JP2000158341A - 研磨方法及び研磨システム - Google Patents

研磨方法及び研磨システム

Info

Publication number
JP2000158341A
JP2000158341A JP10337685A JP33768598A JP2000158341A JP 2000158341 A JP2000158341 A JP 2000158341A JP 10337685 A JP10337685 A JP 10337685A JP 33768598 A JP33768598 A JP 33768598A JP 2000158341 A JP2000158341 A JP 2000158341A
Authority
JP
Japan
Prior art keywords
polishing
slurry
tank
inert gas
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10337685A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000158341A5 (enExample
Inventor
Yoshiaki Yamade
善章 山出
Yoshiyasu Maehane
良保 前羽
Yasuo Namikawa
康夫 南川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP10337685A priority Critical patent/JP2000158341A/ja
Publication of JP2000158341A publication Critical patent/JP2000158341A/ja
Publication of JP2000158341A5 publication Critical patent/JP2000158341A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP10337685A 1998-11-27 1998-11-27 研磨方法及び研磨システム Pending JP2000158341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10337685A JP2000158341A (ja) 1998-11-27 1998-11-27 研磨方法及び研磨システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10337685A JP2000158341A (ja) 1998-11-27 1998-11-27 研磨方法及び研磨システム

Publications (2)

Publication Number Publication Date
JP2000158341A true JP2000158341A (ja) 2000-06-13
JP2000158341A5 JP2000158341A5 (enExample) 2005-11-04

Family

ID=18311010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10337685A Pending JP2000158341A (ja) 1998-11-27 1998-11-27 研磨方法及び研磨システム

Country Status (1)

Country Link
JP (1) JP2000158341A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6326305B1 (en) * 2000-12-05 2001-12-04 Advanced Micro Devices, Inc. Ceria removal in chemical-mechanical polishing of integrated circuits
JP3432161B2 (ja) 1998-12-24 2003-08-04 シャープ株式会社 研磨液供給装置
JP2003225859A (ja) * 2001-11-30 2003-08-12 Toshiro Doi 研磨装置および研磨方法
WO2004010487A1 (ja) * 2002-07-22 2004-01-29 Seimi Chemical Co., Ltd. 半導体用研磨剤、その製造方法及び研磨方法
CN101823234B (zh) * 2009-03-04 2013-02-20 台湾积体电路制造股份有限公司 研磨液供给系统及化学机械研磨站的研磨液混合物供给法
CN109940504A (zh) * 2017-12-20 2019-06-28 松下知识产权经营株式会社 研磨装置及研磨方法
CN114699941A (zh) * 2022-03-14 2022-07-05 长鑫存储技术有限公司 一种液体混合装置、供给系统及供给方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3432161B2 (ja) 1998-12-24 2003-08-04 シャープ株式会社 研磨液供給装置
US6326305B1 (en) * 2000-12-05 2001-12-04 Advanced Micro Devices, Inc. Ceria removal in chemical-mechanical polishing of integrated circuits
JP2003225859A (ja) * 2001-11-30 2003-08-12 Toshiro Doi 研磨装置および研磨方法
WO2004010487A1 (ja) * 2002-07-22 2004-01-29 Seimi Chemical Co., Ltd. 半導体用研磨剤、その製造方法及び研磨方法
CN100369211C (zh) * 2002-07-22 2008-02-13 清美化学股份有限公司 半导体用研磨剂、该研磨剂的制造方法和研磨方法
CN101823234B (zh) * 2009-03-04 2013-02-20 台湾积体电路制造股份有限公司 研磨液供给系统及化学机械研磨站的研磨液混合物供给法
CN109940504A (zh) * 2017-12-20 2019-06-28 松下知识产权经营株式会社 研磨装置及研磨方法
CN114699941A (zh) * 2022-03-14 2022-07-05 长鑫存储技术有限公司 一种液体混合装置、供给系统及供给方法

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