JP2000124682A - Equipment and method for manufacturing electronic component mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an equipment and a method for manufacturing an electronic component mounting board, which can increase productivity more than the conventional ones. SOLUTION: This equipment is provided with a solder cream printing device 131, an electronic component mounting device 261, and a transfer device 121 having a belt 122 which carries a circuit board on it. While being carried on the belt, a circuit board is printed with solder cream by the solder cream printing device and mounted with electronic components by the electronic component mounting device. Thereby, unlike the convention method, the moving and mounting operation of electronic components is no longer necessary, so that productivity is increased. Moreover, the printing of the solder cream by the solder cream printing device is conducted in synchronism with the transfer of the circuit board by the belt, which further increases the productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting board manufacturing apparatus for manufacturing an electronic component mounting board by supplying an electronic component to a circuit board to which a particularly small circuit board is supplied, and the electronic component mounting. The present invention relates to a method for manufacturing an electronic component mounting board which is executed by a board manufacturing apparatus.

[0002]

2. Description of the Related Art An electronic component is mounted on a printed circuit board which is a so-called raw board, and then the electronic component is mounted, the cream solder is melted and fixed, and the electronic component is mounted on a circuit board. Manufacturing equipment 51 for manufacturing
Has a configuration as shown in FIG. That is, the electronic component mounting board manufacturing apparatus 51 includes a board supply stocker 2 that stores and supplies the printed board, a cream solder printing machine 5 that prints the cream solder on the printed board,
An electronic component mounting machine 6 for mounting electronic components on a circuit board on which cream solder is printed, and a reflow machine 7 for melting the cream solder and fixing the electronic components to the circuit board.
And a board stocker 9 for storing the manufactured electronic component mounting board, and first to fourth belt conveyors 12 for independently transporting the circuit boards among the above-described components. In such a configuration, the printed board 1 taken out from the board supply stocker 2 is transported by the first belt conveyor 12-1 to the fixed stage 10 provided in the cream solder printing machine 5 shown in FIG.
In the cream solder printing machine 5, since the fixed stage 10 does not move in the X and Y directions orthogonal to each other on a plane, the cream solder 52 is moved to a predetermined position on the printed board.
Screen 18 and print head 19 to print
In the X and Y directions and the Z direction which is the thickness direction of the printed circuit board 1. Thus, the fixed stage 1
After positioning the screen 18 with respect to the printed board 1 held at 0, the print head 19 is moved while the fixed stage 10 is stopped, and the cream solder 52 is printed on the printed board 1 via the screen 18. I do.

[0003] The printed printed circuit board on which the cream solder 52 is printed in this manner is a second belt conveyor 12-.
At 2, it is conveyed to the X, Y table 11 provided in the electronic component mounting machine 6. In the electronic component mounter 6, the electronic component held by the component mounting head 54 from the component supply device 53 is moved to the predetermined position on the printed printed board by moving the X, Y table 11 in the X, Y directions. It is placed on the position. The printed circuit board on which the electronic components are mounted in this way is transported to the reflow machine 7 by the third belt conveyor 12-3, and the reflow operation is performed by the reflow machine 7. The electronic component mounting board on which the electronic components are fixed to the printed board 1 by the reflow operation is the fourth belt conveyor 1
The wafer is conveyed to the substrate stocker 9 at 2-4 and stored in the substrate stocker 9.

[0004]

In recent years, the size of the electronic component mounting board has been reduced due to the miniaturization of equipment to which the electronic component mounting board is mounted, and the printed printed board has been reduced. The mounting time required for mounting the electronic components on the device is decreasing. However, in the conventional electronic component mounting board manufacturing apparatus 51 as described above, the time required to change the printed board 1 or the printed printed board to the fixed stage 10 or the X and Y tables 11 is increased by the mounting time. It increases over time, causing a significant decrease in productivity. In the conventional cream solder printing machine 5,
During the printing of the cream solder 52, the printed circuit board 1 has to be stopped. In other words, the printing operation cannot be performed while the printed circuit board 1 is being conveyed, which also causes a decrease in productivity. It has become. Also, in the electronic component mounter 6, it is necessary to move the X, Y table 11 in the X, Y directions each time one electronic component is mounted on the board, which also causes a reduction in productivity. Has become. The present invention has been made in order to solve such a problem, and an electronic component mounting board manufacturing apparatus and an electronic component mounting board manufacturing apparatus capable of improving productivity as compared with the related art. It is an object of the present invention to provide a method for manufacturing an electronic component mounting board to be executed.

[0005]

According to a first aspect of the present invention, an electronic component mounting board manufacturing apparatus includes a transport device, a print paste printing device, and an electronic component mounting device, and the transport device includes a circuit board holding device. The circuit board holding member holds and conveys the circuit boards in a row along a conveying direction, and extends adjacent to and integrally with the print paste printing apparatus and the electronic component mounting apparatus. The printing paste printing apparatus is provided with a screen having a cylindrical shape, and the printing board is held by the circuit board holding member transferred to the electronic component mounting apparatus by the transfer apparatus. The printing paste is printed by the rotation of the screen along with the movement of the circuit board by transport, and the electronic component mounting device is transported from the print paste printing device by the transport device. Mounting the electronic components to the printing part of the printing paste on the circuit board which is held on the circuit board holding member, and wherein the.

In a second aspect of the present invention, there is provided a method for manufacturing an electronic component mounting board, wherein the circuit boards are transported in a row along the transport direction, and the circuit boards are transported for mounting electronic components. On the other hand, before the mounting of the electronic component, a printing paste is printed using the movement of the circuit board due to the transport, and after the printing of the printing paste, the electronic component is mounted on the printed portion of the printing paste of the circuit board. It is characterized by doing.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting board manufacturing apparatus according to an embodiment of the present invention and an electronic component mounting board manufacturing method executed by the electronic component mounting board manufacturing apparatus will be described below with reference to the drawings. Will be described. In the drawings, the same components are denoted by the same reference numerals. Further, in the present embodiment, the belt 1 is used as an example that fulfills the function of the “circuit board holding member” described in the above “Means for Solving the Problems”.
22 is taken as an example, and in this embodiment, a cream solder 140 is taken as an example that fulfills the function of “print paste”. Therefore, in the present embodiment, the cream solder printing apparatus 131 is an example that fulfills the function of the “print paste printing apparatus”.
Is equivalent.

An electronic component mounting board manufacturing apparatus 101 according to the present embodiment shown in FIG. 1 includes a board supply stocker 111, a board transfer apparatus 115, a transport apparatus 121, a cream solder printing machine 131, and an electronic component mounting apparatus. 261, a mounting inspection machine 171, a reflow device 175 as an example that performs a function of a heating device, and a boundary scan test machine 181.
, A taping device 185, and a control device 191. The controller 191 includes the substrate supply stocker 11
1, the substrate transfer device 115, the transport device 121, the cream solder printing machine 131, the electronic component mounting device 2,
61, the mounting inspection machine 171, the reflow device 17
5. The boundary scan tester 181 and the taping device 185 are connected, and the control device 191 controls the operations of these devices.

The board supply stocker 111 is a so-called raw board, and is a printed board 11 on which electronic components are mounted.
2 is a device that stores a plurality of trays 113 on which a plurality of trays 2 are placed in a grid, and takes out and stores the trays 113. The printed circuit board 112 handled by the electronic component mounting board manufacturing apparatus 101 according to the present embodiment is a printed circuit board that is extremely small compared to the current average size.
The substrate transfer device 115 is a device that holds the printed circuit board 112 from the tray 113 and transfers the printed circuit board 112 to the transfer device 121, and is an X, Y robot that is movable in X and Y directions orthogonal to each other on a plane. 116, and a printed board holding device 117 attached to the X, Y robot 116 to hold and release the printed board 112 by a suction operation in the present embodiment. Note that, as will be described later, cream solder is printed on the printed circuit board 112 and electronic components are mounted on the printed circuit board 112 to change its form.
The circuit board until the cream solder is printed uses the term of the printed circuit board 112 as described above,
Printed circuit board 1 with printed circuit board with cream solder
43, and the circuit board on which the electronic components are mounted is expressed by adding a modifier to the term of the circuit board like the mounted circuit board 255. Further, the final circuit board on which the electronic components are fixed is referred to as a circuit board 281 on which electronic components are mounted.

The transport device 121 is a device for placing the printed circuit board 112 thereon and transporting the printed substrate 112 in a transport direction indicated by an arrow I. In the present embodiment, the transport device 121 is configured in a belt-conveyor shape. Belt 122 for mounting and holding
And a driving device including a motor in the present embodiment, on which the belt 122 is hung and the belt 122 is conveyed along the extending direction thereof. In the present embodiment, the belt 12
Reference numeral 2 extends in a straight line, and the cream solder printing machine 131, the electronic component mounting device 261, the mounting inspection machine 171, the reflow device 175, and the boundary scan test machine 181 are arranged along the belt 122. Therefore, in the electronic component mounting board manufacturing apparatus 101 of the present embodiment, when the circuit board is supplied to the cream solder printing machine 131 or the like, a device provided in each device and holding the circuit board, for example, the X, There is no need to change the circuit board on the Y table 11 or the like, and the time required for the change can be omitted, and the production efficiency can be improved as compared with the related art.

In order to prevent the circuit board from dropping off the belt 122 during transportation, in the present embodiment, for example, a frame-shaped board holding member 123 is provided on the belt 122 as shown in FIG. . The substrate holding member 12
No. 3 does not hinder, for example, the printing operation on the printed circuit board 112 by the cream solder printer 131 described later. Further, the method of holding the circuit board on the belt 122 is not limited to the above-described board holding member 123, but may be, for example, a suction operation. As a structure for the suction operation, a suction groove member 124 is provided along the belt 122 on the back surface 122b of the belt 122 facing the mounting surface 122a of the circuit board as shown in FIG. The belt 122 is transported along the transport direction while sliding on the suction groove member 124.
In addition, a suction device 125 is connected to the suction groove member 124 to make the inside of the suction groove member 124 a negative pressure. Therefore, the circuit board is attracted to the mounting surface 122a through the through holes 126 provided in the belt 122. Further, the circuit board holding member is not limited to the belt 122, and may be, for example, a caterpillar-shaped member as shown in FIG. In this case, the circuit board may be held in a form similar to that of the board holding member 123 described above. Further, in the present embodiment, the belt 122 extends linearly. However, the present invention is not limited to this, and the belt 122 may draw a curve.

As shown in FIG. 2, a cream solder printing apparatus 131 is an apparatus for printing cream solder on a printing surface 112a of a printed circuit board 112.
And a cream solder first supply device 135. The screen 132 has a cylindrical shape which is rotated by a driving device in a direction around a central axis 133 extending in a direction perpendicular to the transport direction. The peripheral surface 132a of the screen 132 The concave portion 134 to which the cream solder is supplied from the first supply device 135 and stores the cream solder is formed in a pattern in which the cream solder is to be printed on the printing surface 112a. Note that the length of the screen 132 in the axial direction is a length corresponding to the printed circuit board 112. Such a screen 132 is formed on the peripheral surface 132a.
Are arranged so that the tangential direction with respect to and the transport direction coincide with each other, and the peripheral surface 132a and the printing surface 112a are in contact with each other. Therefore, in synchronization with the movement of the printed circuit board 112 in the direction of arrow I, which is the direction of conveyance by the conveyance of the belt 122, the cream solder printing apparatus 131 moves the screen 132 in the direction of arrow II around the central axis 133. Rotate. The transfer device 121 and the cream solder printing machine 131 are connected to a control device 191, and the control device 191 controls the synchronization. Further, the cream solder first supply device 135 is connected to the screen 132.
And a nozzle for supplying cream solder to the recess 134 in contact with or in proximity to the peripheral surface 132a. A predetermined pressure is applied to the cream solder stored in the cream solder first supply device 135, and the cream solder is discharged from the tip of the nozzle.

As described above, according to the cream solder printing apparatus 131 of the present embodiment, the belt 1
Since cream solder is directly printed on the printed circuit board 112 which is moved by the transport of the printed circuit board 22, the trouble of sequentially transferring the printed circuit board 112 to the fixed stage 10 described above can be omitted, and the electronic components can be mounted. In order to perform the printing on the circuit board 112 by rotating the screen 132 using the transfer operation of the circuit board to the electronic component mounting apparatus 261, the time required for the printing operation can be significantly reduced as compared with the related art. it can.

In this embodiment, the cream solder is supplied from the outer peripheral side of the screen 132 by using the cream solder first supply device 135 as described above. However, the present invention is not limited to this. For example, the screen 132 may be penetrated in the diameter direction, a through hole corresponding to the recess 134 may be formed in the screen 132, and cream solder may be supplied to the through hole from the inner peripheral side of the screen 132. . Further, as shown in FIG.
7, squeegee 139 and cream solder second supply device 1
The cream solder printing device 142 provided with 41 can also be constituted. That is, in the cylindrical screen 137,
As a portion that performs the same function as the concave portion 134, a through hole 138 that penetrates the screen 137 in the diameter direction of the screen 137 is provided. The cream solder second supply device 141 is a device that supplies the cream solder 140 to the inner peripheral surface of the screen 137, and the squeegee 139
Is the cream solder 14 inside the screen 137.
Squeezing of the cream solder 140 supplied by the cream solder second supply device 141 is disposed so as to extend along the diametrical direction of the screen 137 at a position facing the printed circuit board 112 where 0 is printed. I do.
In the cream solder printing apparatus 142 configured as above, the cream solder 140 is printed on the printing surface 112a from the inner peripheral side of the screen 137 through the through hole 138 by the squeezing. The printing operation is also performed in the cream solder printing apparatus 142 in synchronization with the conveyance of the printed circuit board 112 by the belt 122.

[0015] Electronic component mounting substrate manufacturing apparatus 1 of the present embodiment
Before describing the electronic component mounting device 261 shown in FIG. 6 provided in FIG. 01, an electronic component mounting device 151 which is a simplified type of the electronic component mounting device 261 will be described. As shown in FIGS. 4 and 5, the electronic component mounting device 151 includes an electronic component supply device 152 and an electronic component holding device 153. The electronic component mounting device 151 converts the electronic component 251 supplied from the electronic component supply device 152 into the electronic component 251. The electronic component 251 held by the component holding device 153 is mounted on the printed circuit board 143 on which the cream solder 140 is printed, which is conveyed by the belt 122. In the present embodiment, the electronic component supply device 152 is a so-called cassette type electronic component supply device, and has a cassette 15 having a reel on which a tape containing electronic components 251 arranged along the extending direction is wound.
6 are arranged along the conveying direction of the belt 122. Therefore, the component supply positions 157 in the respective cassettes 156 are located along the transport direction, and the electronic components 251 are supplied one by one from the respective cassettes 156 at the respective component supply positions 157. In order to simplify the moving operation of the electronic component holding device 153 as described later, it is preferable that the component supply position 157 is located along the transport direction. In addition, as long as this configuration is adopted, the electronic component supply device 15
2 is not limited to the cassette type. In addition, in order to simplify the movement operation of the electronic component holding device 153 as described later, in the present embodiment, the arrangement pitch of the cassettes 156 arranged along the transport direction is different from that of the printed circuit board 143. The pitch is set to match the arrangement pitch of the electronic components arranged along the transport direction.

The electronic component holding device 153 includes an electronic component holding head 158 provided with a holding member driving device 162 and a rotation driving device 163, and the electronic component holding head 158 is formed of Y.
Moving device 159 for moving in the X direction, and X moving device 1 for moving the Y moving device 159 in the X direction.
60. In the present embodiment, the holding member driving device 162 of the electronic component holding head 158 corresponds to the electronic component holding member 161 formed of a nozzle, which holds the electronic component 251 by a suction operation, in the thickness direction of the printed circuit board 143. In the present embodiment, the apparatus is configured to be moved by a motor in the Z direction. In the present embodiment, five holding member driving devices 162 configured as described above are arranged along the conveying direction of the belt 122, and
The stand is integrally formed so that the arrangement position does not shift. The arrangement interval of the electronic component holding members 161 arranged along the X direction is an integral multiple of the arrangement pitch of each cassette 156 of the electronic component supply device 152 as shown in FIG.
In the present embodiment, it is set to three times. The value of the integral multiple is the electronic component 251 arranged along the X direction among the electronic components 251 attached to the circuit board.
, And is not limited to the above “3” times. The rotation driving device 163 of the electronic component holding head 158 is provided with each of the electronic component holding members 161 provided in each of the holding member driving devices 162.
Is a device for synchronizing the rotation of the motor 155a in the direction around its axis by an angle θ. In this embodiment, the motor 155a and the timing of transmitting the rotation of the output shaft of the motor 155a to the respective electronic component holding members 161. Belt 155b
And is configured.

The Y-direction moving device 159 has a so-called ball screw structure, in which a nut 166 is engaged with a screw 164 that extends in the Y direction and is rotated around an axis by a motor 165. The electronic component holding head 158 is attached to the nut portion 166, and thus the electronic component holding head 158 moves along the Y direction by rotating the screw 164 around its axis by the motor 165. I do. The X-direction moving device 160 also has the same structure as the Y-direction moving device 159, and has a nut 169 engaged with a screw 168 that extends in the X direction and is rotated around an axis by a motor 167. The motor 165 provided in the Y-direction moving device 159 is attached to the nut portion 169. Therefore, when the screw 168 is rotated around its axis by the motor 167, the Y-direction moving device 159, The electronic component holding head 158 moves along the X direction.

Further, in the electronic component mounting board manufacturing apparatus 101, a component attitude recognition camera 154 is installed at a position between the electronic component supply device 152 and the belt 122. The component attitude recognition camera 154 captures an image of the holding attitude of the electronic component 251 held by the electronic component holding member 161 at the component supply position 157, and sends the captured information to the control device 191. The control device 191 includes:
Based on the imaging information, the necessity of the rotation of the angle θ and the angle when the rotation is necessary are determined so that the electronic component 251 can be correctly mounted on the printed circuit board 143, and the operation control of the rotation driving device 163 is performed. I do.

In the electronic component mounting apparatus 151 configured as described above, as described above, the arrangement pitch of the cassette 156 along the transport direction is determined by setting the printed circuit board 1
At 43, the arrangement pitch of the electronic component holding members 161 arranged along the transport direction is matched with the arrangement pitch of the electronic components arranged along the transport direction, and the arrangement interval of the electronic component holding members 161 arranged along the transport direction is an integral multiple of the arrangement pitch of the cassette 156. After holding the electronic component 251 from the electronic component supply device 152 with the electronic component holding member 161, the electronic component holding head 158 is moved in the Y direction without moving in both the X direction and the Y direction. By moving along only
The held electronic component 251 can be mounted on the printed circuit board 143. Furthermore, the electronic component 25 to be mounted next
To hold 1, the electronic component holding head 158 may first be moved in the X direction by the arrangement pitch of the cassette 156. Then, the electronic component holding head 158 may be moved in the Z direction to hold the electronic component 251. The electronic component 251 is thus attached to the printed circuit board 143.
The amount of movement of the electronic component holding head 158 at the time of mounting is significantly smaller than in the past. Therefore, according to the electronic component mounting substrate manufacturing apparatus 101 of the present embodiment, productivity can be improved as compared with the related art. Furthermore, in the electronic component holding head 158, a plurality of electronic component holding members 161, in this embodiment, five electronic component holding members 1 are provided.
61, one of the electronic component holding heads 158 is provided.
The electronic component 251 can be mounted on the five printed circuit boards 143 by performing the above-described movements. The electronic component 251
The circuit board on which is mounted is referred to as a mounted circuit board 255.

The above-described electronic component mounting apparatus 151 is similar to that shown in FIG.
As shown in FIG. 7, the electronic component 251 is mounted on one printed circuit board 143 in one row and three columns. However, the present invention is not limited to such a configuration. As in the electronic component holding device 263 shown in FIG. 6, the electronic components 251 can be mounted on one printed circuit board 143 in five rows and three columns. The difference between the electronic component holding device 263 and the electronic component holding device 153 is that a plurality of printed circuit boards 1
In order to mount the electronic components 251 in a plurality of rows to 43, each holding member driving device 162, that is, each electronic component holding member 161 is mounted in the Y direction of the electronic component 251 mounted on the printed circuit board 143. The point is that the electronic component holding heads 262 are arranged so as to be shifted in the Y direction by the intervals, that is, the intervals of the rows. Also, in the electronic component supply device 152, the component supply position 157 is set to Y in accordance with the displacement of the electronic component holding member 161 in the Y direction.
It is shifted in the direction. Other configurations are the same as those of the above-described electronic component holding device 153, and a detailed description thereof will be omitted.

Electronic component holding device 2 configured as above
63 operates as follows. After the electronic component holding head 262 is moved to the component supply device 152 by the Y direction moving device 159, the electronic component holding member 161 is lowered in the Z direction, and the electronic component 25 is held by each electronic component holding member 161.
Hold 1 Then, after the electronic component holding member 161 is raised in the Z direction, the electronic component holding head 262 is moved in the Y direction, and an imaging operation is performed by the component posture recognition camera 154. Then, if necessary by the imaging operation, the rotation operation of the angle θ is performed, and thereafter, the electronic component holding head 262 is moved in the Y direction, and the electronic component holding member 161 is moved in the Z direction. By these operations, the printed circuit board 14 is printed from right to left in the drawing.
An electronic component 251-1-1 is located in the first row and the third column of 3-1.
Electronic components 251-1-2 are provided in the second row and third column of the printed circuit board 143-2, and electronic components 251-1-3 are provided in the third row and third column of the printed circuit board 143-3. Electronic components 251-1-4 are provided in the fourth row and the third column of the printed circuit board 143-4.
However, electronic components 251-1-5 are mounted on the fifth row and third column of the printed circuit board 143-5. Next, after raising the electronic component holding member 161 in the Z direction,
The electronic component holding head 262 is moved to the left in the figure by one pitch of the cassette 156 by the X direction moving device 160. The electronic component 25 is again operated in the same manner as described above.
1 is performed. By the mounting operation, the electronic component 251 is placed in the first row and second column of the printed circuit board 143-1.
In the second row and second column of the printed circuit board 143-2, the electronic component 251-2-2 is placed.
The electronic component 251-2-3 is in the third row and the second column of the printed circuit board 143-4, and the electronic component 2 is in the fourth row and the second column of the printed circuit board 143-4.
51-2-4, the electronic component 251-2-5 is mounted on the fifth row and second column of the printed circuit board 143-5. Further, similarly, electronic components 251 are mounted at positions corresponding to the first rows and the first columns, respectively. In this way, when the electronic components 251 are mounted on all the columns of one row in the printed circuit boards 143-1 to 143-5, the belt 122 is moved by the transport device 121 in the transport direction I. It moves by one substrate 143. Then, the electronic component holding head 262 is driven by driving the X-direction moving device 160.
Is returned to the original position, and the above operation is repeated again.
Thus, the printed circuit board 14 in the transport direction I is
3 is moved five times in total, the printed circuit board 1
The printed circuit board 143-1 initially located at the right end among 43-1 to 143-5 has a total of one electronic component 251 thereon.
Five printed circuit boards 143-1 will be mounted.
Goes to the next step as a mounted circuit board 255.

By providing the electronic component holding device 263 in this manner, when a large number of electronic components 251 are mounted on one printed circuit board 143, the mounting of the electronic components 251 can be performed more efficiently than in the past. And productivity can be improved.

The number of electronic components 251 mounted on one printed circuit board 143 is not limited to the above-mentioned fifteen, but may be increased or decreased by the number of electronic component holding members 161 provided in the electronic component holding head. The desired number of electronic components 2
51 can be mounted. Further, in the above-described electronic component mounting device 261, since each electronic component holding member 161 mounts the electronic component 251 on a different row for each printed circuit board 143, as described above, all of one row When the electronic components 251 are mounted in the row, the printed circuit board 143 moves by one sheet in the transport direction.
However, the present invention is not limited to such a form. For example, in a case where each of the two electronic component holding members 161 mounts electronic components on the same row with respect to two printed circuit boards 143, respectively. When the electronic components 251 are mounted on all the columns of one row, the printed circuit board 1
43 can move in the transport direction by two sheets.
FIGS. 4 to 6 are diagrams for explaining the configuration, and the arrangement state of each of the illustrated components does not always match the actual arrangement state.

Further, as shown in FIG.
In the electronic component mounting device 151 shown in FIG. 61 or FIG. 5, a mixed mounting device 271 can be arranged along the belt 122. Note that the mounting device 271 for mixed mounting does not handle electronic components 251 of almost the same shape and substantially the same type as the electronic component supply device 152 described above, but the electronic components having various shapes, types, etc. are transferred to the circuit board. It is a device for mounting.

Next, the mounting inspection machine 171
Along the above-described transport direction, the above-described electronic component mounting apparatus 2
61 or an apparatus which is arranged as a next step of the electronic component mounting device 151 and the mixed mounting device 271 and inspects whether or not the electronic component 251 is mounted on the circuit board. Since the structure is the same as that of the conventional mounting inspection machine 171, the description is omitted here.

Next, the reflow device 175
2 is arranged as the next step of the mounting inspection machine 171 along the transport direction, and heats and cools the mounted circuit board 255, and the cream solder 1 on the mounted circuit board 255
40 is melted and then solidified and mounted electronic component 2
This is a device for fixing 51 to the mounted circuit board 255.
The structure is the same as that of the conventional reflow device 175, and a description thereof will be omitted.

Next, the boundary scan test machine 181
Is a device that is disposed as a next process of the reflow device 175 along the transport direction of the belt 122, and uses a test circuit provided inside the electronic component 251 fixed to the mounted circuit board 255, and Mounted circuit board 25
5 is an apparatus for performing an electrical test. After the inspection, the circuit board is carried out as the electronic component-mounted circuit board 281.
Since the structure is the same as that of the conventional boundary scan tester 181, the description is omitted here.

Next, the taping device 185 controls the belt 1
22 is a device that is arranged as a next process of the boundary scan test machine 181 along the transport direction of 22.
The transfer device 186 that holds the electronic component-mounted circuit board 281 conveyed by the belt 122 from above the belt 122, moves in the X and Y directions, and transfers it to the storage tape 187.
And a winding device 188 for winding the storage tape.

The operation of the electronic component mounting substrate manufacturing apparatus 101 of the present embodiment configured as described above will be described. Note that, as described above, the electronic component mounting board manufacturing apparatus 10
1 is controlled by the control device 191. The substrate supply stocker 111 allows a desired printed circuit board 112
Is discharged, and the substrate transfer device 11
At 5, the printed circuit boards 112 are sequentially transferred from the tray 113 onto the belt 122. At this time, the belt 122 moves intermittently. That is, as described above with reference to FIG. 6, in this embodiment, the electronic component mounting device 261 including the electronic component holding head 262 having the five electronic component holding members 161 is provided, and the printed circuit board 143 is mounted on the printed circuit board 143. In the present embodiment, when three rows of electronic components 251 are mounted, the belt 122 is conveyed by one printed circuit board 112. Thus, the belt 122 moves intermittently. On the printing surface 112a of the printed circuit board 112 conveyed to the cream solder printing machine 131 due to such intermittent movement of the belt 122, the printed circuit board 112 is conveyed while being mounted on the belt 122, and In synchronization with the cream solder printing machine 131, the cream solder 14
0 is printed. The printed circuit board 143 on which the cream solder 140 is printed is conveyed to the electronic component mounting device 261 by the intermittent movement, and the electronic component 25 is moved as described above.
1 is mounted on the printed circuit board 143. FIG.
In the case of an electronic component mounting board manufacturing apparatus provided with the electronic component mounting apparatus 151 described with reference to FIG.
Since only a total of three electronic components 251 in one row and three columns are mounted on 43, the belt 122 is conveyed by five printed circuit boards 112 when the three columns of electronic components 251 are mounted.

The mounted circuit board 255 on which the electronic components 251 are mounted sequentially passes through the mounting inspection machine 171, the reflow device 175, and the boundary scan test machine 181 due to the intermittent movement of the belt 122. , A boundary scan test is performed.
Then, only the non-defective products of the circuit board 281 on which the electronic components are mounted, which has been transported to the end position of the belt 122, are transferred to the storage tape 187 by the transfer device 186. Winding device 188
The storage tape 187 wound up by is transportable to another process.

As described above, according to the electronic component mounting board manufacturing apparatus 101 of the present embodiment, the printing of the cream solder 140, the mounting of the electronic component 251, the mounting inspection, and the like are performed while the circuit board is mounted on the belt 122. Reflow operation and boundary scan test can be executed, eliminating the need to transfer the circuit board each time with a cream solder printing machine or electronic component mounting device as before, eliminating the time loss associated with it. can do. Further, in the cream solder printing machine 131, the cream solder 140 is printed on the printed circuit board 112 in synchronization with the transfer operation by using the transfer of the printed circuit board 112. Can be. Further, in the electronic component mounting devices 151 and 261, the printed circuit board 143 is used.
And the arrangement pitch of the electronic component holding members 161 are the same, so that the electronic component holding heads 262, 1
58 can be minimized in the X direction, and the mounting tact can be greatly reduced. Further, since the arrangement pitch of the electronic component holding members 161 corresponds to an integral multiple of the arrangement pitch of the cassettes 156 of the electronic component supply device 152, the plurality of electronic component holding members 161 have the same number of electronic component holding members 161 at the same time. The electronic component 251 can be held from the cassette 156, and the mounting tact can be greatly reduced.

In the electronic component mounting substrate manufacturing apparatus 101 in the above-described embodiment, only one row of the belts 122 is provided. However, as shown by the phantom line in FIG. A belt provided in the transport device 128 is installed in parallel in the same direction adjacent to the belt 122,
Component devices such as the electronic component mounting devices 151 and 261 can also be arranged. By providing the plurality of belts 122 in this manner, the productivity can be further improved.

The electronic component mounting board manufacturing apparatus 101 in the above-described embodiment is the most preferred embodiment, in which the supply of the printed circuit board 112 to the electronic component mounting circuit board 2 is started.
Each device is provided for executing each operation up to the winding of 81. However, it is not always necessary to provide all of these, and at least the cream solder printing machine 1
31, the electronic component mounting device 151 or 261, the cream solder printing machine 131, and the transport device 121 extending through the electronic component mounting device 151 or 261.
What is necessary is just to provide.

[0034]

As described above in detail, according to the electronic component mounting board manufacturing apparatus of the first aspect and the electronic component mounting board manufacturing method of the second aspect of the present invention, a print paste printing apparatus and an electronic component are provided. A mounting device, and a transfer device having a circuit board holding member, wherein the circuit board holding member extends through the print paste printing device and the electronic component mounting device, and mounts and transfers the circuit board. Therefore, when performing the printing operation on the circuit board by the print paste printing apparatus and when performing the mounting operation of the electronic component on the circuit board by the electronic component mounting apparatus, it is not necessary to perform the transfer operation of the circuit board. . Therefore, the productivity of the electronic component mounting board can be improved as compared with the related art. Further, the printing paste printing apparatus prints the printing paste on the printed surface of the circuit board in synchronization with the transfer operation during the transfer operation of the circuit board. Productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting board manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing a structure of a cream solder printing machine provided in the electronic component mounting board manufacturing apparatus shown in FIG.

FIG. 3 is a view showing another embodiment of the cream solder printing machine shown in FIG. 2;

FIG. 4 is a perspective view showing an example of an electronic component mounting apparatus provided in the electronic component mounting board manufacturing apparatus shown in FIG.

5 is a plan view of the electronic component mounting device shown in FIG.

6 is a plan view of an electronic component mounting apparatus provided in the electronic component mounting board manufacturing apparatus shown in FIG.

FIG. 7 is a perspective view showing another embodiment of the transfer device provided in the electronic component mounting board manufacturing apparatus shown in FIG.

8 is a perspective view showing another embodiment of the transfer device provided in the electronic component mounting board manufacturing apparatus shown in FIG.

FIG. 9 is a perspective view of a conventional electronic component mounting board manufacturing apparatus.

10 is a side view showing a cream solder printing apparatus provided in the electronic component mounting board manufacturing apparatus shown in FIG.

[Description of Reference Numerals] 101: electronic component mounting board manufacturing apparatus, 112: printed board, 112a: printing surface, 121: transport device, 122:
Belt, 131: cream solder printing device, 132: screen, 134: concave portion, 135: cream solder first supply device, 139: squeegee, 141: cream solder second supply device, 143: printed circuit board, 151: electronic component Mounting device, 152: Electronic component supply device, 153: Electronic component holding device, 161: Electronic component holding member, 175: Reflow device, 191: Control device, 255: Mounted circuit board,
261, an electronic component mounting device; 281, a circuit board on which electronic components are mounted.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Muneyoshi Fujiwara 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Kenji Okamoto 1006 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hideki Miyakawa 1006 Odaka, Kazuma, Kadoma City, Osaka Pref. 1006 Kadoma Kadoma Kadoma Matsushita Electric Industrial Co., Ltd. F-term (reference) CC33 CD15 CD26 CD29 CD36 CD53 GG15

Claims (13)

[Claims] 1. A transfer device (121), a print paste printing device (131), and an electronic component mounting device (151, 26).
1), wherein the transport device has a circuit board holding member (122), and the circuit board holding member holds and transports the circuit boards in a row along a transport direction, and the printing paste printing device. The printing paste printing apparatus includes a screen (132) having a cylindrical shape, and is formed integrally with and extending adjacent to the electronic component mounting apparatus. On the circuit board held by the circuit board holding member to be conveyed, a printing paste is printed by rotating the screen accompanying the movement of the circuit board by the conveyance, and the electronic component mounting device is moved by the conveyance device. An electronic component is applied to a printed portion of the print paste on a circuit board held by the circuit board holding member conveyed from the print paste printing apparatus. Chakusuru, electronic component mounting 置基 board manufacturing apparatus characterized by. 2. The cylindrical screen of the printing paste printing apparatus according to claim 1, wherein the screen rotates around a rotation center axis extending in a direction orthogonal to the transport direction, and a peripheral surface of the cylindrical body includes the circuit. It is arranged in contact with the printed surface (112a) of the substrate and the tangential direction with respect to the peripheral surface and the transport direction coincide with each other, and rotates in the direction around the axis in synchronization with the transport of the circuit board to the printed surface. 2. The electronic component mounting board manufacturing apparatus according to claim 1, wherein the printing paste is printed. 3. A recess (134) for storing the printing paste to be printed on the printing surface is formed on the peripheral surface of the screen in the printing paste printing device. The apparatus for manufacturing an electronic component mounting board according to claim 2, further comprising a first printing paste supply device (135) for supplying the printing paste. 4. The printing paste printing apparatus according to claim 1, wherein the printing paste printing apparatus supplies the printing paste to an inner peripheral surface of the screen, and a printing paste second supply apparatus disposed inside the screen. Squeegee (1) for squeezing the printing paste supplied by
39) The electronic component mounting board manufacturing apparatus according to claim 2, comprising: 5. The electronic component mounting board manufacturing apparatus according to claim 1, wherein the electronic component mounting apparatus simultaneously mounts the electronic component on each of a plurality of circuit boards. . 6. The electronic component mounting device, comprising: an electronic component supply device arranged along the transport direction for supplying an electronic component to be mounted on the circuit board; and the circuit board transported in the transport direction. At least two electronic component holding members (1) arranged along the transport direction at the same pitch as the arrangement pitch of the electronic component.
61) holding the electronic components from the electronic component supply device by simultaneously moving the electronic component holding members in a direction orthogonal to the transport direction, and holding the electronic components held by the respective electronic component holding devices. The electronic component mounting board manufacturing apparatus according to claim 5, further comprising an electronic component holding device (153) mounted on a plurality of circuit boards corresponding to the members. 7. The electronic component mounting board manufacturing apparatus according to claim 6, wherein the at least two electronic component holding devices mount the electronic components at different positions on the plurality of circuit boards. 8. A plurality of the electronic component supply devices are arranged along the transport direction between the positions of the electronic component holding devices, and the electronic component holding devices are mounted every time the electronic components are mounted on the circuit board. 8. The electronic component mounting board manufacturing apparatus according to claim 6, wherein the electronic component holding member is moved along the transport direction at an arrangement pitch of the electronic component supply device. 9. 9. The circuit board holding member according to claim 1, wherein the circuit board holding member is a continuous belt that holds the circuit board and is disposed adjacent to the printing paste printing apparatus and the electronic component mounting apparatus. An electronic component mounting board manufacturing apparatus according to the above. 10. The printing paste is cream solder, and after mounting the electronic component, the cream solder is melted.
The electronic component mounting board manufacturing apparatus according to any one of claims 1 to 9, further comprising a heating device (175) for solidifying and fixing the electronic component to the circuit board. 11. The circuit board is conveyed in a row along a conveying direction, and the circuit board is conveyed before mounting the electronic component on the circuit board conveyed for mounting the electronic component. A method for manufacturing an electronic component mounting board, comprising printing a print paste by using movement, and mounting an electronic component on a printed portion of the circuit board after printing the print paste. 12. The mounting of electronic components on the circuit board,
The method of manufacturing an electronic component mounting board according to claim 11, wherein the electronic component is mounted on each of the plurality of circuit boards simultaneously. 13. The method for manufacturing an electronic component mounting board according to claim 12, wherein the mounting of the circuit board on each of the circuit boards is performed by moving the electronic component only in a direction orthogonal to the transport direction. .