ITTO960415A0 - Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti stampatimultistrato. - Google Patents

Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti stampatimultistrato.

Info

Publication number
ITTO960415A0
ITTO960415A0 ITTO960415A ITTO960415A ITTO960415A0 IT TO960415 A0 ITTO960415 A0 IT TO960415A0 IT TO960415 A ITTO960415 A IT TO960415A IT TO960415 A ITTO960415 A IT TO960415A IT TO960415 A0 ITTO960415 A0 IT TO960415A0
Authority
IT
Italy
Prior art keywords
equipment
printed circuit
control
layer printed
related method
Prior art date
Application number
ITTO960415A
Other languages
English (en)
Original Assignee
Pluritec Italia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pluritec Italia filed Critical Pluritec Italia
Priority to IT96TO000415A priority Critical patent/IT1285334B1/it
Publication of ITTO960415A0 publication Critical patent/ITTO960415A0/it
Priority to US08/856,793 priority patent/US6015249A/en
Priority to EP97107952A priority patent/EP0808087A3/en
Priority to JP9127034A priority patent/JPH1058284A/ja
Publication of ITTO960415A1 publication Critical patent/ITTO960415A1/it
Application granted granted Critical
Publication of IT1285334B1 publication Critical patent/IT1285334B1/it
Priority to US09/572,916 priority patent/US6309151B1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25Movable or adjustable work or tool supports
    • B23Q1/44Movable or adjustable work or tool supports using particular mechanisms
    • B23Q1/56Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism
    • B23Q1/58Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism a single sliding pair
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • B23Q17/2233Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the tool relative to the workpiece
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/26Measuring arrangements characterised by the use of electric or magnetic techniques for measuring depth
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00Cutting by use of rotating axially moving tool
    • Y10T408/03Processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00Cutting by use of rotating axially moving tool
    • Y10T408/16Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor
    • Y10T408/17Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor to control infeed
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00Cutting by use of rotating axially moving tool
    • Y10T408/16Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor
    • Y10T408/175Cutting by use of rotating axially moving tool with control means energized in response to activator stimulated by condition sensor to control relative positioning of Tool and work
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00Cutting by use of rotating axially moving tool
    • Y10T408/55Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
    • Y10T408/561Having tool-opposing, work-engaging surface
    • Y10T408/5623Having tool-opposing, work-engaging surface with presser foot
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00Gear cutting, milling, or planing
    • Y10T409/30Milling
    • Y10T409/303752Process
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00Gear cutting, milling, or planing
    • Y10T409/30Milling
    • Y10T409/306664Milling including means to infeed rotary cutter toward work
    • Y10T409/306776Axially
    • Y10T409/306832Axially with infeed control means energized in response to activator stimulated by condition sensor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00Gear cutting, milling, or planing
    • Y10T409/30Milling
    • Y10T409/306664Milling including means to infeed rotary cutter toward work
    • Y10T409/307224Milling including means to infeed rotary cutter toward work with infeed control means energized in response to activator stimulated by condition sensor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00Gear cutting, milling, or planing
    • Y10T409/30Milling
    • Y10T409/308624Milling with limit means to aid in positioning of cutter bit or work [e.g., gauge, stop, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
  • Supply And Installment Of Electrical Components (AREA)
IT96TO000415A 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti IT1285334B1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT96TO000415A IT1285334B1 (it) 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti
US08/856,793 US6015249A (en) 1996-05-17 1997-05-15 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards
EP97107952A EP0808087A3 (en) 1996-05-17 1997-05-15 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards
JP9127034A JPH1058284A (ja) 1996-05-17 1997-05-16 多層印刷回路板の切削機械の切削深さ制御装置及び制御方法
US09/572,916 US6309151B1 (en) 1996-05-17 1999-10-19 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT96TO000415A IT1285334B1 (it) 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti

Publications (3)

Publication Number Publication Date
ITTO960415A0 true ITTO960415A0 (it) 1996-05-17
ITTO960415A1 ITTO960415A1 (it) 1997-11-17
IT1285334B1 IT1285334B1 (it) 1998-06-03

Family

ID=11414642

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96TO000415A IT1285334B1 (it) 1996-05-17 1996-05-17 Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti

Country Status (4)

Country Link
US (2) US6015249A (it)
EP (1) EP0808087A3 (it)
JP (1) JPH1058284A (it)
IT (1) IT1285334B1 (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114900966A (zh) * 2022-05-19 2022-08-12 深圳崇达多层线路板有限公司 电路板近孔背钻方法、电路板、通讯电子设备及加工装置
CN116546727A (zh) * 2023-05-04 2023-08-04 江西景旺精密电路有限公司 一种增加弯折能力以及控深精度的半刚挠产品控深铣工艺

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IT1285334B1 (it) * 1996-05-17 1998-06-03 Pluritec Italia Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti
FR2774617B1 (fr) * 1998-02-06 2000-05-05 St Microelectronics Sa Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne
US6199290B1 (en) * 1999-07-30 2001-03-13 Excellon Automation Co. Method and apparatus for automatic loading and registration of PCBs
WO2002057047A1 (en) * 2001-01-16 2002-07-25 Tyco Electronics Corporation Circuit board router apparatus and method thereof
US6550118B2 (en) * 2001-02-02 2003-04-22 Electroimpact, Inc. Apparatus and method for accurate countersinking and rivet shaving for mechanical assembly operations
US6651866B2 (en) * 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US20030115757A1 (en) * 2001-10-26 2003-06-26 Claudio Meisser Method and equipment for stripping a flat cable
US6745611B2 (en) 2002-02-19 2004-06-08 Fci Americas Technology, Inc. Battery powered hydraulic tool
WO2003070423A1 (en) * 2002-02-22 2003-08-28 Ballado Investments Inc. Workpiece clamp with two alternately applicable compression rings
US7351018B2 (en) * 2003-06-02 2008-04-01 Novator Ab Method and apparatus for measuring a depth of holes in composite-material workpieces being machined by an orbiting cutting tool
JP4180476B2 (ja) * 2003-09-09 2008-11-12 日立ビアメカニクス株式会社 ワーク押さえを備える主軸装置
CN101547563A (zh) * 2003-09-19 2009-09-30 通道系统集团公司 闭合反钻系统
JP4367854B2 (ja) * 2004-06-01 2009-11-18 日立ビアメカニクス株式会社 プリント基板の穴あけ方法およびプリント基板加工機
US7625158B2 (en) * 2006-09-22 2009-12-01 Murray Houlton Forlong Clamping assembly
US8047749B2 (en) * 2007-08-30 2011-11-01 The Boeing Company Rapid inspection of lightning strike protection systems prior to installing fastener
US8668410B1 (en) * 2009-11-13 2014-03-11 The Boeing Company Drilling system stabilization
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IT1401067B1 (it) * 2010-07-26 2013-07-12 Cover Technology S R L Macchina fresatrice
JP5583555B2 (ja) * 2010-11-09 2014-09-03 ビアメカニクス株式会社 加工装置
US9199351B2 (en) * 2011-05-09 2015-12-01 The Boeing Company Drilling machine having hole measurement capability
CN102883536B (zh) * 2012-09-29 2015-12-02 杭州华三通信技术有限公司 一种pcb板通孔加工方法及通孔结构
JP6023574B2 (ja) * 2012-12-10 2016-11-09 ビアメカニクス株式会社 基板穴明け装置及び基板穴明け方法
DE102013004679B4 (de) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Vorrichtung und Verfahren zum Bearbeiten von Leiterplatten
CN103776361B (zh) * 2014-01-15 2017-01-04 中钞信用卡产业发展有限公司 一种双界面卡内天线的深度检测装置及检测方法
CN103791808B (zh) * 2014-02-26 2017-02-15 广州明森科技股份有限公司 一种双界面卡内天线的深度检测装置及检测方法
US9341670B2 (en) 2014-05-20 2016-05-17 International Business Machines Corporation Residual material detection in backdrilled stubs
US20150359110A1 (en) * 2014-06-06 2015-12-10 Keysight Technologies, Inc. Inner layer depth detection during controlled-depth drilling using continuity test coupon
EP2987576A1 (de) * 2014-08-19 2016-02-24 Skybrain Vermögensverwaltungs GmbH Verfahren zur Herstellung einer Bohrung und Bohrmaschine hierfür
US10237983B2 (en) * 2014-12-23 2019-03-19 Sanmina Corporation Method for forming hole plug
CN104764395A (zh) * 2015-03-27 2015-07-08 深圳崇达多层线路板有限公司 一种印制电路板的切割深度测试方法及电路板
JP6485774B2 (ja) * 2015-11-11 2019-03-20 大船企業日本株式会社 多層プリント配線基板におけるバックドリル加工方法及び基板加工装置
JP7386034B2 (ja) * 2018-12-11 2023-11-24 ビアメカニクス株式会社 ドリル加工装置及びドリル加工方法
US11690177B2 (en) 2020-04-07 2023-06-27 Nextgin Technology Bv Methods and systems for back-drilling a multi-layer circuit board
CN112804825B (zh) * 2021-04-09 2021-09-14 苏州维嘉科技股份有限公司 控深钻孔的补偿方法和钻孔设备

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114900966A (zh) * 2022-05-19 2022-08-12 深圳崇达多层线路板有限公司 电路板近孔背钻方法、电路板、通讯电子设备及加工装置
CN116546727A (zh) * 2023-05-04 2023-08-04 江西景旺精密电路有限公司 一种增加弯折能力以及控深精度的半刚挠产品控深铣工艺

Also Published As

Publication number Publication date
EP0808087A2 (en) 1997-11-19
EP0808087A3 (en) 1998-09-09
IT1285334B1 (it) 1998-06-03
JPH1058284A (ja) 1998-03-03
US6015249A (en) 2000-01-18
ITTO960415A1 (it) 1997-11-17
US6309151B1 (en) 2001-10-30

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