JP2000162769A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000162769A5 JP2000162769A5 JP1998341267A JP34126798A JP2000162769A5 JP 2000162769 A5 JP2000162769 A5 JP 2000162769A5 JP 1998341267 A JP1998341267 A JP 1998341267A JP 34126798 A JP34126798 A JP 34126798A JP 2000162769 A5 JP2000162769 A5 JP 2000162769A5
- Authority
- JP
- Japan
- Prior art keywords
- radiation
- resin composition
- sensitive resin
- present
- polymerizable unsaturated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011229 interlayer Substances 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000010408 film Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34126798A JP3994429B2 (ja) | 1998-12-01 | 1998-12-01 | 層間絶縁膜用感放射線性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34126798A JP3994429B2 (ja) | 1998-12-01 | 1998-12-01 | 層間絶縁膜用感放射線性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000162769A JP2000162769A (ja) | 2000-06-16 |
| JP2000162769A5 true JP2000162769A5 (enExample) | 2005-06-30 |
| JP3994429B2 JP3994429B2 (ja) | 2007-10-17 |
Family
ID=18344734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34126798A Expired - Lifetime JP3994429B2 (ja) | 1998-12-01 | 1998-12-01 | 層間絶縁膜用感放射線性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3994429B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4529616B2 (ja) * | 2004-09-24 | 2010-08-25 | Ｊｓｒ株式会社 | 層間絶縁膜形成用感放射線性樹脂組成物および層間絶縁膜 |
| JP4775994B2 (ja) * | 2005-03-14 | 2011-09-21 | 株式会社リコー | 表示媒体とそれを用いた表示装置と可逆表示体 |
| KR101348757B1 (ko) * | 2006-02-03 | 2014-01-07 | 주식회사 동진쎄미켐 | 유기 절연막용 수지 조성물 및 그 제조 방법, 상기 수지조성물을 포함하는 표시판 |
| JP5108480B2 (ja) * | 2007-11-28 | 2012-12-26 | 東京応化工業株式会社 | 層間絶縁膜用感光性樹脂組成物 |
| KR102006751B1 (ko) | 2012-12-11 | 2019-08-02 | 제이에스알 가부시끼가이샤 | 감방사선성 수지 조성물, 표시 소자용 경화막, 표시 소자용 경화막의 형성 방법 및 표시 소자 |
-
1998
- 1998-12-01 JP JP34126798A patent/JP3994429B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4069076A (en) | Liquid lamination process | |
| JPH10307388A5 (enExample) | ||
| CA2345829C (en) | Process to manufacture tight tolerance embedded elements for printed circuit boards | |
| US4339526A (en) | Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices | |
| JP2000119472A5 (enExample) | ||
| JP2000162769A5 (enExample) | ||
| JPH0324076B2 (enExample) | ||
| JPH11258792A5 (enExample) | ||
| JPS62232989A (ja) | 基板上の回路線の形成方法 | |
| JPH1152574A5 (ja) | 感放射線性樹脂組成物、保護膜、層間絶縁膜およびこれらの膜の形成法 | |
| JPH02230149A (ja) | 画像形成方法 | |
| JPH05198933A (ja) | はんだパターン転写フィルムおよびその製造方法 | |
| JPS61201237A (ja) | 感光性樹脂組成物 | |
| GB2285891A (en) | Process for producing an electronic part | |
| JPS6180236A (ja) | ソルダ−レジスト形成用感光性フイルム | |
| JP4561625B2 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
| JPS60206192A (ja) | 薄膜ハイブリツド回路およびその製造方法 | |
| JPH01221735A (ja) | 画像形成方法 | |
| JP2660943B2 (ja) | 回路基板の接着方法 | |
| EP0469973A1 (en) | Method for forming relief patterns | |
| JPS63115337A (ja) | フオトレジストの処理方法 | |
| JP2005257812A (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
| JPH0820737B2 (ja) | ポリイミド樹脂の厚膜加工方法 | |
| JPH03173086A (ja) | 縦縞細条形ヒートシールコネクタ部材とその製造法 | |
| JPH0992984A (ja) | 回路基板及びその製造方法 |