JP2000160349A5 - - Google Patents
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- Publication number
- JP2000160349A5 JP2000160349A5 JP1998337488A JP33748898A JP2000160349A5 JP 2000160349 A5 JP2000160349 A5 JP 2000160349A5 JP 1998337488 A JP1998337488 A JP 1998337488A JP 33748898 A JP33748898 A JP 33748898A JP 2000160349 A5 JP2000160349 A5 JP 2000160349A5
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- substrate
- plating
- plated
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 description 84
- 238000007747 plating Methods 0.000 description 71
- 239000000243 solution Substances 0.000 description 62
- 239000000758 substrate Substances 0.000 description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- 238000005406 washing Methods 0.000 description 25
- 238000000034 method Methods 0.000 description 17
- 238000001035 drying Methods 0.000 description 16
- 239000007788 liquid Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 8
- 239000011261 inert gas Substances 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000011109 contamination Methods 0.000 description 7
- 229910052736 halogen Inorganic materials 0.000 description 7
- 150000002367 halogens Chemical class 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337488A JP2000160349A (ja) | 1998-11-27 | 1998-11-27 | 無電解めっき装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337488A JP2000160349A (ja) | 1998-11-27 | 1998-11-27 | 無電解めっき装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005150068A Division JP2005256179A (ja) | 2005-05-23 | 2005-05-23 | 無電解めっき装置及び無電解めっき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000160349A JP2000160349A (ja) | 2000-06-13 |
| JP2000160349A5 true JP2000160349A5 (enrdf_load_stackoverflow) | 2004-12-02 |
Family
ID=18309131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10337488A Pending JP2000160349A (ja) | 1998-11-27 | 1998-11-27 | 無電解めっき装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000160349A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130013488A (ko) * | 2011-07-28 | 2013-02-06 | 한국과학기술원 | 진공 도금 장치 및 방법 |
| CN108513448B (zh) * | 2018-04-23 | 2023-12-15 | 苏州普瑞得电子有限公司 | 一种电脑用电路板电镀治具 |
-
1998
- 1998-11-27 JP JP10337488A patent/JP2000160349A/ja active Pending
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