ITMI20020831A1 - Dispositivo di montaggio di componenti elettrici e/oppure elettronicisu una piastra circuitale - Google Patents

Dispositivo di montaggio di componenti elettrici e/oppure elettronicisu una piastra circuitale

Info

Publication number
ITMI20020831A1
ITMI20020831A1 IT2002MI000831A ITMI20020831A ITMI20020831A1 IT MI20020831 A1 ITMI20020831 A1 IT MI20020831A1 IT 2002MI000831 A IT2002MI000831 A IT 2002MI000831A IT MI20020831 A ITMI20020831 A IT MI20020831A IT MI20020831 A1 ITMI20020831 A1 IT MI20020831A1
Authority
IT
Italy
Prior art keywords
electrical
electronic components
mounting device
circuit plate
circuit
Prior art date
Application number
IT2002MI000831A
Other languages
English (en)
Inventor
Kurt Gross
Michael Kirchberger
Gunter Ludwig
Volker Karrer
Stefan Kulig
Hans Rappl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ITMI20020831A0 publication Critical patent/ITMI20020831A0/it
Publication of ITMI20020831A1 publication Critical patent/ITMI20020831A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
IT2002MI000831A 2001-04-27 2002-04-19 Dispositivo di montaggio di componenti elettrici e/oppure elettronicisu una piastra circuitale ITMI20020831A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10120692A DE10120692B4 (de) 2001-04-27 2001-04-27 Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte

Publications (2)

Publication Number Publication Date
ITMI20020831A0 ITMI20020831A0 (it) 2002-04-19
ITMI20020831A1 true ITMI20020831A1 (it) 2003-10-20

Family

ID=7682944

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2002MI000831A ITMI20020831A1 (it) 2001-04-27 2002-04-19 Dispositivo di montaggio di componenti elettrici e/oppure elettronicisu una piastra circuitale

Country Status (4)

Country Link
US (1) US6723926B2 (it)
DE (1) DE10120692B4 (it)
FR (1) FR2824231B1 (it)
IT (1) ITMI20020831A1 (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004032161A1 (de) * 2002-09-27 2004-04-15 Epcos Ag Elektrisches bauelement und anordnung mit dem bauelement
US6936502B2 (en) * 2003-05-14 2005-08-30 Nortel Networks Limited Package modification for channel-routed circuit boards
FI118781B (fi) * 2003-06-04 2008-03-14 Vacon Oyj Kondensaattorin kiinnitys- ja suojajärjestely
JP4161877B2 (ja) * 2003-11-05 2008-10-08 住友電装株式会社 回路構成体、その製造方法及び配電ユニット
JP2006054260A (ja) * 2004-08-10 2006-02-23 Toshiba Corp 外部とのインターフェース機能を有するｌｓｉパッケージ、外部とのインターフェース機能を備えたｌｓｉパッケージを有する実装体、外部とのインターフェース機能を備えたｌｓｉパッケージを有する実装体の製造方法
US20060256533A1 (en) * 2005-05-13 2006-11-16 Lear Corporation Thermally dissipating and power dispersing adhesively bonded metal-printed circuit board structure
TWI348341B (en) * 2005-05-18 2011-09-01 Chunghwa Picture Tubes Ltd Electronic element module and electronic device using the same
DE102011109609B3 (de) 2011-08-05 2013-01-17 Peter Fischer Verfahren zum Herstellen eines induktionsarmen Busbar
US10539585B2 (en) 2014-10-09 2020-01-21 Continental Automotive Systems, Inc. Arrangement and method for connecting an electrical component to a leadframe
DE102014223791A1 (de) 2014-11-21 2016-05-25 Zf Friedrichshafen Ag Anordnung zur Kontaktierung eines elektrischen Bauelements an eine Leiterplatte
FR3043859B1 (fr) * 2015-11-13 2020-11-13 Valeo Systemes Thermiques Module de commande d'alimentation d'un moteur electrique
EP3506466B1 (en) * 2017-12-28 2021-03-10 SPAL Automotive S.r.l. Rotary electric machine

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE277165C (it)
US2502291A (en) * 1946-02-27 1950-03-28 Lawrence H Taylor Method for establishing electrical connections in electrical apparatus
US3013188A (en) * 1958-01-16 1961-12-12 Harry A Kohler Mechanically integrated circuit board and a method of making same by die forms
US3228091A (en) * 1960-12-30 1966-01-11 Bendix Corp Method of making printed circuit board
GB1250839A (it) * 1969-05-02 1971-10-20
DE2915240A1 (de) * 1978-06-28 1980-01-03 Mitsumi Electric Co Gedruckte schaltung
DE3003373A1 (de) * 1980-01-31 1981-08-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrische baueinheit mit einer leiterplatte
FR2638594B1 (fr) * 1988-11-03 1990-12-21 Cartier Systemes G Procede de realisation d'un circuit electrique de puissance monocouche ou multicouches, et circuit obtenu par ce procede
DD277165A1 (de) * 1988-11-15 1990-03-21 Koepenick Funkwerk Veb Anordnung zur waermeabfuehrung von elektronischen bauelementen mit definierter impedanz ihrer ein- und ausgaenge
DE3922485C1 (it) * 1989-07-08 1990-06-13 Doduco Gmbh + Co Dr. Eugen Duerrwaechter, 7530 Pforzheim, De
DE8909246U1 (de) * 1989-07-31 1989-09-21 Siemens AG, 1000 Berlin und 8000 München Induktionsarme Kondensatorbatterie
DE3930158C2 (de) * 1989-09-09 1997-12-18 Bosch Gmbh Robert Gleichrichtereinrichtung für Drehstromgeneratoren von Fahrzeugen
DE4007566C2 (de) * 1990-03-09 1998-07-16 Siemens Ag Leistungsverstärker für die Speisung einer Induktivität mit geschalteten Transistoren
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
DE4222068C1 (it) * 1992-07-04 1993-06-09 Abb Patent Gmbh, 6800 Mannheim, De
US5573172A (en) * 1993-11-08 1996-11-12 Sawtek, Inc. Surface mount stress relief hidden lead package device and method
JP3047735B2 (ja) * 1994-05-16 2000-06-05 住友電気工業株式会社 光受信モジュ−ルとその製造方法
JPH0818170A (ja) * 1994-06-28 1996-01-19 Honda Motor Co Ltd 配線基板
JP3533741B2 (ja) * 1995-02-07 2004-05-31 松下電器産業株式会社 アルミ電解コンデンサの製造方法
DE19535490A1 (de) * 1995-09-23 1997-03-27 Bosch Gmbh Robert Schaltungsplatine sowie Verfahren zum Herstellen einer Schaltungsplatine
EP0868838B1 (en) * 1996-09-24 2003-09-17 BC Components Holdings B.V. Passive component
US5875091A (en) * 1997-01-07 1999-02-23 Siemens Nixdorf Informationssysteme Aktiengesellschaft Busbars with filter capacitors
US5920458A (en) * 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
DE19859739A1 (de) * 1998-12-23 2000-07-06 Bosch Gmbh Robert Kühlvorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät
JP3740329B2 (ja) * 1999-09-02 2006-02-01 株式会社東芝 部品実装基板
DE19949141A1 (de) * 1999-10-12 2001-06-13 Bosch Gmbh Robert Multilayer-Anordnung

Also Published As

Publication number Publication date
US20020159238A1 (en) 2002-10-31
US6723926B2 (en) 2004-04-20
DE10120692A1 (de) 2002-11-21
FR2824231B1 (fr) 2005-08-05
DE10120692B4 (de) 2004-02-12
ITMI20020831A0 (it) 2002-04-19
FR2824231A1 (fr) 2002-10-31

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