JP2000058508A5 - - Google Patents

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Publication number
JP2000058508A5
JP2000058508A5 JP1998239441A JP23944198A JP2000058508A5 JP 2000058508 A5 JP2000058508 A5 JP 2000058508A5 JP 1998239441 A JP1998239441 A JP 1998239441A JP 23944198 A JP23944198 A JP 23944198A JP 2000058508 A5 JP2000058508 A5 JP 2000058508A5
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JP
Japan
Prior art keywords
dry etching
gas
reactive gas
etching method
reactive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998239441A
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English (en)
Japanese (ja)
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JP2000058508A (ja
JP3704965B2 (ja
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Publication date
Application filed filed Critical
Priority to JP23944198A priority Critical patent/JP3704965B2/ja
Priority claimed from JP23944198A external-priority patent/JP3704965B2/ja
Publication of JP2000058508A publication Critical patent/JP2000058508A/ja
Publication of JP2000058508A5 publication Critical patent/JP2000058508A5/ja
Application granted granted Critical
Publication of JP3704965B2 publication Critical patent/JP3704965B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP23944198A 1998-08-12 1998-08-12 ドライエッチング方法及び装置 Expired - Fee Related JP3704965B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23944198A JP3704965B2 (ja) 1998-08-12 1998-08-12 ドライエッチング方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23944198A JP3704965B2 (ja) 1998-08-12 1998-08-12 ドライエッチング方法及び装置

Publications (3)

Publication Number Publication Date
JP2000058508A JP2000058508A (ja) 2000-02-25
JP2000058508A5 true JP2000058508A5 (cg-RX-API-DMAC10.html) 2004-10-21
JP3704965B2 JP3704965B2 (ja) 2005-10-12

Family

ID=17044828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23944198A Expired - Fee Related JP3704965B2 (ja) 1998-08-12 1998-08-12 ドライエッチング方法及び装置

Country Status (1)

Country Link
JP (1) JP3704965B2 (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4153961B2 (ja) * 2006-04-25 2008-09-24 積水化学工業株式会社 シリコンのエッチング方法
TWI335450B (en) * 2006-05-15 2011-01-01 Ind Tech Res Inst Film cleaning method and apparatus
FR2913912A1 (fr) * 2007-03-23 2008-09-26 Cirtes Src Sa Procede de conception d'un emballage par stratoconception integre au procede de conception du produit a emballer.
US8771539B2 (en) * 2011-02-22 2014-07-08 Applied Materials, Inc. Remotely-excited fluorine and water vapor etch
KR101661096B1 (ko) * 2015-03-20 2016-09-30 주식회사 엔씨디 마스크 프리 건식 식각 장치 및 건식 식각 방법
KR102459129B1 (ko) * 2020-04-30 2022-10-26 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 플라즈마 처리 장치
JP7798438B2 (ja) * 2021-11-10 2026-01-14 東京エレクトロン株式会社 プラズマ源及びプラズマ処理装置
JPWO2024247461A1 (cg-RX-API-DMAC10.html) * 2023-05-31 2024-12-05

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