JP2000138246A5 - - Google Patents

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Publication number
JP2000138246A5
JP2000138246A5 JP1998310877A JP31087798A JP2000138246A5 JP 2000138246 A5 JP2000138246 A5 JP 2000138246A5 JP 1998310877 A JP1998310877 A JP 1998310877A JP 31087798 A JP31087798 A JP 31087798A JP 2000138246 A5 JP2000138246 A5 JP 2000138246A5
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JP
Japan
Prior art keywords
mold
fpc tape
semiconductor
fpc
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998310877A
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English (en)
Japanese (ja)
Other versions
JP2000138246A (ja
JP3601985B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP31087798A priority Critical patent/JP3601985B2/ja
Priority claimed from JP31087798A external-priority patent/JP3601985B2/ja
Priority to TW087121665A priority patent/TW401632B/zh
Priority to US09/220,351 priority patent/US6166433A/en
Priority to KR1019980062703A priority patent/KR100309965B1/ko
Publication of JP2000138246A publication Critical patent/JP2000138246A/ja
Publication of JP2000138246A5 publication Critical patent/JP2000138246A5/ja
Application granted granted Critical
Publication of JP3601985B2 publication Critical patent/JP3601985B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP31087798A 1998-03-26 1998-10-30 半導体パッケージの製造方法 Expired - Fee Related JP3601985B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP31087798A JP3601985B2 (ja) 1998-10-30 1998-10-30 半導体パッケージの製造方法
TW087121665A TW401632B (en) 1998-03-26 1998-12-24 Resin molded semiconductor device and method of manufacturing semiconductor package
US09/220,351 US6166433A (en) 1998-03-26 1998-12-24 Resin molded semiconductor device and method of manufacturing semiconductor package
KR1019980062703A KR100309965B1 (ko) 1998-03-26 1998-12-31 수지성형반도체장치및반도체패키지의제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31087798A JP3601985B2 (ja) 1998-10-30 1998-10-30 半導体パッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2000138246A JP2000138246A (ja) 2000-05-16
JP2000138246A5 true JP2000138246A5 (ko) 2004-12-09
JP3601985B2 JP3601985B2 (ja) 2004-12-15

Family

ID=18010468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31087798A Expired - Fee Related JP3601985B2 (ja) 1998-03-26 1998-10-30 半導体パッケージの製造方法

Country Status (1)

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JP (1) JP3601985B2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3467454B2 (ja) 2000-06-05 2003-11-17 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP3619773B2 (ja) * 2000-12-20 2005-02-16 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2009188147A (ja) * 2008-02-06 2009-08-20 Sanyo Electric Co Ltd 回路装置の製造方法
JP2017139343A (ja) * 2016-02-04 2017-08-10 株式会社ディスコ パッケージ基板の加工方法

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