JP2000162769A5 - - Google Patents
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- Publication number
- JP2000162769A5 JP2000162769A5 JP1998341267A JP34126798A JP2000162769A5 JP 2000162769 A5 JP2000162769 A5 JP 2000162769A5 JP 1998341267 A JP1998341267 A JP 1998341267A JP 34126798 A JP34126798 A JP 34126798A JP 2000162769 A5 JP2000162769 A5 JP 2000162769A5
- Authority
- JP
- Japan
- Prior art keywords
- radiation
- resin composition
- sensitive resin
- present
- polymerizable unsaturated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011229 interlayer Substances 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000001678 irradiating Effects 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000010408 film Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000001681 protective Effects 0.000 description 1
- 230000002285 radioactive Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Description
【０００１】
【発明の属する技術分野】
本発明は、感放射線性樹脂組成物、層間絶縁膜およびその形成方法に関する。さらに詳しくは、電子部品に用いられる保護膜などを形成するための材料、または層間絶縁膜、特に、液晶表示素子、集積回路素子、固体撮像素子などの層間絶縁膜を形成するための材料として好適な感放射線性樹脂組成物、層間絶縁膜およびその形成方法に関する。
[0001]
[Technical field to which the invention belongs]
The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film, and a method for forming the same. More specifically, it is suitable as a material for forming a protective film or the like used for electronic components, or as a material for forming an interlayer insulating film, particularly an interlayer insulating film such as a liquid crystal display element, an integrated circuit element, or a solid-state imaging device. The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film, and a method for forming the same.
【０００４】
【発明が解決しようとする課題】
本発明は、以上のような事情に基づいてなされたものであって、その目的は、絶縁性、平坦性、耐熱性、透明性、耐薬品性などの諸性能に優れたパターン状薄膜を容易に形成することができる感放射線性樹脂組成物を提供することにある。
本発明の他の目的は、本発明の間放射線性樹脂組成物から層間絶縁膜を形成する方法および形成された層間絶縁膜を提供することにある。
本発明のさらに他の目的および利点は、以下の説明から明らかになろう。
0004
[Problems to be Solved by the Invention]
The present invention has been made based on the above circumstances, and an object of the present invention is to facilitate a patterned thin film having excellent various performances such as insulation, flatness, heat resistance, transparency, and chemical resistance. It is an object of the present invention to provide a radiation-sensitive resin composition which can be formed in the above.
Another object of the present invention is to provide a method for forming an interlayer insulating film from a radioactive resin composition and an interlayer insulating film formed during the present invention.
Still other objectives and advantages of the present invention will become apparent from the following description.
本発明によれば、本発明の上記目的および利点は、第２に、
以下の工程を以下に記載順で実施することを特徴とする層間絶縁膜の形成方法によって達成される。
（１）本発明の感放射線性樹脂組成物の塗膜を基板上に形成する工程、
（２）該塗膜に所定パターンのマスクを介して放射線を照射する工程、
（３）現像工程、および
（４）加熱工程。
本発明によれば、本発明の上記目的および利点は、第３に、
本発明の感放射線性樹脂組成物から形成された層間絶縁膜によって達成される。
以下、本発明の層間絶縁膜用感放射線性樹脂組成物について詳述する。
本発明の層間絶縁膜用感放射線性樹脂組成物は、共重合体［Ａ］、重合性化合物［Ｂ］および重合開始剤［Ｃ］からなることを特徴とする。
According to the present invention, the above object and advantage of the present invention are secondly:
It is achieved by a method for forming an interlayer insulating film, which comprises carrying out the following steps in the order described below.
(1) A step of forming a coating film of the radiation-sensitive resin composition of the present invention on a substrate,
(2) A step of irradiating the coating film with radiation through a mask having a predetermined pattern.
(3) Development process and
(4) Heating step.
According to the present invention, the above object and advantage of the present invention are, thirdly,
This is achieved by an interlayer insulating film formed from the radiation-sensitive resin composition of the present invention.
Hereinafter, the radiation-sensitive resin composition for an interlayer insulating film of the present invention will be described in detail.
The radiation-sensitive resin composition for an interlayer insulating film of the present invention is characterized by comprising a copolymer [A], a polymerizable compound [B], and a polymerization initiator [C].
Claims (3)
（ａ２）エポキシ基含有重合性不飽和化合物、および
（ａ３）前記（ａ１）および（ａ２）以外の重合性不飽和化合物、
の共重合体、
［Ｂ］エチレン性不飽和結合を有する重合性化合物、並びに
［Ｃ］感放射線重合開始剤
を含有することを特徴とする層間絶縁膜用感放射線性樹脂組成物。[A] (a1) polymerizable unsaturated carboxylic acid and / or polymerizable unsaturated carboxylic acid anhydride,
(A2) an epoxy group-containing polymerizable unsaturated compound, and (a3) a polymerizable unsaturated compound other than (a1) and (a2) above,
A copolymer of
[B] A radiation-sensitive resin composition for interlayer insulation films, comprising a polymerizable compound having an ethylenically unsaturated bond, and [C] a radiation-sensitive polymerization initiator.
（１）請求項１に記載の感放射線性樹脂組成物の塗膜を基板上に形成する工程、(1) The process of forming the coating film of the radiation sensitive resin composition of Claim 1 on a board | substrate,
（２）該塗膜に所定パターンのマスクを介して放射線を照射する工程、(2) A step of irradiating the coating film with radiation through a mask having a predetermined pattern;
（３）現像工程、および(3) Development process, and
（４）加熱工程。(4) Heating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34126798A JP3994429B2 (en) | 1998-12-01 | 1998-12-01 | Radiation sensitive resin composition for interlayer insulation film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34126798A JP3994429B2 (en) | 1998-12-01 | 1998-12-01 | Radiation sensitive resin composition for interlayer insulation film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000162769A JP2000162769A (en) | 2000-06-16 |
| JP2000162769A5 true JP2000162769A5 (en) | 2005-06-30 |
| JP3994429B2 JP3994429B2 (en) | 2007-10-17 |
Family
ID=18344734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34126798A Expired - Lifetime JP3994429B2 (en) | 1998-12-01 | 1998-12-01 | Radiation sensitive resin composition for interlayer insulation film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3994429B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4529616B2 (en) | 2004-09-24 | 2010-08-25 | Ｊｓｒ株式会社 | Radiation-sensitive resin composition for forming interlayer insulating film and interlayer insulating film |
| JP4775994B2 (en) * | 2005-03-14 | 2011-09-21 | 株式会社リコー | Display medium, display device using the same, and reversible display |
| KR101348757B1 (en) * | 2006-02-03 | 2014-01-07 | 주식회사 동진쎄미켐 | A resin composition for organic insulating layer, method for manufacturing thereof and array panel comprising the same |
| JP5108480B2 (en) * | 2007-11-28 | 2012-12-26 | 東京応化工業株式会社 | Photosensitive resin composition for interlayer insulation film |
| KR102006751B1 (en) | 2012-12-11 | 2019-08-02 | 제이에스알 가부시끼가이샤 | Radiation-sensitive resin composition, cured film for display device, method for forming the cured film for display device, and display device |
-
1998
- 1998-12-01 JP JP34126798A patent/JP3994429B2/en not_active Expired - Lifetime
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