JP2000015557A - 研磨装置 - Google Patents

研磨装置

Info

Publication number
JP2000015557A
JP2000015557A JP8687199A JP8687199A JP2000015557A JP 2000015557 A JP2000015557 A JP 2000015557A JP 8687199 A JP8687199 A JP 8687199A JP 8687199 A JP8687199 A JP 8687199A JP 2000015557 A JP2000015557 A JP 2000015557A
Authority
JP
Japan
Prior art keywords
polished
dresser
grindstone
polishing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8687199A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000015557A5 (enExample
Inventor
Naonori Matsuo
尚典 松尾
Hirokuni Hiyama
浩國 檜山
Taketaka Wada
雄高 和田
Kazuto Hirokawa
一人 廣川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP8687199A priority Critical patent/JP2000015557A/ja
Priority to US09/300,383 priority patent/US6402588B1/en
Publication of JP2000015557A publication Critical patent/JP2000015557A/ja
Publication of JP2000015557A5 publication Critical patent/JP2000015557A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP8687199A 1998-04-27 1999-03-29 研磨装置 Pending JP2000015557A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8687199A JP2000015557A (ja) 1998-04-27 1999-03-29 研磨装置
US09/300,383 US6402588B1 (en) 1998-04-27 1999-04-27 Polishing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-116744 1998-04-27
JP11674498 1998-04-27
JP8687199A JP2000015557A (ja) 1998-04-27 1999-03-29 研磨装置

Publications (2)

Publication Number Publication Date
JP2000015557A true JP2000015557A (ja) 2000-01-18
JP2000015557A5 JP2000015557A5 (enExample) 2004-12-02

Family

ID=26427946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8687199A Pending JP2000015557A (ja) 1998-04-27 1999-03-29 研磨装置

Country Status (2)

Country Link
US (1) US6402588B1 (enExample)
JP (1) JP2000015557A (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001054862A1 (en) * 2000-01-28 2001-08-02 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
WO2002024410A1 (en) * 2000-09-22 2002-03-28 Lam Research Corporation Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
WO2002030618A1 (en) * 2000-10-06 2002-04-18 Lam Research Corporation Activated slurry cmp system and methods for implementing the same
WO2002016075A3 (en) * 2000-08-22 2002-08-15 Lam Res Corp Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
WO2002031866A3 (en) * 2000-10-13 2002-09-06 Lam Res Corp Infrared end-point system for cmp
WO2002053322A3 (en) * 2001-01-04 2003-05-01 Lam Res Corp System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
JP2008049430A (ja) * 2006-08-24 2008-03-06 Sumitomo Metal Mining Co Ltd ウエハーの研磨方法
JP2010064160A (ja) * 2008-09-09 2010-03-25 Okamoto Machine Tool Works Ltd 複合平面研削装置
JP2010137338A (ja) * 2008-12-12 2010-06-24 Disco Abrasive Syst Ltd ウエーハの研削方法および研削装置
JP2015155131A (ja) * 2014-02-21 2015-08-27 旭精機工業株式会社 ばね研削装置
JP2021112820A (ja) * 2017-02-27 2021-08-05 株式会社東京精密 研削装置
CN113814832A (zh) * 2021-11-23 2021-12-21 杭州中欣晶圆半导体股份有限公司 一种改善大尺寸硅单晶外延厚度均匀性的装置及操作方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000005988A (ja) * 1998-04-24 2000-01-11 Ebara Corp 研磨装置
US6547651B1 (en) * 1999-11-10 2003-04-15 Strasbaugh Subaperture chemical mechanical planarization with polishing pad conditioning
US7481695B2 (en) * 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6726527B2 (en) * 2001-06-08 2004-04-27 Edward A. Lalli Automatic disc repair system
US7930058B2 (en) * 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7473162B1 (en) 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
JP4960395B2 (ja) * 2009-03-17 2012-06-27 株式会社東芝 研磨装置とそれを用いた半導体装置の製造方法
JP6088919B2 (ja) * 2013-06-28 2017-03-01 株式会社東芝 半導体装置の製造方法
JP6243255B2 (ja) * 2014-02-25 2017-12-06 光洋機械工業株式会社 ワークの平面研削方法
US9987724B2 (en) * 2014-07-18 2018-06-05 Applied Materials, Inc. Polishing system with pad carrier and conditioning station
SG10201906815XA (en) 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
CN105619243B (zh) * 2016-01-05 2017-08-29 京东方科技集团股份有限公司 研磨刀头及研磨装置
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872626A (en) * 1973-05-02 1975-03-25 Cone Blanchard Machine Co Grinding machine with tilting table
DE3306246C2 (de) * 1983-02-23 1984-12-06 Maschinenfabrik Ernst Thielenhaus GmbH, 5600 Wuppertal Werkstückaufnahme zum Feinschleifen von zumindest bereichsweise kreiszylindrischen oder topfförmig ausgebildeten Werkstücken
DE3585200D1 (de) * 1984-10-15 1992-02-27 Nissei Ind Co Flachschleifmaschine.
JPS61168462A (ja) 1985-01-18 1986-07-30 Hitachi Ltd ウエハ研削装置
EP0272531B1 (en) * 1986-12-08 1991-07-31 Sumitomo Electric Industries Limited Surface grinding machine
CA2012878C (en) * 1989-03-24 1995-09-12 Masanori Nishiguchi Apparatus for grinding semiconductor wafer
JPH05138512A (ja) 1991-11-12 1993-06-01 Disco Abrasive Syst Ltd 研削装置
JP3024417B2 (ja) * 1992-02-12 2000-03-21 住友金属工業株式会社 研磨装置
JPH05305561A (ja) * 1992-05-01 1993-11-19 Sumitomo Electric Ind Ltd 窒化ケイ素系セラミックスの研削加工方法及びその加工製品
DE69306049T2 (de) * 1992-06-19 1997-03-13 Rikagaku Kenkyusho Vorrichtung zum Schleifen von Spiegeloberfläche
DE4335980C2 (de) * 1993-10-21 1998-09-10 Wacker Siltronic Halbleitermat Verfahren zum Positionieren einer Werkstückhalterung
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
JPH08281550A (ja) * 1995-04-14 1996-10-29 Sony Corp 研磨装置及びその補正方法
US5718619A (en) * 1996-10-09 1998-02-17 Cmi International, Inc. Abrasive machining assembly
JPH10128654A (ja) * 1996-10-31 1998-05-19 Toshiba Corp Ｃｍｐ装置及び該ｃｍｐ装置に用いることのできる研磨布
US5816895A (en) * 1997-01-17 1998-10-06 Tokyo Seimitsu Co., Ltd. Surface grinding method and apparatus
US5975994A (en) * 1997-06-11 1999-11-02 Micron Technology, Inc. Method and apparatus for selectively conditioning a polished pad used in planarizng substrates
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
JP3001054B1 (ja) * 1998-06-29 2000-01-17 日本電気株式会社 研磨装置及び研磨パッドの表面調整方法
US6093088A (en) * 1998-06-30 2000-07-25 Nec Corporation Surface polishing machine

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001054862A1 (en) * 2000-01-28 2001-08-02 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
JP4831910B2 (ja) * 2000-01-28 2011-12-07 アプライド マテリアルズ インコーポレイテッド 半導体ウェーハの制御された研磨及びプレーナ化のためのシステム及び方法
KR100780977B1 (ko) * 2000-01-28 2007-11-29 램 리서치 코포레이션 반도체 웨이퍼의 제어식 폴리싱 및 평탄화 시스템과 방법
JP2003521117A (ja) * 2000-01-28 2003-07-08 ラム リサーチ コーポレイション 半導体ウェーハの制御された研磨及びプレーナ化のためのシステム及び方法
US6869337B2 (en) 2000-01-28 2005-03-22 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
WO2002016075A3 (en) * 2000-08-22 2002-08-15 Lam Res Corp Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
US6976903B1 (en) 2000-09-22 2005-12-20 Lam Research Corporation Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing
WO2002024410A1 (en) * 2000-09-22 2002-03-28 Lam Research Corporation Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
WO2002030618A1 (en) * 2000-10-06 2002-04-18 Lam Research Corporation Activated slurry cmp system and methods for implementing the same
US6503129B1 (en) 2000-10-06 2003-01-07 Lam Research Corporation Activated slurry CMP system and methods for implementing the same
WO2002031866A3 (en) * 2000-10-13 2002-09-06 Lam Res Corp Infrared end-point system for cmp
US6540587B1 (en) 2000-10-13 2003-04-01 Lam Research Corporation Infrared end-point detection system
WO2002053322A3 (en) * 2001-01-04 2003-05-01 Lam Res Corp System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
JP2008049430A (ja) * 2006-08-24 2008-03-06 Sumitomo Metal Mining Co Ltd ウエハーの研磨方法
JP2010064160A (ja) * 2008-09-09 2010-03-25 Okamoto Machine Tool Works Ltd 複合平面研削装置
JP2010137338A (ja) * 2008-12-12 2010-06-24 Disco Abrasive Syst Ltd ウエーハの研削方法および研削装置
JP2015155131A (ja) * 2014-02-21 2015-08-27 旭精機工業株式会社 ばね研削装置
JP2021112820A (ja) * 2017-02-27 2021-08-05 株式会社東京精密 研削装置
JP7079871B2 (ja) 2017-02-27 2022-06-02 株式会社東京精密 研削装置
CN113814832A (zh) * 2021-11-23 2021-12-21 杭州中欣晶圆半导体股份有限公司 一种改善大尺寸硅单晶外延厚度均匀性的装置及操作方法
CN113814832B (zh) * 2021-11-23 2022-03-18 杭州中欣晶圆半导体股份有限公司 一种改善大尺寸硅单晶外延厚度均匀性的装置及操作方法

Also Published As

Publication number Publication date
US6402588B1 (en) 2002-06-11

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