JP2000158341A5 - - Google Patents

Download PDF

Info

Publication number
JP2000158341A5
JP2000158341A5 JP1998337685A JP33768598A JP2000158341A5 JP 2000158341 A5 JP2000158341 A5 JP 2000158341A5 JP 1998337685 A JP1998337685 A JP 1998337685A JP 33768598 A JP33768598 A JP 33768598A JP 2000158341 A5 JP2000158341 A5 JP 2000158341A5
Authority
JP
Japan
Prior art keywords
polishing
slurry
inert gas
workpiece
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998337685A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000158341A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10337685A priority Critical patent/JP2000158341A/ja
Priority claimed from JP10337685A external-priority patent/JP2000158341A/ja
Publication of JP2000158341A publication Critical patent/JP2000158341A/ja
Publication of JP2000158341A5 publication Critical patent/JP2000158341A5/ja
Pending legal-status Critical Current

Links

JP10337685A 1998-11-27 1998-11-27 研磨方法及び研磨システム Pending JP2000158341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10337685A JP2000158341A (ja) 1998-11-27 1998-11-27 研磨方法及び研磨システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10337685A JP2000158341A (ja) 1998-11-27 1998-11-27 研磨方法及び研磨システム

Publications (2)

Publication Number Publication Date
JP2000158341A JP2000158341A (ja) 2000-06-13
JP2000158341A5 true JP2000158341A5 (enExample) 2005-11-04

Family

ID=18311010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10337685A Pending JP2000158341A (ja) 1998-11-27 1998-11-27 研磨方法及び研磨システム

Country Status (1)

Country Link
JP (1) JP2000158341A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3432161B2 (ja) 1998-12-24 2003-08-04 シャープ株式会社 研磨液供給装置
US6326305B1 (en) * 2000-12-05 2001-12-04 Advanced Micro Devices, Inc. Ceria removal in chemical-mechanical polishing of integrated circuits
JP4510362B2 (ja) * 2001-11-30 2010-07-21 俊郎 土肥 Ｃｍｐ装置およびｃｍｐ方法
KR100988749B1 (ko) * 2002-07-22 2010-10-20 아사히 가라스 가부시키가이샤 반도체용 연마제, 그 제조 방법 및 연마 방법
US8297830B2 (en) * 2009-03-04 2012-10-30 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry system for semiconductor fabrication
JP6946166B2 (ja) * 2017-12-20 2021-10-06 パナソニックＩｐマネジメント株式会社 研磨装置および研磨方法
CN114699941A (zh) * 2022-03-14 2022-07-05 长鑫存储技术有限公司 一种液体混合装置、供给系统及供给方法

Similar Documents

Publication Publication Date Title
US6582282B2 (en) Chemical mechanical polishing with multiple polishing pads
US6902470B2 (en) Apparatuses for conditioning surfaces of polishing pads
JP4237439B2 (ja) 基体の研磨又は平坦化方法
JP2019036714A5 (enExample)
JP2000158341A5 (enExample)
TW524728B (en) Method and apparatus for multiphase chemical mechanical polishing
JP2008036783A (ja) 研磨方法および研磨装置
US6764388B2 (en) High-pressure pad cleaning system
JP2005118982A (ja) ニッケルベースの被膜を平坦化するための粒子を含まない研磨流体
US20020173221A1 (en) Method and apparatus for two-step polishing
CN100408267C (zh) 对包含第ⅷ族金属的表面采用固定磨料制品的平面化方法
KR20030022105A (ko) 폴리싱장치 및 드레싱방법
JP2000117635A5 (enExample)
CN100578739C (zh) 化学机械抛光的方法
JP2001138233A (ja) 研磨装置、研磨方法および研磨工具の洗浄方法
US20200198090A1 (en) Cmp apparatus and method of performing ceria-based cmp process
EP0624432A4 (en) POLISHING METHOD, DEVICE DETERMINED FOR THIS AND BAKING / POLISHING DISC.
JP3671649B2 (ja) 研磨方法及び研磨装置
JP2002103204A (ja) 研磨パッド及び研磨方法
JP2008028232A (ja) 半導体基板研磨装置および半導体基板研磨方法、半導体装置の製造方法
JP2002222782A5 (enExample)
JP2671558B2 (ja) ハイシリコンアルミボア表面の加工および処理方法
CN211490922U (zh) 一种钢结构生产加工用打磨装置
JP4936443B2 (ja) 液体ホーニング加工方法
JPH11347940A5 (enExample)