IT975162B - Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivo ottenuto con il procedi mento - Google Patents

Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivo ottenuto con il procedi mento

Info

Publication number
IT975162B
IT975162B IT70125/72A IT7012572A IT975162B IT 975162 B IT975162 B IT 975162B IT 70125/72 A IT70125/72 A IT 70125/72A IT 7012572 A IT7012572 A IT 7012572A IT 975162 B IT975162 B IT 975162B
Authority
IT
Italy
Prior art keywords
procedure
spositive
semiconductive
manufacturing
devices obtained
Prior art date
Application number
IT70125/72A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT975162B publication Critical patent/IT975162B/it

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/40—Transit-time diodes, e.g. IMPATT or TRAPATT diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N80/00—Bulk negative-resistance effect devices
    • H10N80/10—Gunn-effect devices
    • H10N80/107—Gunn diodes
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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Wire Bonding (AREA)
  • Drying Of Semiconductors (AREA)
IT70125/72A 1971-10-07 1972-10-04 Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivo ottenuto con il procedi mento IT975162B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7113746A NL7113746A (it) 1971-10-07 1971-10-07

Publications (1)

Publication Number Publication Date
IT975162B true IT975162B (it) 1974-07-20

Family

ID=19814192

Family Applications (1)

Application Number Title Priority Date Filing Date
IT70125/72A IT975162B (it) 1971-10-07 1972-10-04 Procedimento per la fabbricazione di dispositivi semiconduttori e di spositivo ottenuto con il procedi mento

Country Status (9)

Country Link
JP (1) JPS5323990B2 (it)
AU (1) AU4728572A (it)
CA (1) CA973975A (it)
CH (1) CH549870A (it)
DE (1) DE2248089A1 (it)
FR (1) FR2156123B1 (it)
GB (1) GB1403239A (it)
IT (1) IT975162B (it)
NL (1) NL7113746A (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039473A (it) * 1973-08-10 1975-04-11
FR2420208A1 (fr) * 1978-03-17 1979-10-12 Thomson Csf Procede de realisation collective d'une source d'ondes millimetriques de type preaccorde et source ainsi realisee
DE2824027C2 (de) * 1978-06-01 1985-03-28 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement und Verfahren zu seiner Herstellung
DE102022004377A1 (de) * 2022-11-23 2024-05-23 Azur Space Solar Power Gmbh Diodenanordnung
WO2025046878A1 (en) * 2023-08-31 2025-03-06 Nippon Telegraph And Telephone Corporation Reconfigurable intelligent surface module and method of manufacturing thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1333007A (fr) * 1962-02-16 1963-07-19 Intermetall Procédé de fabrication de transistors à haute fréquence et transistors conformesà ceux ainsi obtenus
US3509428A (en) * 1967-10-18 1970-04-28 Hughes Aircraft Co Ion-implanted impatt diode

Also Published As

Publication number Publication date
JPS5323990B2 (it) 1978-07-18
DE2248089A1 (de) 1973-04-12
FR2156123A1 (it) 1973-05-25
NL7113746A (it) 1973-04-10
AU4728572A (en) 1974-04-11
CH549870A (de) 1974-05-31
CA973975A (en) 1975-09-02
FR2156123B1 (it) 1977-12-23
JPS4846272A (it) 1973-07-02
GB1403239A (en) 1975-08-28

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