JP2000021926A5 - - Google Patents

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Publication number
JP2000021926A5
JP2000021926A5 JP1998190809A JP19080998A JP2000021926A5 JP 2000021926 A5 JP2000021926 A5 JP 2000021926A5 JP 1998190809 A JP1998190809 A JP 1998190809A JP 19080998 A JP19080998 A JP 19080998A JP 2000021926 A5 JP2000021926 A5 JP 2000021926A5
Authority
JP
Japan
Prior art keywords
electrode
semiconductor chip
region
wire
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998190809A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000021926A (ja
JP3946874B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP19080998A external-priority patent/JP3946874B2/ja
Priority to JP19080998A priority Critical patent/JP3946874B2/ja
Priority to TW088110698A priority patent/TW473882B/zh
Priority to DE69935182T priority patent/DE69935182T2/de
Priority to EP06027122A priority patent/EP1770777A3/en
Priority to EP99112588A priority patent/EP0971411B1/en
Priority to US09/345,505 priority patent/US6330165B1/en
Publication of JP2000021926A publication Critical patent/JP2000021926A/ja
Priority to US09/970,668 priority patent/US6489680B2/en
Priority to US10/291,840 priority patent/US6943441B2/en
Priority to US11/194,701 priority patent/US7068521B2/en
Publication of JP2000021926A5 publication Critical patent/JP2000021926A5/ja
Priority to US11/451,579 priority patent/US20070001300A1/en
Publication of JP3946874B2 publication Critical patent/JP3946874B2/ja
Application granted granted Critical
Priority to US11/905,421 priority patent/US7525813B2/en
Priority to US12/394,421 priority patent/US7817437B2/en
Priority to US12/787,154 priority patent/US8295057B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP19080998A 1998-07-06 1998-07-06 半導体装置 Expired - Lifetime JP3946874B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP19080998A JP3946874B2 (ja) 1998-07-06 1998-07-06 半導体装置
TW088110698A TW473882B (en) 1998-07-06 1999-06-25 Semiconductor device
DE69935182T DE69935182T2 (de) 1998-07-06 1999-07-01 Halbleiteranordnung
EP06027122A EP1770777A3 (en) 1998-07-06 1999-07-01 Semiconductor device with a shielding bond wire
EP99112588A EP0971411B1 (en) 1998-07-06 1999-07-01 Semiconductor device
US09/345,505 US6330165B1 (en) 1998-07-06 1999-07-01 Semiconductor device
US09/970,668 US6489680B2 (en) 1998-07-06 2001-10-05 Semiconductor device
US10/291,840 US6943441B2 (en) 1998-07-06 2002-11-12 Semiconductor device
US11/194,701 US7068521B2 (en) 1998-07-06 2005-08-02 Semiconductor device
US11/451,579 US20070001300A1 (en) 1998-07-06 2006-06-13 Semiconductor device
US11/905,421 US7525813B2 (en) 1998-07-06 2007-10-01 Semiconductor device
US12/394,421 US7817437B2 (en) 1998-07-06 2009-02-27 Semiconductor device
US12/787,154 US8295057B2 (en) 1998-07-06 2010-05-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19080998A JP3946874B2 (ja) 1998-07-06 1998-07-06 半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2006339318A Division JP2007074001A (ja) 2006-12-18 2006-12-18 半導体装置
JP2006339316A Division JP2007074000A (ja) 2006-12-18 2006-12-18 半導体装置

Publications (3)

Publication Number Publication Date
JP2000021926A JP2000021926A (ja) 2000-01-21
JP2000021926A5 true JP2000021926A5 (enExample) 2005-10-27
JP3946874B2 JP3946874B2 (ja) 2007-07-18

Family

ID=16264117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19080998A Expired - Lifetime JP3946874B2 (ja) 1998-07-06 1998-07-06 半導体装置

Country Status (1)

Country Link
JP (1) JP3946874B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW594888B (en) 2001-09-05 2004-06-21 Hitachi Ltd Semiconductor device and manufacturing method thereof and wireless communication device
US7952448B2 (en) * 2005-10-19 2011-05-31 Nxp B.V. Device comprising an element with electrodes coupled to connections
KR100935854B1 (ko) * 2009-09-22 2010-01-08 테세라 리써치 엘엘씨 와이어 본딩 및 기준 와이어 본딩에 의해 제어되는 임피던스를 가진 마이크로전자 어셈블리
KR100950511B1 (ko) 2009-09-22 2010-03-30 테세라 리써치 엘엘씨 와이어 본딩 및 도전성 기준 소자에 의해 제어되는 임피던스를 포함하는 마이크로전자 어셈블리
US8853708B2 (en) 2010-09-16 2014-10-07 Tessera, Inc. Stacked multi-die packages with impedance control
US8786083B2 (en) 2010-09-16 2014-07-22 Tessera, Inc. Impedance controlled packages with metal sheet or 2-layer RDL
US9136197B2 (en) 2010-09-16 2015-09-15 Tessera, Inc. Impedence controlled packages with metal sheet or 2-layer RDL
US8581377B2 (en) 2010-09-16 2013-11-12 Tessera, Inc. TSOP with impedance control

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