JP2000022480A - Laminated filter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the height of a filter while keeping the inductance of the laminated low pass filter or the Q characteristic of a strip line to be excellent. SOLUTION: An inductance conductor layer 2 is provided in a ceramic dielectric body 1 having 1st and 2nd major faces 6, 7 and 1st, 2nd, 3rd and 4th side faces. A ground conductor layer 4 and 1st and 2nd terminal conductor layers 5a, 5b are provided on the outer circumferential face of the dielectric body 1. The inductance conductor layer 2 is connected between the 1st and 2nd terminal conductor layers 5a, 5b. The inductance conductance layer 2 is arranged so as to be extended linearly from the 1st side face toward the 2nd side face and is arranged in parallel with the 3rd and 4th side faces.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer filter used for a high-frequency circuit of a portable telephone or the like.

2. Description of the Related Art To embed a conductor layer having an inductance and a conductor layer for obtaining a capacitance in a dielectric to constitute a laminated high-frequency low-pass filter is disclosed in, for example, Japanese Patent Application Laid-Open No. H5-25-2
It is known from 59702.

[0003]

By the way, with the miniaturization of communication equipment, there has been a demand for miniaturization and reduction in height of a multilayer filter. However, it has been difficult to reduce the size and height of the filter by preventing the characteristic deterioration of the filter. That is, the conductor layer for obtaining the inductance of the conventional multilayer filter is arranged such that its main surface is parallel to the main surface of the printed circuit board on which the multilayer filter is mounted. In the conventional multilayer filter, when the height of the dielectric is reduced to reduce the height, the volume of the dielectric surrounding the conductor layer for obtaining the inductance is reduced, and the loss of the inductance is increased, that is, the Q is reduced. Invited. This kind of problem also occurs when a conductor layer for obtaining inductance is a strip line conductor layer.

Accordingly, an object of the present invention is to provide a multilayer filter capable of miniaturizing or reducing the height by suppressing the deterioration of the characteristics.

[0005]

In order to solve the above problems and to achieve the above object, the present invention provides a hexahedral dielectric, a conductor layer having an inductance embedded in the dielectric, and A capacitor conductor layer embedded in the body, a ground conductor layer provided on the outer peripheral surface of the dielectric, and coupled to one end and the other end of the conductor layer provided on the outer peripheral surface of the dielectric and having the inductance; A first and a second terminal conductor layer, wherein the dielectric body has a first and a second main surface facing each other and a first and a second surface facing each other between the first and second main surfaces. And a third and a fourth side surface which are opposed to each other between the first and second main surfaces and which are arranged at right angles to the first and second side surfaces. The terminal conductor layer is provided on at least a part of the first side surface. The second terminal conductor layer is provided on at least a part of the second side surface, and is a multilayer filter formed such that the first main surface faces a filter support, and has the inductance. The conductor layer has a predetermined thickness and a predetermined width, and extends from the first side surface toward the second side surface, and a pair of main surfaces of the conductor layer having the inductance is provided on the first side of the dielectric. The capacitor conductor layer is disposed in parallel with the third and fourth side surfaces, and the capacitor conductor layer is disposed to face the conductor layer having the inductance so as to obtain capacitance between the capacitor conductor layer and the conductor layer having the inductance, and the ground conductor layer The present invention relates to a multilayer filter characterized by being connected to a filter. In addition, as described in claim 2, the capacitor conductor layer can be provided on the ground conductor layer covering the dielectric via a dielectric layer, and this capacitor conductor layer can be connected to the terminal conductor layer. Further, as described in claim 3, the capacitor conductor layer can be buried in the dielectric and opposed to the ground conductor layer. Further, the conductor layer having inductance can be formed wide at one end and the other end and narrow at the middle part. Also, as described in claim 5, the middle part of the conductor layer having inductance can be in a meandering state. Further, as described in claim 6, the middle part of the conductor layer having inductance can be a combination of conductor layers of a plurality of dielectric layers. Further, an LC parallel circuit, that is, a trap circuit can be obtained by using one end and the other end of the conductor layer having inductance as a pattern in which a capacitance can be obtained therebetween.

[0006]

According to the invention of each claim, the pair of main surfaces of the conductor layer having inductance is arranged in parallel with the side surface of the dielectric, so that the pair of main surfaces of the conductor layer having inductance is provided. Even if the thickness of the dielectric layer increases in the direction parallel to the vertical direction, the reduction in height of the multilayer filter is not hindered.
Therefore, according to the present invention, the thickness of the dielectric layer in the direction parallel to the side surface of the conductor layer having the inductance is sufficiently maintained, whereby the inductance and the loss of the filter can be suppressed and the height can be reduced. According to the first and third aspects of the present invention, a capacitor (capacitor) for a low-pass filter can be easily obtained. According to the second aspect of the present invention, since the capacitor conductor layer is disposed outside the dielectric,
The Q characteristic of the inductance can be improved. According to the invention of claims 4, 5 and 6, since the both end portions are wide, it is possible to achieve a good connection of the conductor layer having the inductance to the terminal conductor layer and to obtain a good inductance. Can be. Claim 7
According to the invention, the capacitance for the low-pass filter can be favorably obtained. Further, according to the invention of claim 8, a low-pass filter with a trap can be provided.

[0007]

Embodiments and Examples Next, embodiments and examples of the present invention will be described.

[0008]

First Embodiment A laminated low-pass filter according to a first embodiment shown in FIGS. 1 to 10 comprises a ceramic dielectric 1, an inductance conductor layer 2, and capacitance conductor layers 3a, 3b, 3c.
3d, a ground conductor layer 4, and first and second terminal conductor layers 5a and 5b.

The dielectric 1 is formed by laminating and firing a plurality of green sheets (porcelain raw sheets), and includes first and second main surfaces 6, 7 and first, second, third, and fourth green sheets. Are formed as a hexahedron, that is, a rectangular parallelepiped as a whole. FIG. 9 is an exploded view of the dielectric 1 into first, second, third, fourth, and fifth dielectric layers 1a, 1b, 1c, 1d, and 1e corresponding to the green sheets. The inductance conductor layer 2 which is omitted and not shown but dotted is arranged at the center of the main surface of the third dielectric layer 1c so as to extend horizontally. Similarly, the first, second, third, and fourth capacitance conductor layers 3a, 3b, 3c, and 3d, which are illustrated by omitting the thickness and dotted, are second and fourth dielectric layers 1b and 1d. Are arranged so as to extend perpendicular to the surface. Therefore, the first, second, third, and fourth capacitance conductor layers 3a, 3b, 3c, and 3d have portions facing the inductance conductor layer 2 with the dielectric layers 1c and 1d interposed therebetween. Can be obtained. Note that the conductor layers 2, 3a,
3b, 3c and 3d are obtained by printing a conductive paste on a green sheet, laminating and firing the green sheet.

The first main surface 6 of the dielectric 1 is a surface facing the main surface of the filter mounting circuit board 12, as shown in FIG. The circuit board 12 has a first conductor layer 13 for connecting the ground conductor layer 4 of the multilayer low-pass filter and the first conductor layer 13.
And a conductor layer (not shown) for connecting the second terminal conductor layer 5b to the conductor layer 14 for connecting the terminal conductor layer 5a.

The inductance conductor layer 2 serving as an inductance element or a strip line has a width W1 and a length L1.
And a first side surface 8 which is arranged substantially at the center of the dielectric 1.
From the first side to the second side surface 9 opposed thereto. The inductance conductor layer 2 is flat and has a pair of main surfaces 2a and 2b facing each other and a pair of side surfaces 2a.
c, 2d and a pair of end faces 2e, 2f. Pair main surface 2
The distance between a and 2b, that is, the thickness of the conductor layer 2 is smaller than the width W1. One end face 2e of this inductance conductor layer 2 is exposed on the first side face 8 of the dielectric 1 as shown in FIG. 7, and the other end face 2f is the second side face 9 of the dielectric 1 as shown in FIG. It is exposed to. The pair of main surfaces 2a and 2b of the inductance conductor layer 2 are the third and fourth side surfaces 1 of the dielectric 1.
0 and 11 are arranged in parallel. Therefore, the pair of main surfaces 2 a and 2 b of the inductance conductor layer 2 are arranged perpendicular to the first main surface 6 on the mounting surface side of the dielectric 1. The inductance conductor layer 2 has a wide one end 2g and the other end 2g.
h and an intermediate portion 2i narrower than these. One end face 2e of the inductance conductor layer 2 is connected to the first terminal conductor layer 5a.
And the other end face 2f is connected to the second terminal conductor layer 5b.

The ground conductor layer 4 includes all of the third and fourth side surfaces 10 and 11 of the dielectric 1 and the first and second main surfaces 6 and 7 of the dielectric 1 and the first and second side surfaces. It is formed in the majority of 8 and 9. That is, the ground conductor layer 4 includes the first and second terminal conductor layers 5a and 5b and the separation region 15 surrounding the first and second terminal conductor layers 5a and 5b.
It is formed on the outer peripheral surface of the dielectric 1 except for a and 15b. One end of each of the capacitive conductor layers 3a, 3b, 3c and 3d is exposed to the second main surface 7 of the dielectric 1 and connected to the ground conductor layer 4, and the other end thereof is connected to the first main surface of the dielectric 1. 6 and is connected to the ground conductor layer 4.

The first and second terminal conductor layers 5a and 5b are provided at the center of the first and second side surfaces 8 and 9 of the dielectric 1 with the first and second terminal conductor layers 5a and 5b.
Is formed in a band shape so as to extend linearly from the main surface 6 to the second main surface 7. The ground conductor layer 4 and the terminal conductor layers 5a and 5b are formed by printing and firing a conductive paste.

FIG. 10 shows an equivalent circuit of the laminated low-pass filter of FIG. The inductance conductor layer 2 acting as a strip line or an inductance element provides an inductance L between the input / output terminals 21 and 22 corresponding to the terminal conductor layers 5a and 5b and resistances R1 and R2. Capacitive conductor layer 3
a, 3b, 3c, 3d are capacitors C1, C2, C3,
C4 and resistors R3, R4, R5, R6. The low-pass filter of the present embodiment has a frequency characteristic in which a pass band is about 1 GHz or less.

As apparent from the above, the present embodiment has the following effects. (1) Pair main surfaces 2a, 2b of the inductance conductor layer 2
Are parallel to the third and fourth side surfaces 10 and 11, the inductance conductor layer 2 and the third and fourth side surfaces 10 and 11
The Q characteristic can be improved by sufficiently increasing the thickness of the dielectric layer between them. That is, the first and second dielectric materials 1
Without increasing the distance between the principal surfaces 6, 7 of the
The characteristics can be improved. Therefore, it is possible to provide a laminated low-pass filter which is not reduced in height but does not cause deterioration in characteristics. (2) Since the capacitance conductor layers 3a to 3d are embedded in the dielectric 1 and opposed to the wide ends 2g and 2h of the inductance conductor layer 2, a desired capacitance can be obtained.

[0016]

Second Embodiment Next, a laminated filter according to a second embodiment will be described with reference to FIG. However, FIG. 11 showing the second embodiment and FIGS. 12 and 2 showing the third to eighth embodiments
In FIG. 5, portions substantially the same as those in FIGS. 1 to 9 are denoted by the same reference numerals, and description thereof will be omitted. In the description of the second to sixth embodiments, portions common to the first embodiment will be described with reference to FIGS.

The laminated low-pass filter according to the second embodiment shown in FIG. 11 has the same configuration as that of the first embodiment except that a meandering portion 30 is provided in the intermediate portion 2i of the inductance conductor layer 2.

By providing the meandering portion 30 in this manner, the inductance component can be increased. Note that the second embodiment also has the same effect as the first embodiment.

[0019]

Third Embodiment A laminated low-pass filter according to a third embodiment is configured such that the intermediate portion 2i of the inductance conductor layer 2 is first and second.
And the third portions 41, 42, 43 and the through conductors 44, 45
Other than the above configuration, the configuration is the same as that of the first embodiment. The first and second portions 41, 42 are wide ends 2
g, 2h, and is disposed on the third dielectric layer 1c. The third portion 43 is disposed on the second dielectric layer 1b. First and second portions 41, 42 and third
Part 43 is a through conductor 44, 45 of the third dielectric layer 1c.
Connected by According to the third embodiment, the middle portion 2i of the inductance conductor layer 2 can be formed long while keeping the size small, and a large inductance value can be obtained. Note that the third embodiment also has the same effect as the first embodiment.

[0020]

Fourth Embodiment A laminated low-pass filter according to a fourth embodiment is the same as the first embodiment except that capacitance projecting portions 51, 52, 53 and 54 are provided on the inductance conductor layer 2 as shown in FIG. It has the same configuration as that of FIG. Projection 5 on one side
The projections 1 and 52 project from one end 2g, and the projections 53 and 54 on the other side project from the other end so that a capacitance corresponding to the capacitors C5 and C6 of the equivalent circuit of FIG. 15 can be obtained. They are facing each other. In FIG. 15, components other than the capacitors C5 and C6 are the same as those indicated by the same reference numerals in FIG. The inductance conductor layer 2 of the first embodiment also has a wide one end and the other end 2g, 2h facing each other, so that the stray capacitance parallel to the intermediate portion 2i, that is, FIG.
Although the capacitors C5 and C6 are not so large, they are omitted in FIG. The fourth
According to this embodiment, the capacitance of the capacitors C5 and C6 can be made larger than that of the first embodiment. The parallel circuit of the inductance L and the capacitors C5 and C6 in FIG. It is possible to provide a low-pass filter having a good trap (attenuation pole) as shown. In the filter characteristics of FIG.
The passband is below GHz. The fourth embodiment has the same effect as the first embodiment in addition to the above-described trap effect.

[0021]

Fifth Embodiment The multilayer filter of the fifth embodiment has a different pattern between the ground conductor layer 4 and the first and second terminal conductor layers 5a and 5b, as is apparent from FIGS. Otherwise, the configuration is the same as that of the first embodiment. That is, in FIGS. 17 and 18, the first and second terminal conductor layers 5 a and 5 b correspond to the first and second side surfaces 8 of the dielectric 1.
9 and the first and second main surfaces 6, 7 and 3
And the fourth side surfaces 10 and 11 are provided so as to extend. Therefore, the ground conductor layer 4 is formed in a band shape at the center of the first and second main surfaces 6, 7 and the third and fourth side surfaces 10, 11. According to the fifth embodiment, the connection of the first and second terminal conductor layers 5a and 5b to the circuit board 12 can be reliably achieved. Note that the fifth embodiment also has the same effect as the first embodiment.

[0022]

Sixth Embodiment A laminated low-pass filter according to a sixth embodiment is different from the first embodiment in that the capacitive conductor layers 3a, 3b, 3c,
Instead of d, the dielectric layers 60a and 60b and the capacitor conductor layer 61,
The structure is the same as that of the first embodiment except that 62, 63 and 64 are provided outside the dielectric 1. The dielectric layers 60a and 60b of this embodiment are obtained by printing a conductor paste on the ground conductor layer 4 on the first and second main surfaces 6 and 7 and firing the paste. The capacitor conductor layers 61, 62, 63, and 64 are formed by printing and firing a conductive paste on the dielectric layers 60a and 60b, and are connected to the terminal conductor layers 5a and 5b. The capacitance between the capacitance conductor layers 61, 62, 63, 64 and the ground conductor layer 4 is determined by the capacitors C1,
This corresponds to the connection of C2, C3 and C4 to terminals 21 and 22, and contributes to the low-pass filter characteristics. According to the sixth embodiment, since the capacitance conductor layers 61 to 64 are provided outside the dielectric 1, the interference effect on the inductance of the inductance conductor layer 2 due to this is eliminated, and the inductance and Q are improved. Can be. The sixth
Since the configuration of the inductance conductor layer 2 of this embodiment is the same as that of the first embodiment, the same effect as that of the first embodiment can be obtained.

[0023]

Seventh Embodiment FIGS. 21 and 22 show a laminated low-pass filter according to a seventh embodiment. In FIG. 21, the ground conductor layer 4 and the terminal conductor layers 5a and 5b are not shown in thickness, and are dotted here. In the seventh embodiment, the inductance conductor layer 2 is bent in a crank shape, and both ends are arranged slightly above the center in the height direction of the dielectric 1, and approach the second main surface 7. The capacitance conductor layers 3a and 3c extend downward from the second main surface 7 and are arranged so as to intersect both ends 2g and 2h of the inductance conductor layer 2 in FIG. The filter of the seventh embodiment is substantially the same as the filter of the first embodiment except for the above-mentioned points. Therefore, the seventh embodiment has the same effect as the first embodiment, and also has the effect that the length of the inductance conductor layer 2 can be increased.

[0024]

Eighth Embodiment A multilayer low-pass filter according to an eighth embodiment shown in FIGS. 23 to 25 is obtained by partially modifying the multilayer low-pass filter according to the first or seventh embodiment. It is. That is, in the eighth embodiment, the inductance conductor layer 2 is
25, and the other conductor layer 72 on the second dielectric layer shown in FIG. 25 is connected by a through conductor 73. Further, one capacitor conductor layer 3a is arranged in the same plane as the other conductor layer 72, and the other capacitor conductor layer 3c is connected to the one conductor layer 71.
And are arranged on the same plane. This eighth embodiment is similar to the first embodiment.
In addition to the same effects as those of the first embodiment, there is an effect that the inductance of the inductance conductor layer 2 can be made larger than those of the first and seventh embodiments.

[0025]

[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) Capacitance conductor layers 61, 62, 63 and 64 are provided in the dielectric 1 as shown by broken lines in FIG. 20, and the capacitance between these and the ground conductor layer 4 is determined by the capacitors C1 to C in FIG.
Can be used as in 4. (2) The dielectric layers 1a and 1e of FIG. 9 can be formed by laminating a plurality of green sheets. (3) The capacitor conductor layers 3a, 3b, 3c, 3d are not formed so as to extend from the first main surface 6 to the second main surface 7,
The main surface 6 side portion or the second main surface 7 side portion can be removed to obtain an open end, that is, a cantilever support state. (4) One or more of the capacitive conductor layers 3a to 3d may be removed. 19 and FIG.
, One or more of the capacitive conductor layers 61, 62, 63, 64 can be removed. (5) The terminal conductor layers 5a, 5b are extended to the first and second main surfaces 6, 7 in the first embodiment to obtain a capacitance between the terminal conductor layers 5a, 5b and the ground conductor layer 4. Can be done. In this case, the capacitive conductor layers 3a to 3d can be removed. (6) A plurality of inductance conductor layers or stripline conductor layers can be formed on one dielectric 1.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a laminated low-pass filter according to a first embodiment.

FIG. 2 is a plan view of the filter of FIG.

FIG. 3 is a front view of the filter of FIG. 1 and its mounting circuit board.

FIG. 4 is a left side view of the filter of FIG. 1;

FIG. 5 is a bottom view of the filter of FIG. 1;

FIG. 6 is a plan view of a dielectric including the conductor layer of FIG. 1;

FIG. 7 is a front view of the dielectric of FIG. 6;

FIG. 8 is a rear view of the dielectric of FIG. 6;

9 is an exploded perspective view of the dielectric of FIG.

FIG. 10 is an equivalent circuit diagram of the filter of FIG. 1;

FIG. 11 is a right side view showing a main surface of an inductance conductor layer of the multilayer low-pass filter according to the second embodiment.

FIG. 12 is a right side view showing an inductance conductor layer and a dielectric layer near the inductance conductor layer of the multilayer low-pass filter of the embodiment of FIG. 3;

FIG. 13 is a sectional view taken along line AA of FIG.

FIG. 14 is a right side view showing an inductance conductor layer of the multilayer low-pass filter according to the fourth embodiment.

FIG. 15 is an equivalent circuit diagram of the multilayer low-pass filter according to the fourth embodiment.

FIG. 16 is an attenuation characteristic diagram of the multilayer low-pass filter of the first embodiment.

FIG. 17 is a perspective view of a laminated low-pass filter according to a fifth embodiment.

18 is a plan view of the filter of FIG.

FIG. 19 is a perspective view of a multilayer low-pass filter according to a sixth embodiment.

FIG. 20 is a sectional view taken along line BB of FIG. 19;

FIG. 21 is a perspective view showing a multilayer low-pass filter according to a seventh embodiment.

22 is a sectional view taken along line CC of FIG. 21.

FIG. 23 is a sectional view showing a laminated low-pass filter according to an eighth embodiment, similarly to FIG. 22;

24 is a front view showing the surface of the first layer by disassembling the dielectric with the conductor layer of FIG. 23;

FIG. 25 is a front view showing a display of a second layer in which the dielectric with the conductor layer of FIG. 23 is exploded.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Dielectric 2 Inductance conductor layer 3a, 3b, 3c, 3d Capacitance conductor layer 4 Ground conductor layer 5a, 5b Terminal conductor layer 6, 7 1st and 2nd main surface 12 Mounting circuit board

Claims (8)

[Claims] 1. A dielectric having a hexahedral shape, a conductor layer having an inductance embedded in the dielectric, a capacitor conductor layer embedded in the dielectric, and a ground provided on an outer peripheral surface of the dielectric. A conductor layer, and first and second terminal conductor layers provided on an outer peripheral surface of the dielectric and coupled to one end and the other end of the conductor layer having the inductance; A first and a second main surface and a first and a second main surface facing each other between the first and the second main surfaces;
And third and fourth side surfaces that are opposed to each other between the second side surface and the first and second main surfaces and are arranged at right angles to the first and second side surfaces, The first terminal conductor layer is provided on at least a part of the first side surface, the second terminal conductor layer is provided on at least a part of the second side surface, and the first main surface is supported by a filter. A multilayer filter formed so as to face a body, wherein the conductor layer having the inductance has a predetermined thickness and a predetermined width, and extends from the first side surface toward the second side surface. A pair of main surfaces of the conductor layer having the inductance are disposed parallel to the third and fourth side surfaces of the dielectric; and the capacitance conductor layer has a capacitance between the conductor layer having the inductance. So that the inductance The multilayer filter, characterized in that connected to the oppositely disposed and the ground conductor layer to the conductor layer having. 2. A hexahedral dielectric, a conductor layer having an inductance embedded in the dielectric, a capacitor conductor layer, a ground conductor layer provided on an outer peripheral surface of the dielectric, and the dielectric First and second terminal conductor layers provided on the outer peripheral surface of the first conductor layer and coupled to one end and the other end of the conductor layer having the inductance, wherein the dielectric is opposed to the first and second main surfaces. And the first and second main surfaces facing each other between the first and second main surfaces.
And third and fourth side surfaces that are opposed to each other between the second side surface and the first and second main surfaces and are arranged at right angles to the first and second side surfaces, A first terminal conductor layer is provided on at least a part of the first side surface; the second terminal conductor layer is provided on at least a part of the second side surface; A multilayer filter formed so as to obtain a capacitance between at least one of a second terminal conductor layer and the ground conductor layer, and formed so that the first main surface faces a filter support. A conductor layer having the inductance, having a predetermined thickness and a predetermined width, extending from the first side surface to the second side surface, and a pair of main surfaces of the conductor layer having the inductance; Is the third and fourth sides of the dielectric Arranged in parallel against, multilayer filter the capacitive conductor layer is characterized by being disposed on the dielectric layer formed on the ground conductor layer. 3. A dielectric body having a hexahedral shape, a conductor layer having an inductance embedded in the dielectric body, a capacitor conductor layer, a ground conductor layer provided on an outer peripheral surface of the dielectric body, and the dielectric body. First and second terminal conductor layers provided on the outer peripheral surface of the first conductor layer and coupled to one end and the other end of the conductor layer having the inductance, wherein the dielectric is opposed to the first and second main surfaces. And the first and second main surfaces facing each other between the first and second main surfaces.
And third and fourth side surfaces that are opposed to each other between the second side surface and the first and second main surfaces and are arranged at right angles to the first and second side surfaces, A first terminal conductor layer is provided on at least a part of the first side surface; the second terminal conductor layer is provided on at least a part of the second side surface; A multilayer filter formed so as to obtain a capacitance between at least one of a second terminal conductor layer and the ground conductor layer, and formed so that the first main surface faces a filter support. A conductor layer having the inductance, having a predetermined thickness and a predetermined width, extending from the first side surface to the second side surface, and a pair of main surfaces of the conductor layer having the inductance; Is the third and fourth sides of the dielectric Arranged in parallel against, multilayer filter the capacitive conductor layer is characterized by being embedded in the dielectric body so as to face the ground conductor layer. 4. The conductor layer having an inductance has one end, the other end, and an intermediate portion, and the one end and the other end have a wider width than the intermediate portion. The multilayer filter according to claim 1, 2 or 3, wherein 5. The conductor layer having the inductance has one end, the other end, and an intermediate portion, wherein the one end and the other end have a wider width than the intermediate portion. 4. The multilayer filter according to claim 1, wherein the filter is formed in a meandering state. 6. The conductor layer having inductance has one end, the other end, and an intermediate portion, wherein the one end and the other end have a wider width than the intermediate portion. 4. The multilayer filter according to claim 1, comprising a conductor layer of a plurality of dielectric layers connected by through conductors. 7. The capacitor conductor layer is a single or a plurality of conductor layers facing one or both of the one end and the other end of the conductor layer having the inductance. The multilayer filter according to claim 4, 5 or 6, wherein: 8. The semiconductor device according to claim 1, wherein the one end and the other end of the conductor layer having the inductance are formed in a pattern such that a capacitance can be obtained therebetween. 3. The laminated filter according to item 1.