JP2000150588A - 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 - Google Patents

半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Info

Publication number
JP2000150588A
JP2000150588A JP10319210A JP31921098A JP2000150588A JP 2000150588 A JP2000150588 A JP 2000150588A JP 10319210 A JP10319210 A JP 10319210A JP 31921098 A JP31921098 A JP 31921098A JP 2000150588 A JP2000150588 A JP 2000150588A
Authority
JP
Japan
Prior art keywords
semiconductor device
adhesive
layer
adhesive layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10319210A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000150588A5 (enExample
Inventor
Taiji Sawamura
泰司 澤村
Hideo Takahashi
秀雄 高橋
Takayoshi Shiraishi
誉悦 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP10319210A priority Critical patent/JP2000150588A/ja
Publication of JP2000150588A publication Critical patent/JP2000150588A/ja
Publication of JP2000150588A5 publication Critical patent/JP2000150588A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP10319210A 1998-11-10 1998-11-10 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 Pending JP2000150588A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10319210A JP2000150588A (ja) 1998-11-10 1998-11-10 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10319210A JP2000150588A (ja) 1998-11-10 1998-11-10 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Publications (2)

Publication Number Publication Date
JP2000150588A true JP2000150588A (ja) 2000-05-30
JP2000150588A5 JP2000150588A5 (enExample) 2005-12-22

Family

ID=18107647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10319210A Pending JP2000150588A (ja) 1998-11-10 1998-11-10 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Country Status (1)

Country Link
JP (1) JP2000150588A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008143128A1 (ja) * 2007-05-18 2008-11-27 Hitachi Chemical Company, Ltd. 樹脂組成物及びそれを含む被膜形成材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008143128A1 (ja) * 2007-05-18 2008-11-27 Hitachi Chemical Company, Ltd. 樹脂組成物及びそれを含む被膜形成材料
JP5526778B2 (ja) * 2007-05-18 2014-06-18 日立化成株式会社 樹脂組成物及びそれを含む被膜形成材料

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