JP1638282S - - Google Patents
Info
- Publication number
- JP1638282S JP1638282S JPD2018-20434F JP2018020434F JP1638282S JP 1638282 S JP1638282 S JP 1638282S JP 2018020434 F JP2018020434 F JP 2018020434F JP 1638282 S JP1638282 S JP 1638282S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-20434F JP1638282S (enExample) | 2018-09-20 | 2018-09-20 | |
| TW107306772F TWD197468S (zh) | 2018-09-20 | 2018-11-19 | 基板處理裝置用晶舟之部分 |
| US29/672,957 USD920935S1 (en) | 2018-09-20 | 2018-12-11 | Boat for substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-20434F JP1638282S (enExample) | 2018-09-20 | 2018-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1638282S true JP1638282S (enExample) | 2019-08-05 |
Family
ID=67474810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2018-20434F Active JP1638282S (enExample) | 2018-09-20 | 2018-09-20 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD920935S1 (enExample) |
| JP (1) | JP1638282S (enExample) |
| TW (1) | TWD197468S (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1078667S1 (en) | 2022-09-14 | 2025-06-10 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6915037B2 (ja) * | 2017-02-27 | 2021-08-04 | ミライアル株式会社 | 基板収納容器 |
| USD937791S1 (en) * | 2018-12-26 | 2021-12-07 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
| USD936025S1 (en) * | 2018-12-26 | 2021-11-16 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
| TWD202895S (zh) * | 2019-03-27 | 2020-02-21 | 家登精密工業股份有限公司 | 光罩盒組裝件 |
| USD954666S1 (en) * | 2019-05-03 | 2022-06-14 | Lumileds Holding B.V. | Flexible circuit board |
| JP1678278S (ja) * | 2020-03-19 | 2021-02-01 | 基板処理装置用ボート | |
| JP1731670S (ja) * | 2022-03-04 | 2025-12-15 | 基板処理装置用基板保持具 | |
| JP1731673S (ja) * | 2022-05-30 | 2025-12-15 | 半導体製造装置用反応管のインナー管 | |
| JP1731675S (ja) * | 2022-05-30 | 2025-12-15 | 半導体製造装置用反応管のインナー管 | |
| JP1731674S (ja) * | 2022-05-30 | 2025-12-15 | 半導体製造装置用反応管のインナー管 | |
| JP1741512S (enExample) * | 2022-09-14 | 2023-04-11 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD655682S1 (en) * | 2010-06-18 | 2012-03-13 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
| USD655255S1 (en) * | 2010-06-18 | 2012-03-06 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
| US9153466B2 (en) * | 2012-04-26 | 2015-10-06 | Asm Ip Holding B.V. | Wafer boat |
| TWD161688S (zh) * | 2012-12-27 | 2014-07-11 | 日立國際電氣股份有限公司 | 半導體製造裝置用晶舟 |
| TWD166332S (zh) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟之部分 |
| TWD163542S (zh) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟 |
| TWD165429S (zh) * | 2013-07-29 | 2015-01-11 | 日立國際電氣股份有限公司 | 半導體製造裝置用晶舟 |
| TWD167988S (zh) * | 2013-07-29 | 2015-05-21 | 日立國際電氣股份有限公司 | 半導體製造裝置用晶舟 |
| TWD168827S (zh) * | 2013-07-29 | 2015-07-01 | 日立國際電氣股份有限公司 | 半導體製造裝置用晶舟 |
| US9343304B2 (en) * | 2014-09-26 | 2016-05-17 | Asm Ip Holding B.V. | Method for depositing films on semiconductor wafers |
| JP1537629S (enExample) * | 2014-11-20 | 2015-11-09 | ||
| JP1537313S (enExample) * | 2014-11-20 | 2015-11-09 | ||
| JP1537312S (enExample) * | 2014-11-20 | 2015-11-09 | ||
| JP1537630S (enExample) * | 2014-11-20 | 2015-11-09 | ||
| JP1563649S (enExample) * | 2016-02-12 | 2016-11-21 | ||
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| JP1584784S (enExample) * | 2017-01-31 | 2017-08-28 | ||
| JP1584241S (enExample) * | 2017-01-31 | 2017-08-21 | ||
| JP1605462S (enExample) * | 2017-08-10 | 2021-05-31 | ||
| JP1597807S (enExample) * | 2017-08-21 | 2018-02-19 | ||
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
-
2018
- 2018-09-20 JP JPD2018-20434F patent/JP1638282S/ja active Active
- 2018-11-19 TW TW107306772F patent/TWD197468S/zh unknown
- 2018-12-11 US US29/672,957 patent/USD920935S1/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1078667S1 (en) | 2022-09-14 | 2025-06-10 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| USD920935S1 (en) | 2021-06-01 |
| TWD197468S (zh) | 2019-05-11 |
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