JP2000082760A5 - - Google Patents
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- Publication number
- JP2000082760A5 JP2000082760A5 JP1999155704A JP15570499A JP2000082760A5 JP 2000082760 A5 JP2000082760 A5 JP 2000082760A5 JP 1999155704 A JP1999155704 A JP 1999155704A JP 15570499 A JP15570499 A JP 15570499A JP 2000082760 A5 JP2000082760 A5 JP 2000082760A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- back surface
- pattern
- circuit board
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000002093 peripheral Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive Effects 0.000 description 1
- 230000029578 entry into host Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000149 penetrating Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11155704A JP2000082760A (ja) | 1998-06-25 | 1999-06-02 | 半導体装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10-178513 | 1998-06-25 | ||
JP17851398 | 1998-06-25 | ||
JP11155704A JP2000082760A (ja) | 1998-06-25 | 1999-06-02 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000082760A JP2000082760A (ja) | 2000-03-21 |
JP2000082760A5 true JP2000082760A5 (da) | 2006-03-09 |
Family
ID=26483632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11155704A Pending JP2000082760A (ja) | 1998-06-25 | 1999-06-02 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000082760A (da) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100386634B1 (ko) * | 2000-12-29 | 2003-06-02 | 앰코 테크놀로지 코리아 주식회사 | 비지에이 패키지용 기판의 습기 배출공 형성방법 |
US7164192B2 (en) * | 2003-02-10 | 2007-01-16 | Skyworks Solutions, Inc. | Semiconductor die package with reduced inductance and reduced die attach flow out |
JP5071035B2 (ja) * | 2007-10-19 | 2012-11-14 | セイコーエプソン株式会社 | 圧電デバイス |
JP2011044747A (ja) * | 2010-11-29 | 2011-03-03 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP2012124537A (ja) * | 2012-03-26 | 2012-06-28 | Renesas Electronics Corp | 半導体装置 |
-
1999
- 1999-06-02 JP JP11155704A patent/JP2000082760A/ja active Pending
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