|
US6634800B2
(en)
*
|
2000-04-27 |
2003-10-21 |
Furukawa Electric Co., Ltd. |
Ferrule for optical connector
|
|
USD541232S1
(en)
*
|
2005-12-19 |
2007-04-24 |
Zalman Tech Co., Ltd. |
Radiator for electronic parts
|
|
USD561711S1
(en)
*
|
2006-12-08 |
2008-02-12 |
Thermaltake Technology Co., Ltd. |
Heat sink
|
|
USD561710S1
(en)
*
|
2007-01-03 |
2008-02-12 |
Thermaltake Technology Co., Ltd. |
Heat sink
|
|
USD587217S1
(en)
|
2007-12-30 |
2009-02-24 |
Zalman Tech Co., Ltd. |
Radiator for a graphics card chipset
|
|
TWD125793S1
(zh)
*
|
2008-01-07 |
2008-11-01 |
訊凱國際股份有限公司 |
散熱器
|
|
CN201229544Y
(zh)
*
|
2008-07-03 |
2009-04-29 |
鸿富锦精密工业（深圳）有限公司 |
具改良型散热结构的计算机
|
|
US20100206521A1
(en)
*
|
2009-02-17 |
2010-08-19 |
Aacotek Company Limited |
Heat dissipating fin and heat sink
|
|
US20100270007A1
(en)
|
2009-04-23 |
2010-10-28 |
Wen-Te Lin |
Heat sink
|
|
US20110192026A1
(en)
|
2010-02-11 |
2011-08-11 |
Shyh-Ming Chen |
Press fitting method for heat pipe and heat sink
|
|
KR101217224B1
(ko)
|
2010-05-24 |
2012-12-31 |
아이스파이프 주식회사 |
전자기기용 방열장치
|
|
US8695687B2
(en)
|
2010-12-10 |
2014-04-15 |
Palo Alto Research Center Incorporated |
Hybrid pin-fin micro heat pipe heat sink and method of fabrication
|
|
USD660256S1
(en)
|
2011-02-25 |
2012-05-22 |
Zalman Tech Co., Ltd. |
Radiator for an electronic device
|
|
TWD164333S
(zh)
|
2013-08-06 |
2014-11-21 |
富士通股份有限公司 |
用於電子元件之散熱器
|
|
TW201506479A
(zh)
*
|
2013-08-08 |
2015-02-16 |
Hon Hai Prec Ind Co Ltd |
光纖連接器
|
|
USD722573S1
(en)
|
2013-11-26 |
2015-02-17 |
Heatscape, Inc. |
U-shaped condenser heat sink for low profile modules
|
|
USD715750S1
(en)
|
2013-11-26 |
2014-10-21 |
Kilpatrick Townsend & Stockton Llp |
Power heat sink with imbedded fly cut heat pipes
|
|
JP1537917S
(fr)
*
|
2014-12-19 |
2015-11-16 |
|
|
|
TWI613414B
(zh)
|
2015-04-13 |
2018-02-01 |
|
具有分隔雙層部份重疊熱管之散熱結構
|
|
US20160313067A1
(en)
|
2015-04-27 |
2016-10-27 |
Cooler Master Co., Ltd. |
Heat dissipating device and heat dissipating fin
|
|
JP6117288B2
(ja)
|
2015-07-14 |
2017-04-19 |
古河電気工業株式会社 |
冷却装置
|
|
US11867467B2
(en)
|
2015-07-14 |
2024-01-09 |
Furukawa Electric Co., Ltd. |
Cooling device with superimposed fin groups
|
|
US11573377B2
(en)
*
|
2015-10-12 |
2023-02-07 |
3M Innovative Properties Company |
Optical waveguide positioning feature in a multiple waveguides connector
|
|
USD805042S1
(en)
|
2015-10-27 |
2017-12-12 |
Tsung-Hsien Huang |
Combined heat exchanger base and embedded heat pipes
|
|
USD795821S1
(en)
*
|
2016-02-22 |
2017-08-29 |
Heatscape.Com, Inc. |
Liquid cooling cold plate with diamond cut pin fins
|
|
USD803169S1
(en)
*
|
2016-02-22 |
2017-11-21 |
Heatscape.Com, Inc. |
Combined liquid cooling cold plate and vapor chamber
|
|
CN105873415A
(zh)
*
|
2016-04-26 |
2016-08-17 |
东莞汉旭五金塑胶科技有限公司 |
散热器的基座与热导管组合
|
|
TWD181170S
(zh)
|
2016-07-22 |
2017-02-01 |
黃崇賢 |
散熱器(1)
|
|
US20190170446A1
(en)
|
2017-12-06 |
2019-06-06 |
Forcecon Technology Co., Ltd. |
Multi-tube parallel heat spreader
|
|
CN212673920U
(zh)
|
2017-12-28 |
2021-03-09 |
古河电气工业株式会社 |
散热器
|
|
WO2019151291A1
(fr)
|
2018-01-31 |
2019-08-08 |
古河電気工業株式会社 |
Dissipateur thermique
|
|
US11013146B2
(en)
|
2018-02-27 |
2021-05-18 |
Ciena Corporation |
Asymmetric heat pipe coupled to a heat sink
|
|
USD905647S1
(en)
|
2018-07-20 |
2020-12-22 |
Heatscape.Com, Inc. |
Combination heat pipe and heat sink
|
|
JP6606267B1
(ja)
|
2018-12-28 |
2019-11-13 |
古河電気工業株式会社 |
ヒートシンク
|
|
DE102019114885B3
(de)
|
2019-06-03 |
2020-08-13 |
Karl Storz Se & Co. Kg |
Vorrichtung zur Wärmeableitung aus einer endoskopischen Beleuchtungseinrichtung
|