ITMI20041636A1 - Modulo di memoria con schede circuitali a chip di memoria - Google Patents

Modulo di memoria con schede circuitali a chip di memoria

Info

Publication number
ITMI20041636A1
ITMI20041636A1 IT001636A ITMI20041636A ITMI20041636A1 IT MI20041636 A1 ITMI20041636 A1 IT MI20041636A1 IT 001636 A IT001636 A IT 001636A IT MI20041636 A ITMI20041636 A IT MI20041636A IT MI20041636 A1 ITMI20041636 A1 IT MI20041636A1
Authority
IT
Italy
Prior art keywords
memory
circuit boards
chip circuit
memory module
memory chip
Prior art date
Application number
IT001636A
Other languages
English (en)
Inventor
Jeong-Hyeon Cho
Jae-Jun Lee
Jung-Joon Lee
Byung-Se So
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of ITMI20041636A1 publication Critical patent/ITMI20041636A1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/06—Address interface arrangements, e.g. address buffers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Combinations Of Printed Boards (AREA)
  • Dram (AREA)
IT001636A 2003-08-13 2004-08-06 Modulo di memoria con schede circuitali a chip di memoria ITMI20041636A1 (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020030056012A KR100585099B1 (ko) 2003-08-13 2003-08-13 적층형 메모리 모듈 및 메모리 시스템.
US10/853,353 US7072201B2 (en) 2003-08-13 2004-05-26 Memory module

Publications (1)

Publication Number Publication Date
ITMI20041636A1 true ITMI20041636A1 (it) 2004-11-06

Family

ID=34132178

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001636A ITMI20041636A1 (it) 2003-08-13 2004-08-06 Modulo di memoria con schede circuitali a chip di memoria

Country Status (3)

Country Link
US (1) US7072201B2 (it)
KR (1) KR100585099B1 (it)
IT (1) ITMI20041636A1 (it)

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US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
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US9542352B2 (en) * 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
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US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
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DE10250156A1 (de) * 2002-10-28 2004-05-13 Infineon Technologies Ag Speichermodul und Speicheranordnung mit abzweigfreien Signalleitungen und verteilten kapazitiven Lasten

Also Published As

Publication number Publication date
US7072201B2 (en) 2006-07-04
KR100585099B1 (ko) 2006-05-30
US20050036350A1 (en) 2005-02-17
KR20050017353A (ko) 2005-02-22

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