FR2867892B3 - Module memoire - Google Patents

Module memoire

Info

Publication number
FR2867892B3
FR2867892B3 FR0412496A FR0412496A FR2867892B3 FR 2867892 B3 FR2867892 B3 FR 2867892B3 FR 0412496 A FR0412496 A FR 0412496A FR 0412496 A FR0412496 A FR 0412496A FR 2867892 B3 FR2867892 B3 FR 2867892B3
Authority
FR
France
Prior art keywords
memory module
module
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0412496A
Other languages
English (en)
Other versions
FR2867892A3 (fr
Inventor
Shih Hsiung Lien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Optimum Care International Tech Inc
Original Assignee
Optimum Care International Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optimum Care International Tech Inc filed Critical Optimum Care International Tech Inc
Publication of FR2867892A3 publication Critical patent/FR2867892A3/fr
Application granted granted Critical
Publication of FR2867892B3 publication Critical patent/FR2867892B3/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Combinations Of Printed Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR0412496A 2003-11-27 2004-11-25 Module memoire Expired - Fee Related FR2867892B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092221015U TWM257001U (en) 2003-11-27 2003-11-27 Improved memory module

Publications (2)

Publication Number Publication Date
FR2867892A3 FR2867892A3 (fr) 2005-09-23
FR2867892B3 true FR2867892B3 (fr) 2006-02-10

Family

ID=34114788

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0412496A Expired - Fee Related FR2867892B3 (fr) 2003-11-27 2004-11-25 Module memoire

Country Status (5)

Country Link
US (1) US7119436B2 (fr)
DE (1) DE202004018336U1 (fr)
FR (1) FR2867892B3 (fr)
NL (1) NL1027613C2 (fr)
TW (1) TWM257001U (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM256569U (en) * 2003-12-09 2005-02-01 Optimum Care Int Tech Inc Memory module device
JP2009096523A (ja) * 2007-10-17 2009-05-07 Panasonic Corp 電子部品の搬送フレームおよび電子部品の製造方法
KR101466236B1 (ko) * 2008-06-13 2014-11-28 삼성전자주식회사 반도체 모듈
AT12320U1 (de) * 2009-09-03 2012-03-15 Austria Tech & System Tech Verfahren zum verbinden einer mehrzahl von elementen einer leiterplatte, leiterplatte sowie verwendung eines derartigen verfahrens
DE102010062308A1 (de) * 2010-12-01 2012-06-06 BSH Bosch und Siemens Hausgeräte GmbH Elektrische Baugruppe
USD709894S1 (en) * 2012-09-22 2014-07-29 Apple Inc. Electronic device
DE202014100686U1 (de) * 2014-02-17 2015-06-01 Zumtobel Lighting Gmbh Leiterplatte mit speziellen Kupplungsbereichen
DE102014008148B4 (de) * 2014-05-23 2020-06-04 Continental Automotive Gmbh Verfahren zur Herstellung einer Leiterplatte und Leiterplatte
CN114512413B (zh) * 2022-04-21 2022-07-12 威海三维曲板智能装备有限公司 一种结合紧密的管芯堆叠体及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2978511B2 (ja) * 1989-09-20 1999-11-15 株式会社日立製作所 集積回路素子実装構造体
US5497027A (en) * 1993-11-30 1996-03-05 At&T Global Information Solutions Company Multi-chip module packaging system
TW492114B (en) * 2000-06-19 2002-06-21 Advantest Corp Method and apparatus for edge connection between elements of an integrated circuit
US6911730B1 (en) * 2003-03-03 2005-06-28 Xilinx, Inc. Multi-chip module including embedded transistors within the substrate

Also Published As

Publication number Publication date
FR2867892A3 (fr) 2005-09-23
US20050127368A1 (en) 2005-06-16
DE202004018336U1 (de) 2005-01-27
NL1027613C2 (nl) 2006-06-27
JP3108979U (ja) 2005-04-28
US7119436B2 (en) 2006-10-10
TWM257001U (en) 2005-02-11
NL1027613A1 (nl) 2005-05-30

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090731