JP2000174165A5 - - Google Patents
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- Publication number
- JP2000174165A5 JP2000174165A5 JP1998349109A JP34910998A JP2000174165A5 JP 2000174165 A5 JP2000174165 A5 JP 2000174165A5 JP 1998349109 A JP1998349109 A JP 1998349109A JP 34910998 A JP34910998 A JP 34910998A JP 2000174165 A5 JP2000174165 A5 JP 2000174165A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor element
- semiconductor device
- manufacturing
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 description 79
- 238000000034 method Methods 0.000 description 30
- 239000011347 resin Substances 0.000 description 26
- 239000010410 layer Substances 0.000 description 24
- 238000004519 manufacturing process Methods 0.000 description 24
- 229920005989 resin Polymers 0.000 description 22
- 239000000758 substrate Substances 0.000 description 21
- 239000007788 liquid Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- QVRVXSZKCXFBTE-UHFFFAOYSA-N n-[4-(6,7-dimethoxy-3,4-dihydro-1h-isoquinolin-2-yl)butyl]-2-(2-fluoroethoxy)-5-methylbenzamide Chemical compound C1C=2C=C(OC)C(OC)=CC=2CCN1CCCCNC(=O)C1=CC(C)=CC=C1OCCF QVRVXSZKCXFBTE-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10349109A JP2000174165A (ja) | 1998-12-08 | 1998-12-08 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10349109A JP2000174165A (ja) | 1998-12-08 | 1998-12-08 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000174165A JP2000174165A (ja) | 2000-06-23 |
| JP2000174165A5 true JP2000174165A5 (enrdf_load_stackoverflow) | 2005-12-02 |
Family
ID=18401556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10349109A Withdrawn JP2000174165A (ja) | 1998-12-08 | 1998-12-08 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000174165A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4050732B2 (ja) | 2004-08-30 | 2008-02-20 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法 |
| JP4887879B2 (ja) * | 2006-04-10 | 2012-02-29 | 日本電気株式会社 | 電子部品の実装構造およびその製造方法 |
| WO2022195800A1 (ja) | 2021-03-18 | 2022-09-22 | 株式会社Fuji | 電子部品装着方法、および電子部品装着装置 |
-
1998
- 1998-12-08 JP JP10349109A patent/JP2000174165A/ja not_active Withdrawn
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