JP2000133809A5 - - Google Patents
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- Publication number
- JP2000133809A5 JP2000133809A5 JP1998305884A JP30588498A JP2000133809A5 JP 2000133809 A5 JP2000133809 A5 JP 2000133809A5 JP 1998305884 A JP1998305884 A JP 1998305884A JP 30588498 A JP30588498 A JP 30588498A JP 2000133809 A5 JP2000133809 A5 JP 2000133809A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- separation layer
- transfer
- substrate
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 17
- 238000000926 separation method Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 230000031700 light absorption Effects 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10305884A JP2000133809A (ja) | 1998-10-27 | 1998-10-27 | 剥離方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10305884A JP2000133809A (ja) | 1998-10-27 | 1998-10-27 | 剥離方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000133809A JP2000133809A (ja) | 2000-05-12 |
| JP2000133809A5 true JP2000133809A5 (enExample) | 2004-11-11 |
Family
ID=17950483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10305884A Pending JP2000133809A (ja) | 1998-10-27 | 1998-10-27 | 剥離方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000133809A (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100338805C (zh) * | 2001-01-19 | 2007-09-19 | 松下电器产业株式会社 | 燃料电池用电解质膜－电极接合体的制造方法 |
| TW487958B (en) * | 2001-06-07 | 2002-05-21 | Ind Tech Res Inst | Manufacturing method of thin film transistor panel |
| US8415208B2 (en) * | 2001-07-16 | 2013-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
| US6814832B2 (en) | 2001-07-24 | 2004-11-09 | Seiko Epson Corporation | Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance |
| EP1455394B1 (en) | 2001-07-24 | 2018-04-11 | Samsung Electronics Co., Ltd. | Transfer method |
| JP4151420B2 (ja) | 2003-01-23 | 2008-09-17 | セイコーエプソン株式会社 | デバイスの製造方法 |
| JP2004349513A (ja) | 2003-05-22 | 2004-12-09 | Seiko Epson Corp | 薄膜回路装置及びその製造方法、並びに電気光学装置、電子機器 |
| JP3897173B2 (ja) | 2003-05-23 | 2007-03-22 | セイコーエプソン株式会社 | 有機ｅｌ表示装置及びその製造方法 |
| JP2004349540A (ja) | 2003-05-23 | 2004-12-09 | Seiko Epson Corp | 薄膜装置の製造方法、電気光学装置、及び電子機器 |
| JP4495939B2 (ja) * | 2003-10-08 | 2010-07-07 | 株式会社リコー | 薄膜デバイス装置の製造方法、アクティブマトリクス基板の製造方法、電気光学装置の製造方法 |
| JP2006049800A (ja) | 2004-03-10 | 2006-02-16 | Seiko Epson Corp | 薄膜デバイスの供給体、薄膜デバイスの供給体の製造方法、転写方法、半導体装置の製造方法及び電子機器 |
| JP2006120726A (ja) | 2004-10-19 | 2006-05-11 | Seiko Epson Corp | 薄膜装置の製造方法、電気光学装置、及び電子機器 |
| JP2007004205A (ja) * | 2006-09-19 | 2007-01-11 | Seiko Epson Corp | 電気光学装置の製造方法、及び電気光学装置 |
| KR102649238B1 (ko) | 2016-10-26 | 2024-03-21 | 삼성디스플레이 주식회사 | 표시패널, 이를 포함하는 적층 기판, 및 표시패널 제조방법 |
| TW202236925A (zh) * | 2021-01-15 | 2022-09-16 | 日商東京威力科創股份有限公司 | 基板處理裝置及基板處理方法 |
| KR20260033366A (ko) * | 2024-09-02 | 2026-03-10 | 도레이첨단소재 주식회사 | 리사이클링 이형필름 및 이를 포함하는 소자 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4619462B2 (ja) * | 1996-08-27 | 2011-01-26 | セイコーエプソン株式会社 | 薄膜素子の転写方法 |
| JP3809681B2 (ja) * | 1996-08-27 | 2006-08-16 | セイコーエプソン株式会社 | 剥離方法 |
| JP4619461B2 (ja) * | 1996-08-27 | 2011-01-26 | セイコーエプソン株式会社 | 薄膜デバイスの転写方法、及びデバイスの製造方法 |
-
1998
- 1998-10-27 JP JP10305884A patent/JP2000133809A/ja active Pending
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