JP2000015557A5 - - Google Patents

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Publication number
JP2000015557A5
JP2000015557A5 JP1999086871A JP8687199A JP2000015557A5 JP 2000015557 A5 JP2000015557 A5 JP 2000015557A5 JP 1999086871 A JP1999086871 A JP 1999086871A JP 8687199 A JP8687199 A JP 8687199A JP 2000015557 A5 JP2000015557 A5 JP 2000015557A5
Authority
JP
Japan
Prior art keywords
polished
grindstone
grinding wheel
dresser
polishing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999086871A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000015557A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP8687199A priority Critical patent/JP2000015557A/ja
Priority claimed from JP8687199A external-priority patent/JP2000015557A/ja
Priority to US09/300,383 priority patent/US6402588B1/en
Publication of JP2000015557A publication Critical patent/JP2000015557A/ja
Publication of JP2000015557A5 publication Critical patent/JP2000015557A5/ja
Pending legal-status Critical Current

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JP8687199A 1998-04-27 1999-03-29 研磨装置 Pending JP2000015557A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8687199A JP2000015557A (ja) 1998-04-27 1999-03-29 研磨装置
US09/300,383 US6402588B1 (en) 1998-04-27 1999-04-27 Polishing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-116744 1998-04-27
JP11674498 1998-04-27
JP8687199A JP2000015557A (ja) 1998-04-27 1999-03-29 研磨装置

Publications (2)

Publication Number Publication Date
JP2000015557A JP2000015557A (ja) 2000-01-18
JP2000015557A5 true JP2000015557A5 (enExample) 2004-12-02

Family

ID=26427946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8687199A Pending JP2000015557A (ja) 1998-04-27 1999-03-29 研磨装置

Country Status (2)

Country Link
US (1) US6402588B1 (enExample)
JP (1) JP2000015557A (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000005988A (ja) * 1998-04-24 2000-01-11 Ebara Corp 研磨装置
US6547651B1 (en) * 1999-11-10 2003-04-15 Strasbaugh Subaperture chemical mechanical planarization with polishing pad conditioning
US6340326B1 (en) * 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6705930B2 (en) 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US7481695B2 (en) * 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
WO2002024410A1 (en) * 2000-09-22 2002-03-28 Lam Research Corporation Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
US6503129B1 (en) * 2000-10-06 2003-01-07 Lam Research Corporation Activated slurry CMP system and methods for implementing the same
US6540587B1 (en) * 2000-10-13 2003-04-01 Lam Research Corporation Infrared end-point detection system
US6726527B2 (en) * 2001-06-08 2004-04-27 Edward A. Lalli Automatic disc repair system
US7930058B2 (en) * 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7473162B1 (en) 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
JP5007791B2 (ja) * 2006-08-24 2012-08-22 住友金属鉱山株式会社 ウエハーの研磨方法
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
JP5329877B2 (ja) * 2008-09-09 2013-10-30 株式会社岡本工作機械製作所 被研削材の複合研削方法
JP5331470B2 (ja) * 2008-12-12 2013-10-30 株式会社ディスコ ウエーハの研削方法および研削装置
JP4960395B2 (ja) * 2009-03-17 2012-06-27 株式会社東芝 研磨装置とそれを用いた半導体装置の製造方法
JP6088919B2 (ja) * 2013-06-28 2017-03-01 株式会社東芝 半導体装置の製造方法
JP6341687B2 (ja) * 2014-02-21 2018-06-13 旭精機工業株式会社 ばね研削装置
JP6243255B2 (ja) * 2014-02-25 2017-12-06 光洋機械工業株式会社 ワークの平面研削方法
US9987724B2 (en) * 2014-07-18 2018-06-05 Applied Materials, Inc. Polishing system with pad carrier and conditioning station
SG10201906815XA (en) 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
CN105619243B (zh) * 2016-01-05 2017-08-29 京东方科技集团股份有限公司 研磨刀头及研磨装置
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
JP6869051B2 (ja) * 2017-02-27 2021-05-12 株式会社東京精密 研削装置
CN113814832B (zh) * 2021-11-23 2022-03-18 杭州中欣晶圆半导体股份有限公司 一种改善大尺寸硅单晶外延厚度均匀性的装置及操作方法

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US3872626A (en) * 1973-05-02 1975-03-25 Cone Blanchard Machine Co Grinding machine with tilting table
DE3306246C2 (de) * 1983-02-23 1984-12-06 Maschinenfabrik Ernst Thielenhaus GmbH, 5600 Wuppertal Werkstückaufnahme zum Feinschleifen von zumindest bereichsweise kreiszylindrischen oder topfförmig ausgebildeten Werkstücken
DE3585200D1 (de) * 1984-10-15 1992-02-27 Nissei Ind Co Flachschleifmaschine.
JPS61168462A (ja) 1985-01-18 1986-07-30 Hitachi Ltd ウエハ研削装置
EP0272531B1 (en) * 1986-12-08 1991-07-31 Sumitomo Electric Industries Limited Surface grinding machine
CA2012878C (en) * 1989-03-24 1995-09-12 Masanori Nishiguchi Apparatus for grinding semiconductor wafer
JPH05138512A (ja) 1991-11-12 1993-06-01 Disco Abrasive Syst Ltd 研削装置
JP3024417B2 (ja) * 1992-02-12 2000-03-21 住友金属工業株式会社 研磨装置
JPH05305561A (ja) * 1992-05-01 1993-11-19 Sumitomo Electric Ind Ltd 窒化ケイ素系セラミックスの研削加工方法及びその加工製品
DE69306049T2 (de) * 1992-06-19 1997-03-13 Rikagaku Kenkyusho Vorrichtung zum Schleifen von Spiegeloberfläche
DE4335980C2 (de) * 1993-10-21 1998-09-10 Wacker Siltronic Halbleitermat Verfahren zum Positionieren einer Werkstückhalterung
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
JPH08281550A (ja) * 1995-04-14 1996-10-29 Sony Corp 研磨装置及びその補正方法
US5718619A (en) * 1996-10-09 1998-02-17 Cmi International, Inc. Abrasive machining assembly
JPH10128654A (ja) * 1996-10-31 1998-05-19 Toshiba Corp Ｃｍｐ装置及び該ｃｍｐ装置に用いることのできる研磨布
US5816895A (en) * 1997-01-17 1998-10-06 Tokyo Seimitsu Co., Ltd. Surface grinding method and apparatus
US5975994A (en) * 1997-06-11 1999-11-02 Micron Technology, Inc. Method and apparatus for selectively conditioning a polished pad used in planarizng substrates
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
JP3001054B1 (ja) * 1998-06-29 2000-01-17 日本電気株式会社 研磨装置及び研磨パッドの表面調整方法
US6093088A (en) * 1998-06-30 2000-07-25 Nec Corporation Surface polishing machine

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