JP2000117636A5 - - Google Patents
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- Publication number
- JP2000117636A5 JP2000117636A5 JP1998293427A JP29342798A JP2000117636A5 JP 2000117636 A5 JP2000117636 A5 JP 2000117636A5 JP 1998293427 A JP1998293427 A JP 1998293427A JP 29342798 A JP29342798 A JP 29342798A JP 2000117636 A5 JP2000117636 A5 JP 2000117636A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- slurry
- polishing slurry
- concentration
- oxidizing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 93
- 239000002002 slurry Substances 0.000 claims 44
- 238000004140 cleaning Methods 0.000 claims 10
- 239000007800 oxidant agent Substances 0.000 claims 9
- 239000012530 fluid Substances 0.000 claims 8
- 229910021645 metal ion Inorganic materials 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 230000008929 regeneration Effects 0.000 claims 6
- 238000011069 regeneration method Methods 0.000 claims 6
- 238000005259 measurement Methods 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 238000004064 recycling Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29342798A JP2000117636A (ja) | 1998-10-15 | 1998-10-15 | 研磨方法及び研磨システム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29342798A JP2000117636A (ja) | 1998-10-15 | 1998-10-15 | 研磨方法及び研磨システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000117636A JP2000117636A (ja) | 2000-04-25 |
JP2000117636A5 true JP2000117636A5 (enrdf_load_stackoverflow) | 2005-09-15 |
Family
ID=17794628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29342798A Pending JP2000117636A (ja) | 1998-10-15 | 1998-10-15 | 研磨方法及び研磨システム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000117636A (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002170792A (ja) | 2000-11-29 | 2002-06-14 | Mitsubishi Electric Corp | 研磨液供給装置及び研磨液供給方法、研磨装置及び研磨方法、並びに、半導体装置の製造方法 |
JP4456308B2 (ja) * | 2001-12-05 | 2010-04-28 | 富士通マイクロエレクトロニクス株式会社 | 薬液供給装置 |
US20070205214A1 (en) * | 2006-03-03 | 2007-09-06 | Roberts Benjamin R | Liquid dispense system |
WO2009056152A1 (en) | 2007-10-30 | 2009-05-07 | Pall Corporation | Method for treating spent abrasive slurry |
US8297830B2 (en) * | 2009-03-04 | 2012-10-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry system for semiconductor fabrication |
-
1998
- 1998-10-15 JP JP29342798A patent/JP2000117636A/ja active Pending
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