JP2000058238A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000058238A5 JP2000058238A5 JP1998233598A JP23359898A JP2000058238A5 JP 2000058238 A5 JP2000058238 A5 JP 2000058238A5 JP 1998233598 A JP1998233598 A JP 1998233598A JP 23359898 A JP23359898 A JP 23359898A JP 2000058238 A5 JP2000058238 A5 JP 2000058238A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heating plate
- heat treatment
- heat
- storage member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 235
- 238000010438 heat treatment Methods 0.000 description 195
- 238000005338 heat storage Methods 0.000 description 52
- 230000002093 peripheral Effects 0.000 description 31
- 238000000034 method Methods 0.000 description 21
- 238000001816 cooling Methods 0.000 description 17
- 230000000875 corresponding Effects 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000001629 suppression Effects 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000011109 contamination Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001965 increased Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000006011 modification reaction Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000003068 static Effects 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N Bis(trimethylsilyl)amine Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 230000003028 elevating Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23359898A JP3768692B2 (ja) | 1998-08-05 | 1998-08-05 | 加熱処理装置および加熱処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23359898A JP3768692B2 (ja) | 1998-08-05 | 1998-08-05 | 加熱処理装置および加熱処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000058238A JP2000058238A (ja) | 2000-02-25 |
| JP2000058238A5 true JP2000058238A5 (ko) | 2004-12-24 |
| JP3768692B2 JP3768692B2 (ja) | 2006-04-19 |
Family
ID=16957574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23359898A Expired - Fee Related JP3768692B2 (ja) | 1998-08-05 | 1998-08-05 | 加熱処理装置および加熱処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3768692B2 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7543863B2 (ja) | 2020-11-17 | 2024-09-03 | 富士電機株式会社 | 半導体モジュール |
-
1998
- 1998-08-05 JP JP23359898A patent/JP3768692B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7543863B2 (ja) | 2020-11-17 | 2024-09-03 | 富士電機株式会社 | 半導体モジュール |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI305015B (en) | Heating device and coating and developing apparatus | |
| US6227786B1 (en) | Substrate treating apparatus | |
| JP2704309B2 (ja) | 基板処理装置及び基板の熱処理方法 | |
| KR101515247B1 (ko) | 기판 처리 장치 | |
| JP2000056474A (ja) | 基板処理方法 | |
| JPH10229037A (ja) | 基板冷却方法および基板冷却装置 | |
| JP3649048B2 (ja) | レジスト塗布・現像装置、ならびにそれに用いる基板加熱処理装置および基板搬送装置 | |
| JP2000040731A (ja) | 処理装置 | |
| KR101287736B1 (ko) | 열처리 장치, 열처리 방법 및 컴퓨터 독취 가능한 기억매체 | |
| JP3874960B2 (ja) | 基板処理装置 | |
| TW201117257A (en) | Temperature increase control method for heating device for substrate treatment system, program, computer recording medium, and substrate treatment system | |
| JP3504822B2 (ja) | 基板処理装置および基板処理用露光装置 | |
| JP3363368B2 (ja) | 熱処理装置 | |
| JP2000058438A (ja) | 処理装置 | |
| JP2000091218A (ja) | 加熱処理方法及び加熱処理装置 | |
| JP3324974B2 (ja) | 熱処理装置及び熱処理方法 | |
| JP3768692B2 (ja) | 加熱処理装置および加熱処理方法 | |
| JP2000058238A5 (ko) | ||
| JP3576826B2 (ja) | 加熱処理装置および加熱処理方法 | |
| JP3479771B2 (ja) | 熱処理装置 | |
| KR102175077B1 (ko) | 기판 반송 로봇 및 기판 처리 설비 | |
| JP3822752B2 (ja) | 処理装置 | |
| JP3128725B2 (ja) | 熱処理方法及び熱処理装置 | |
| JP2002324740A (ja) | 処理装置 | |
| JP4219447B2 (ja) | 現像処理装置および現像処理方法 |