IT980775B - Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivi ottenuti con il procedi mento - Google Patents

Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivi ottenuti con il procedi mento

Info

Publication number
IT980775B
IT980775B IT67984/73A IT6798473A IT980775B IT 980775 B IT980775 B IT 980775B IT 67984/73 A IT67984/73 A IT 67984/73A IT 6798473 A IT6798473 A IT 6798473A IT 980775 B IT980775 B IT 980775B
Authority
IT
Italy
Prior art keywords
devices
procedure
manufacture
semiconductive
devices obtained
Prior art date
Application number
IT67984/73A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT980775B publication Critical patent/IT980775B/it

Links

Classifications

    • H10P14/61—
    • H10W10/0121—
    • H10W10/0126—
    • H10W10/13—
    • H10W74/43—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/043—Dual dielectric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/114—Nitrides of silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/122—Polycrystalline
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/151—Simultaneous diffusion
IT67984/73A 1972-04-08 1973-04-05 Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivi ottenuti con il procedi mento IT980775B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204741A NL7204741A (enExample) 1972-04-08 1972-04-08

Publications (1)

Publication Number Publication Date
IT980775B true IT980775B (it) 1974-10-10

Family

ID=19815806

Family Applications (1)

Application Number Title Priority Date Filing Date
IT67984/73A IT980775B (it) 1972-04-08 1973-04-05 Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivi ottenuti con il procedi mento

Country Status (8)

Country Link
US (1) US3900350A (enExample)
JP (1) JPS5212070B2 (enExample)
AU (1) AU463001B2 (enExample)
CA (1) CA970478A (enExample)
FR (1) FR2179864B1 (enExample)
GB (1) GB1421212A (enExample)
IT (1) IT980775B (enExample)
NL (1) NL7204741A (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2409910C3 (de) * 1974-03-01 1979-03-15 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen einer Halbleiteranordnung
JPS5824951B2 (ja) * 1974-10-09 1983-05-24 ソニー株式会社 コウガクソウチ
JPS6022497B2 (ja) * 1974-10-26 1985-06-03 ソニー株式会社 半導体装置
JPS5187979A (ja) * 1975-01-31 1976-07-31 Hitachi Ltd Bunryosankabutsuryoikiojusuru handotaisochinoseizohoho
JPS5197385A (en) * 1975-02-21 1976-08-26 Handotaisochino seizohoho
US4044454A (en) * 1975-04-16 1977-08-30 Ibm Corporation Method for forming integrated circuit regions defined by recessed dielectric isolation
US3961999A (en) * 1975-06-30 1976-06-08 Ibm Corporation Method for forming recessed dielectric isolation with a minimized "bird's beak" problem
JPS5246784A (en) * 1975-10-11 1977-04-13 Hitachi Ltd Process for production of semiconductor device
JPS5253679A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Productin of semiconductor device
JPS5261972A (en) * 1975-11-18 1977-05-21 Mitsubishi Electric Corp Production of semiconductor device
JPS5922381B2 (ja) * 1975-12-03 1984-05-26 株式会社東芝 ハンドウタイソシノ セイゾウホウホウ
US4098618A (en) * 1977-06-03 1978-07-04 International Business Machines Corporation Method of manufacturing semiconductor devices in which oxide regions are formed by an oxidation mask disposed directly on a substrate damaged by ion implantation
US4401691A (en) * 1978-12-18 1983-08-30 Burroughs Corporation Oxidation of silicon wafers to eliminate white ribbon
US4269636A (en) * 1978-12-29 1981-05-26 Harris Corporation Method of fabricating self-aligned bipolar transistor process and device utilizing etching and self-aligned masking
JPS5645051A (en) * 1979-09-20 1981-04-24 Toshiba Corp Manufacture of semiconductor device
US4287661A (en) * 1980-03-26 1981-09-08 International Business Machines Corporation Method for making an improved polysilicon conductor structure utilizing reactive-ion etching and thermal oxidation
US4465705A (en) * 1980-05-19 1984-08-14 Matsushita Electric Industrial Co., Ltd. Method of making semiconductor devices
DE3174468D1 (en) * 1980-09-17 1986-05-28 Hitachi Ltd Semiconductor device and method of manufacturing the same
US4506435A (en) * 1981-07-27 1985-03-26 International Business Machines Corporation Method for forming recessed isolated regions
US4454646A (en) * 1981-08-27 1984-06-19 International Business Machines Corporation Isolation for high density integrated circuits
US4454647A (en) * 1981-08-27 1984-06-19 International Business Machines Corporation Isolation for high density integrated circuits
US4372033A (en) * 1981-09-08 1983-02-08 Ncr Corporation Method of making coplanar MOS IC structures
US4508757A (en) * 1982-12-20 1985-04-02 International Business Machines Corporation Method of manufacturing a minimum bird's beak recessed oxide isolation structure
JPS6054453A (ja) * 1983-09-05 1985-03-28 Oki Electric Ind Co Ltd 半導体集積回路装置の製造方法
US4541167A (en) * 1984-01-12 1985-09-17 Texas Instruments Incorporated Method for integrated circuit device isolation
US4612701A (en) * 1984-03-12 1986-09-23 Harris Corporation Method to reduce the height of the bird's head in oxide isolated processes
US4691222A (en) * 1984-03-12 1987-09-01 Harris Corporation Method to reduce the height of the bird's head in oxide isolated processes
US4630356A (en) * 1985-09-19 1986-12-23 International Business Machines Corporation Method of forming recessed oxide isolation with reduced steepness of the birds' neck
US4824795A (en) * 1985-12-19 1989-04-25 Siliconix Incorporated Method for obtaining regions of dielectrically isolated single crystal silicon
JPS6410644A (en) * 1987-07-02 1989-01-13 Mitsubishi Electric Corp Manufacture of semiconductor device
US5039625A (en) * 1990-04-27 1991-08-13 Mcnc Maximum areal density recessed oxide isolation (MADROX) process
KR960005556B1 (ko) * 1993-04-24 1996-04-26 삼성전자주식회사 반도체장치의 소자분리방법
JP4746639B2 (ja) * 2008-02-22 2011-08-10 株式会社東芝 半導体デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1147014A (en) * 1967-01-27 1969-04-02 Westinghouse Electric Corp Improvements in diffusion masking
NL169121C (nl) * 1970-07-10 1982-06-01 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een halfgeleiderlichaam, dat aan een oppervlak is voorzien van een althans ten dele in het halfgeleiderlichaam verzonken, door thermische oxydatie gevormd oxydepatroon.
US3719535A (en) * 1970-12-21 1973-03-06 Motorola Inc Hyperfine geometry devices and method for their fabrication
US3784847A (en) * 1972-10-10 1974-01-08 Gen Electric Dielectric strip isolation for jfet or mesfet depletion-mode bucket-brigade circuit

Also Published As

Publication number Publication date
JPS4917977A (enExample) 1974-02-16
GB1421212A (en) 1976-01-14
DE2317087A1 (de) 1973-10-18
NL7204741A (enExample) 1973-10-10
FR2179864B1 (enExample) 1976-09-10
US3900350A (en) 1975-08-19
AU5406473A (en) 1974-10-10
JPS5212070B2 (enExample) 1977-04-04
DE2317087B2 (de) 1976-11-04
AU463001B2 (en) 1975-07-10
FR2179864A1 (enExample) 1973-11-23
CA970478A (en) 1975-07-01

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