
As a modification of the method of forming the interlayer insulating resin layer 40, a prepreg 40a and a thin copper foil 40b are used.
For example, the interlayer insulating resin layer 40 may be formed by roll laminating sheets of an interlayer insulating layer such as an epoxy resin having a thickness of 40 μm on both surfaces of the core substrate 30 and thermocompression bonding.

  Examples of the material for the prepreg 40a and the interlayer insulating sheet include glass fiber-containing epoxy resin material, glass fiber-containing bismaleimide-triazine resin (hereinafter referred to as BT resin) material, glass fiber-containing polyimide resin material, and glass fiber-containing PPE resin. A material such as a material can be used.

  Specifically, the reinforcing material put into the material may be a glass fiber or a fiber material such as an aramid nonwoven fabric, an aramid fiber, or a polyester fiber. In addition, the resin material in the material includes epoxy resin, BT resin, polyimide resin, polyphenylene ether (PPE) resin, phenol resin, polytetrafluoroethylene (PTFE) resin, silicon resin, polybutadiene resin, polyester resin, melamine resin. Organic resins such as urea resin, polyphenylene sulfide (PPS) resin, and polyphenylene oxide (PPO) resin can be used. In addition, these resins can be used alone, or a combination of resins such as mixing a plurality of resins or preparing a compound can be used.

  What added the filler to resin can also be used. As the filler, silica, barium sulfate, talc, clay, glass, calcium carbonate, titanium oxide and the like can be used. Moreover, it may replace with an inorganic filler and may use organic fillers, such as a phenol resin and a polymethacrylic acid polymer, and may use an organic inorganic mixed filler.

  In this embodiment, as described above, the prepreg 40a and the thin copper foil 40b are laminated on both surfaces of the organic resin core substrate 30 with glass material, and the interlayer insulating resin layer 40 is formed on both surfaces by heating and curing in one step. Therefore, there is an effect that the manufacturing cost can be reduced. Moreover, since the thickness of the interlayer insulating resin layer 40 laminated on both surfaces of the organic resin core substrate 30 with glass material can be formed sufficiently thinner than the thickness of the base plate in the prior art using the base plate, the component built-in printed wiring board with a thin plate thickness 10 can be produced.

(Step 14)
Next, as shown in FIG. 6 (p), using a laser drilling device, drilling from the surface of the interlayer insulating resin layer 40 using an ultraviolet laser such as a UV-YAG laser or an excimer laser or an infrared laser such as a carbon dioxide laser. Via hole 41a, component electrode upper connection via hole 42a, and component electrode lower connection via hole 43a are formed by drilling through thin copper foil 40b and hardened prepreg 40a with laser light for use. To do.

  The interlayer insulating resin layer 40 and the resin 52 on the upper side of the electrode terminal of the printed wiring board built-in electronic component 50 are formed with holes having a diameter of 40 μm to 200 μm by the drilling laser beam. A component electrode upper connection via hole 42a for exposing the terminal 51 is formed.

  Then, component electrode lower connection via hole holes 43a are formed in the lower resin 52 and the interlayer insulating resin layer 40 of the electrode terminals 51 of the printed wiring board built-in electronic component 50 by a drilling laser beam. The component electrode lower connection via hole 43a has a diameter of 40 μm to 200 μm, exposes the copper surface of the component support land 23c, and penetrates the land opening hole 23d having a diameter of 0.03 mm to 0.06 mm. Then, holes are formed in the insulating resin filled in the land opening holes 23d to expose the electrode terminals 51.

(Step 15)
When the via hole 41a, the component electrode upper connection via hole 42a, and the component electrode lower connection via hole 43a are formed by laser light, a thin resin film may remain at the bottom of the via hole. Yes, in that case, desmear processing is performed. That is, by immersing the substrate in a desmear solution, a desmear process is performed on the via hole hole 41a, the component electrode upper connection via hole hole 42a, and the component electrode lower connection via hole hole 43a. In the desmear treatment, the resin is swollen with a strong alkali, and then the resin is decomposed and removed using an oxidizing agent such as chromic acid or a permanganate aqueous solution. Alternatively, it may be removed by wet blasting with an abrasive or plasma treatment.

  Further, when the interlayer insulating resin layer 40 is formed by thermocompression bonding a sheet of an interlayer insulating layer such as an epoxy resin and the surface of the insulating resin layer of the interlayer insulating resin layer 40 is exposed, the interlayer insulating resin is used as necessary. The surface of the insulating resin layer of the layer 40 is roughened. In general, when a sheet of an interlayer insulating layer of thermosetting resin or thermoplastic resin is used, wet processes such as surface roughening with an oxidizing agent such as an aqueous solution of chromic acid or permanganate, or plasma treatment And dry processes such as ashing are effective.

(Step 16)
Next, by immersing the substrate in an electroless copper plating solution, electroless copper plating is performed on the wall surfaces of the via hole hole 41a, the component electrode upper connection via hole hole 42a, and the component electrode lower connection via hole hole 43a. Form a film.

(Step 17)
Next, as shown in FIG. 6 (q), the cathode of the electrolytic copper plating apparatus is connected to the thin copper foil 40b underlying the substrate, and the substrate is immersed in an electrolytic copper plating bath to have a thickness of, for example, 15 μm. A panel plating process for electrolytic copper plating is performed. As a result, the via hole 41a, the component electrode upper connection via hole 42a and the component electrode lower connection via hole 43a of the substrate are filled in a columnar shape with copper plating to form the blind via hole 41 and the component electrode upper connection via. Holes 42 and component electrode lower connection via holes 43 are formed.

(Step 18)
Next, as shown in FIG. 6 (r), the copper plating layer on the surface of the substrate is protected with an etching resist pattern. For example, a photosensitive film etching resist for dry film is attached by roll lamination, and exposed and developed to expose portions other than the circuit pattern. The exposed portion of copper is removed by etching. An aqueous ferric chloride solution or the like can be used as an etching solution. Strip the dry film etching resist. Thereby, in the interlayer insulating resin layer 40, the columnar blind via hole 41 connected to the via hole land 23b and the component electrode upper side connection connected to the electrode terminal 51 of the printed circuit board built-in electronic component 50 are connected. A wiring pattern 44 connected to the via hole 42 is formed, and a wiring pattern 45 connected to the component electrode lower connection via hole 43 is formed.

  FIG. 7 shows a plan view (cross section) and a side sectional view of the component built-in printed wiring board 10. As shown in FIG. 7, the component built-in printed wiring board 10 according to the first embodiment includes a glass material-containing organic resin substrate 1 made of glass fiber or glass filler epoxy resin and glass fiber or glass filler polyimide resin. And an inner via hole 3 formed by electrolytic copper plating in the organic resin layer. The printed circuit board built-in electronic component 50 has a component electrode upper connection via hole 42 on the upper side of the electrode terminal 51, and the component electrode upper connection via hole 42 is connected to the wiring pattern 44 formed on the upper surface of the substrate. Further, the wiring electrode 45 has a component electrode lower connection via hole 43 below the electrode terminal 51 of the printed wiring board built-in electronic component 50, and the component electrode lower connection via hole 43 is formed on the lower surface of the substrate. Connecting.

  In this embodiment, in this way, a wiring structure is provided that conducts from the upper surface to the lower surface of the substrate from the top to the bottom at the position of the electrode terminal 51 of the printed wiring board built-in electronic component 50.

  The component electrode upper connection via hole 42 and the component electrode lower connection via hole 43, which are parts of the wiring structure, are formed in the component electrode connection via hole hole 42 a that reaches the electrode terminal 51 of the printed wiring board built-in electronic component 50. Since it is formed by plating, it can be firmly electrically connected to the electrode terminal 51 of the electronic component 50 with a built-in printed wiring board by metal plating, and the electrical connection with the electrode terminal 51 of the electronic component 50 with a built-in printed wiring board is reliable. There is an effect that can increase the nature.

  Either the top or bottom of the electrode terminal 51 of the electronic component 50 for embedded printed wiring board. Or it is possible to connect to the electrode terminal 5 from both, and there is an effect of increasing the degree of freedom of wiring.

  It should be noted that the substrate having the configuration shown in FIG. 7 formed in step 18 may be a finished product, or a substrate having a solder resist printed on the surface of the substrate may be manufactured. Alternatively, a substrate in which an interlayer insulating resin layer and a wiring pattern are further stacked on this substrate may be manufactured.

<Second Embodiment>
Next, the component built-in printed wiring board 10 according to the second embodiment and the manufacturing method thereof will be described with reference to FIGS. In the second embodiment, the organic resin core substrate 30 with glass material is composed of a copper-clad laminate in which 35 μm copper foil 1a is laminated on both surfaces of a substrate such as glass fiber or glass filler-containing epoxy resin or polyimide resin. The organic resin substrate 1 with glass material is used as it is. As a material of the organic resin substrate 1 with glass material, epoxy resin material with glass fiber such as FR-4, bismaleimide-triazine resin (hereinafter referred to as BT resin) material with glass fiber, polyimide resin material with glass fiber, glass A material such as a PPE resin material containing fibers can be used.

  The reinforcing material put into the material may be a glass material or a fiber material such as an aramid nonwoven fabric, an aramid fiber, or a polyester fiber.

(Process 1)
As shown in FIG. 8A, a through-hole prepared hole 4a is formed using a drill at a predetermined position of the glass-filled organic resin core substrate 30 using the glass-filled organic resin substrate 1. In some cases, resin is deposited on the side surface of the through-hole pilot hole 4a by frictional heat generated by the rotation of the drill. In this case, desmear treatment is performed. In the desmear treatment, the resin is swollen with a strong alkali, and then the resin is decomposed and removed using an oxidizing agent such as chromic acid or a permanganate aqueous solution. Alternatively, it may be removed by wet blasting with an abrasive or plasma treatment.

(Process 2)
Next, as shown in FIG. 8 (b), electroless copper plating is applied to the wall surface of the through hole pilot hole 4a, and electrolytic copper plating is applied as a plating thickness, and the through hole plating wall surface is applied to the inner wall surface of the through hole pilot hole. 4 is formed and electrically connected to the upper and lower copper foils 1a of the substrate. Moreover, the electrolytic copper plating layer 4b is formed on the outer side of the copper foil 1a on the upper and lower surfaces of the substrate. For example, a copper plating layer having a thickness of 15 μm is formed on the through-hole plating wall surface 4.

(Process 3)
Next, as shown in FIG. 8C, the hole filling material 5 is filled into the space surrounded by the through-hole plating wall surface 4. The following organic resin can be used for the hole filling material 5. Or they can be used in combination. That is, as a component of the hole filling material 5, organic resin such as epoxy resin, BT resin, polyimide resin, PPE resin, phenol resin, PTFE resin, silicon resin, polybutadiene resin, polyester resin, melamine resin, urea resin, cardo resin, etc. Can be used. Moreover, what added the filler to resin can also be used. As the filler, inorganic fillers such as silica, barium sulfate, talc, clay, glass, carbon, copper and other metals can be used. Instead of the inorganic filler, an organic filler may be used, or an organic-inorganic mixed filler may be used. Further, a metal paste such as a copper paste or a silver paste may be filled.

  The hole filling material 5 may adhere to the upper and lower surfaces of the electrolytic copper plating layer 4b on the substrate and may rise from the surface position of the surface of the electrolytic copper plating layer 4b. Remove by buffing. Further, the resin of the glass-filled organic resin substrate 1 is swollen with strong alkali so that the electroless copper plating in the next step can be adhered, and then the resin is decomposed using an oxidizing agent such as chromic acid or permanganate aqueous solution. , Roughen.

(Process 4)
Next, as shown in FIG. 8D, the upper and lower surfaces of the substrate are further subjected to electroless copper plating, and the electrolytic copper plating layer 6 is formed. The thickness of the electrolytic copper plating layer 6 is, for example, 10 μm. Thereby, the through-hole plating wall surface 4 can be electrically connected to the upper and lower electrolytic copper plating layers 6 via the electrolytic copper plating layer 4b electrically connected to the upper and lower ends thereof.

(Process 5)
Next, a photosensitive resist, for example, a dry film etching resist is attached to the upper and lower surfaces of the substrate by roll lamination, and exposure and development are performed to expose portions other than the circuit pattern. The exposed portion of copper is removed by etching. An aqueous ferric chloride solution or the like can be used as an etching solution. The etching resist of the dry film is peeled off to form a wiring pattern 7 as shown in FIG.

(Step 6)
As shown in FIG. 9 (f), the holes 31 are formed by punching the organic resin substrate 1 with glass material exposed by forming the wiring pattern 7 into a substantially rectangular shape with a mold or a carbon dioxide laser. Form. The holes 31 have dimensions slightly smaller than the printed wiring board built-in electronic component 50. Thus, the printed wiring board built-in electronic component 50 inserted into the hole 31 can be fixed by the stress of the glass-filled organic resin substrate 1.

(Step 7)
Next, as shown in FIG. 9G, the printed wiring board built-in electronic component 50 is inserted into the hole 31 from the upper surface side of the glass-filled organic resin core substrate 30, and the printed wiring board built-in electronic component 50 is inserted. Then, friction is caused with the side wall surfaces of the four side portions 31b in the holes 31. At that time, a part of the resin 52 covered with the printed wiring board built-in electronic component 50 is scraped off, and a part of the material of the side wall surface of the four side portion 31 b in the hole 31 is scraped off. Thus, when the printed wiring board built-in electronic component 50 is inserted, the shape of the shaved resin 52 of the printed wiring board built-in electronic component 50 and the shape of the shaved four-side portion 31b are formed in close contact with each other. The

  Here, when the printed wiring board built-in electronic component 50 is rubbed against the side wall surface of the four-side portion 31b in the hole 31, the printed wiring board built-in electronic component 50 is embedded even if the resin 52 is scraped off. In order to leave the resin 52 on the surface of the electronic component 50 and improve the adhesion with the four side portions 31b in the holes 31, the thickness of the resin 52 is set to 1 μm or more and 30 μm or less. It is desirable that the thickness be 10 μm or more and 30 μm or less in order to leave a part of the resin 52 on the surface of the printed wiring board built-in electronic component 50 even if the resin 52 is scraped.

(Modification 2)
As Modification 2 of Step 7, a resin 52 that covers the printed wiring board built-in electronic component 50 is formed of a thermoplastic resin. When the printed wiring board built-in electronic component 50 is installed in the hole 31, the resin 52 is heated by infrared rays to soften the resin 52 easily and then the side wall surface of the four-side portion 31 b is formed in the hole 31. Install in close contact with. The resin 52 heated and softened when the printed wiring board built-in electronic component 50 is installed in the hole 31 is cooled and hardened again after the printed wiring board built-in electronic component 50 is installed. There is an effect that the printed wiring board built-in electronic component 50 can be firmly held in the circuit board 31.

(Modification 3)
As a third modification, an ultraviolet curable resin can be used for the resin 52. When the printed wiring board built-in electronic component 50 is installed in the hole 31, the resin 52 made of ultraviolet curable resin is cured by irradiating ultraviolet rays, so that the printed wiring board built-in electronic component 50 is placed in the hole 31. Can be held firmly.

  Thus, a structure is formed in which the contact portions between the printed wiring board built-in electronic component 50 and the side wall surfaces of the four side portions 31b in the holes 31 are in close contact. Thus, the printed wiring board built-in electronic component 50 is firmly held by the close contact surfaces on the side wall surfaces of the four side portions 31b in the air holes 31 of the component built-in printed wiring board 10.

(Process 8)
Next, as in step 13 of the first embodiment, as shown in FIGS. 9H to 10I, the interlayer insulating resin layer 40 is thermocompression bonded by roll lamination or lamination press. For example, a 40 μm thick epoxy resin is roll laminated. When using a glass fiber epoxy resin prepreg 40a, a thin copper foil 40b having a thickness of 12 μm is superposed and thermocompression bonded by a vacuum lamination press.

(Step 9)
Next, in the same manner as in step 14 of the first embodiment, as shown in FIG. 10 (j), a via hole 41a for connecting the inner layer circuit, a component electrode upper connection via hole 42a, and a component The electrode lower connection via hole 43a is formed by a laser method. These via hole holes are formed not only in the interlayer insulating resin layer 40 but also in the resin 52 at the same time.

(Steps 10 to 12)
Next, in the same manner as in Step 15 to Step 17 of the first embodiment, desmear treatment, electroless copper plating treatment and electrolytic copper plating treatment are performed as shown in FIG. The hole 41a and the component electrode upper connection via hole hole 42a and the component electrode lower connection via hole hole 43a are filled in a columnar shape by copper plating to connect the blind via hole 41 and the component electrode upper connection via hole 42 to the component electrode lower connection. A via hole 43 is formed.

(Step 13)
Next, in the same manner as in step 18 of the first embodiment, as shown in FIG. 10L, a photosensitive resist, for example, an etching resist of a dry film is attached by roll lamination, and exposed and developed to form a wiring pattern. Parts other than 44 and 45 are exposed. The exposed portion of copper is removed by etching. An aqueous ferric chloride solution or the like can be used as an etching solution. The etching resist of the dry film is peeled off to form wiring patterns 44 and 45 shown in FIG.

(Step 14)
Furthermore, the process of process 8-process 13 may be repeated, and the board | substrate which piled up the interlayer insulation resin layer and the wiring pattern on the outer surface of this board | substrate may be manufactured.

(Step 15)
As shown in FIG. 11 (m), a solder resist 60 is formed. As a pretreatment of the solder resist 60, a roughening treatment of the surface of the electrolytic copper plating is performed by, for example, MEC etch bond manufactured by MEC, which is a treatment liquid composed of imidazole copper (II) complex, glycolic acid, and potassium chloride. Next, a photosensitive liquid solder resist is applied to a thickness of about 20 μm by spray coating, roll coating, curtain coating or screen method, and dried, or a photosensitive dry film / solder resist is applied by roll lamination. Then, the solder resist is exposed and developed, the pad portion is opened, and heated and cured in a high temperature bath.

  Next, 3 μm or more of electroless nickel plating is formed in the opening 61 of the solder resist serving as the external connection terminal, and 0.03 μm or more of electroless gold plating is formed thereon. Electroless gold plating may be 1 μm or more. Furthermore, solder may be precoated thereon. Instead of electroless nickel plating, electrolytic nickel plating may be formed to 3 μm or more, and electrolytic gold plating may be formed thereon to 0.5 μm or more. In addition to metal plating, a water-soluble rust-proof organic film such as Toughace made by Shikoku Kasei Kogyo Co., Ltd. may be formed.

(Step 16)
Next, the outer shape is processed to produce individual pieces of the component built-in printed wiring board 10.

  FIG. 11 (n) shows a plan view (cross section) of the component built-in printed wiring board 10. As shown in FIG. 11, the component built-in printed wiring board 10 of the second embodiment is a through-hole plating that conducts a glass-filled organic resin core substrate 30 and connects the upper wiring pattern 44 to the lower wiring pattern 45. The wiring structure includes a wall surface 4 and a blind via hole 41.

  Similarly to the first embodiment, a component electrode upper connection via hole 42 is provided above the electrode terminal 51 of the printed wiring board built-in electronic component 50, and the component electrode upper connection via hole 42 is formed on the upper surface of the substrate. Connected to the formed wiring pattern 44, and further has a component electrode lower connection via hole 43 below the electrode terminal 51 of the printed wiring board built-in electronic component 50, and the component electrode lower connection via hole 43 is formed on the substrate. Are connected to the wiring pattern 45 formed on the lower surface. Thus, a wiring structure is provided that can be connected to the electrode terminal 51 of the printed wiring board built-in electronic component 50 from either the upper surface or the lower surface of the substrate.

DESCRIPTION OF SYMBOLS 1 ... Organic resin board | substrate 1a with glass material ... Copper foil 2 ... Double-sided copper clad board 2a ... Thin copper foil 3 ... Inner via hole 3a ...・ Through hole 3b for inner via hole .... Land 3c for component installation .... Land 3d for component terminal .... Land opening hole 4 .... Through hole plating wall surface 4a .... Through hole Prepared hole 4b ... Electrolytic copper plating layer 5 ... Hole filling material 6 ... Electrolytic copper plating layer 7 ... Wiring pattern 10 ... Printed wiring board 21 with built-in components ... .... Prepreg 21a ... Hardened resin layer 22 ... Thin copper foil 23 ... Blind via hole 23a ... Via hole hole 23b ... Via hole land 23c ... Component support land 23d ... Land opening hole 30 ... With glass material Resin core substrate 31... Hole 31a... Four corner portions 31b... Four side portions 32... Wiring substrate portion 40 ... Interlayer insulating resin layer 40a ... Prepreg 40b ... Thin copper Foil 41 ... Blind via hole 41a ... Via hole 42 ... Component electrode upper connection via hole 42a ... Component electrode upper connection via hole 43 ... Lower part electrode Connection via hole 43a... Component electrode lower connection via hole 44... Wiring pattern 45... Wiring pattern 50. .... Electrode terminal 52 ... Resin 60 ... Solder resist 61 ... Solder resist opening L ... Laser light for laser ablation

Claims (6)

  A printed wiring board built-in electronic component, wherein the surface of the electrode terminal is made of copper, and the electrode terminal is covered with a resin.   2. The printed wiring board built-in electronic component according to claim 1, wherein the electrode terminal is coated with a resin having a thickness of 1 μm or more and 30 μm or less.   3. The printed wiring board built-in electronic component according to claim 1 or 2, wherein the surface of the electrode terminal is roughened with an average roughness Ra of 180 nm or more and 400 nm or less. Electronic parts.   A step of manufacturing an electronic component for embedded printed wiring board in which the surface of the electrode terminal is formed of copper and the electrode terminal is coated with a resin having a thickness of 1 μm or more and 30 μm or less; And the four corners of the hole are formed with gaps from four corners of the printed wiring board built-in electronic component, and the four sides of the hole are formed in the hole. And forming the printed circuit board built-in electronic component so as to have a gap narrower than the size of the above, and frictionally inserting the printed wiring board built-in electronic component into the wall surface projecting inside the four sides of the hole. A printed wiring board with a built-in component comprising the step of holding the printed electronic component with a built-in printed wiring board by bringing the four side portions into close contact with the outer surface of the resin covering the printed electronic component with a built-in printed wiring board Manufacturing method.   5. The method for manufacturing a printed wiring board with a built-in component according to claim 4, wherein the glass-filled organic resin substrate and the electronic component with a built-in printed wiring board are moved up and down after the step of holding the electronic component with a built-in printed wiring board. Forming a hole reaching the electrode terminal through the interlayer insulating resin layer and the resin covering the printed circuit board built-in electronic component by laser drilling and covering with an interlayer insulating resin layer A method of manufacturing a component built-in printed wiring board, comprising: forming a component electrode connection via hole by metal plating.   It is a manufacturing method of the component built-in printed wiring board of Claim 4 or 5, Comprising: The surface roughness of the said electrode terminal is roughened by the average roughness Ra of 180 nm or more and 400 nm or less by performing wet barrel polishing. The manufacturing method of the component built-in printed wiring board characterized by having a process to make.

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