IT967608B - Processo perfezionato per la fab bricazione di dispositivi semicon duttori e a circuito integrato - Google Patents

Processo perfezionato per la fab bricazione di dispositivi semicon duttori e a circuito integrato

Info

Publication number
IT967608B
IT967608B IT29372/72A IT2937272A IT967608B IT 967608 B IT967608 B IT 967608B IT 29372/72 A IT29372/72 A IT 29372/72A IT 2937272 A IT2937272 A IT 2937272A IT 967608 B IT967608 B IT 967608B
Authority
IT
Italy
Prior art keywords
manufacturing
integrated circuit
improved process
circuit devices
semicon ductor
Prior art date
Application number
IT29372/72A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT967608B publication Critical patent/IT967608B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
IT29372/72A 1971-09-22 1972-09-19 Processo perfezionato per la fab bricazione di dispositivi semicon duttori e a circuito integrato IT967608B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18277871A 1971-09-22 1971-09-22

Publications (1)

Publication Number Publication Date
IT967608B true IT967608B (it) 1974-03-11

Family

ID=22669985

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29372/72A IT967608B (it) 1971-09-22 1972-09-19 Processo perfezionato per la fab bricazione di dispositivi semicon duttori e a circuito integrato

Country Status (5)

Country Link
US (1) US3751647A (it)
JP (1) JPS575057B2 (it)
CA (1) CA969658A (it)
DE (1) DE2240653A1 (it)
IT (1) IT967608B (it)

Families Citing this family (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825243A (ja) * 1981-08-07 1983-02-15 Hitachi Ltd 半導体ウェーハ処理方法
US4571685A (en) * 1982-06-23 1986-02-18 Nec Corporation Production system for manufacturing semiconductor devices
JPS60254626A (ja) * 1984-05-30 1985-12-16 Sharp Corp ウエハテスト方法
US4666294A (en) * 1984-12-31 1987-05-19 Klimsch & Co Kg Apparatus for exposure of both sides of printed circuit plates
JPS6285266U (it) * 1985-11-20 1987-05-30
US4796194A (en) * 1986-08-20 1989-01-03 Atherton Robert W Real world modeling and control process
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
US5124931A (en) * 1988-10-14 1992-06-23 Tokyo Electron Limited Method of inspecting electric characteristics of wafers and apparatus therefor
JP2941308B2 (ja) 1989-07-12 1999-08-25 株式会社日立製作所 検査システムおよび電子デバイスの製造方法
US6185324B1 (en) 1989-07-12 2001-02-06 Hitachi, Ltd. Semiconductor failure analysis system
US5086397A (en) * 1989-07-18 1992-02-04 Schuster Pamela K Method and apparatus for data collection of testing and inspection of products made on a production assembly line
JP2986868B2 (ja) * 1990-03-14 1999-12-06 株式会社日立製作所 外観検査方法及びその装置
JP2679500B2 (ja) * 1990-12-17 1997-11-19 モトローラ・インコーポレイテッド 総合的なシステム歩留りを計算するための方法
JPH06168863A (ja) * 1991-03-01 1994-06-14 Texas Instr Inc <Ti> 半導体製造装置の監視および制御を実行する装置と方法
JP2716288B2 (ja) * 1991-05-31 1998-02-18 山形日本電気株式会社 半導体回路試験方式
US5319570A (en) * 1991-10-09 1994-06-07 International Business Machines Corporation Control of large scale topography on silicon wafers
TW248612B (it) * 1993-03-31 1995-06-01 Siemens Ag
US5408405A (en) * 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
WO1995035544A1 (en) * 1994-06-22 1995-12-28 The Trustees Of Columbia University In The City Of New York System and method for inspection of products with warranties
JP3986571B2 (ja) * 1994-12-09 2007-10-03 日本テキサス・インスツルメンツ株式会社 歩留り予測装置とその方法
US5598341A (en) * 1995-03-10 1997-01-28 Advanced Micro Devices, Inc. Real-time in-line defect disposition and yield forecasting system
US5649169A (en) * 1995-06-20 1997-07-15 Advanced Micro Devices, Inc. Method and system for declustering semiconductor defect data
US5539752A (en) * 1995-06-30 1996-07-23 Advanced Micro Devices, Inc. Method and system for automated analysis of semiconductor defect data
US5828778A (en) * 1995-07-13 1998-10-27 Matsushita Electric Industrial Co., Ltd. Method and apparatus for analyzing failure of semiconductor wafer
US5777901A (en) * 1995-09-29 1998-07-07 Advanced Micro Devices, Inc. Method and system for automated die yield prediction in semiconductor manufacturing
US5793650A (en) * 1995-10-19 1998-08-11 Analog Devices, Inc. System and method of identifying the number of chip failures on a wafer attributed to cluster failures
US5913105A (en) * 1995-11-29 1999-06-15 Advanced Micro Devices Inc Method and system for recognizing scratch patterns on semiconductor wafers
KR100200480B1 (ko) * 1995-12-21 1999-10-01 윤종용 불량 분석 피드백에 의한 반도체 제조공정 제어방법
DE69738979D1 (de) 1996-03-19 2008-10-23 Hitachi Ltd Prozesssteuerungssystem
US6304836B1 (en) 1996-10-28 2001-10-16 Advanced Micro Devices Worst case design parameter extraction for logic technologies
US5773315A (en) * 1996-10-28 1998-06-30 Advanced Micro Devices, Inc. Product wafer yield prediction method employing a unit cell approach
US6445969B1 (en) 1997-01-27 2002-09-03 Circuit Image Systems Statistical process control integration systems and methods for monitoring manufacturing processes
US5916715A (en) * 1997-09-08 1999-06-29 Advanced Micro Devices, Inc. Process of using electrical signals for determining lithographic misalignment of vias relative to electrically active elements
US6118137A (en) * 1997-09-08 2000-09-12 Advanced Micro Devices, Inc. Test structure responsive to electrical signals for determining lithographic misalignment of conductors relative to vias
US6070004A (en) * 1997-09-25 2000-05-30 Siemens Aktiengesellschaft Method of maximizing chip yield for semiconductor wafers
US6096093A (en) * 1997-12-05 2000-08-01 Heuristic Physics Laboratories Method for using inspection data for improving throughput of stepper operations in manufacturing of integrated circuits
JP4611369B2 (ja) * 1998-01-14 2011-01-12 ルネサスエレクトロニクス株式会社 デバイスの製造方法
US6359461B1 (en) 1998-02-10 2002-03-19 Advanced Micro Devices, Inc. Test structure for determining the properties of densely packed transistors
US5986283A (en) * 1998-02-25 1999-11-16 Advanced Micro Devices Test structure for determining how lithographic patterning of a gate conductor affects transistor properties
US6044208A (en) * 1998-04-30 2000-03-28 International Business Machines Corporation Incremental critical area computation for VLSI yield prediction
US6247853B1 (en) * 1998-05-26 2001-06-19 International Business Machines Corporation Incremental method for critical area and critical region computation of via blocks
US6380554B1 (en) 1998-06-08 2002-04-30 Advanced Micro Devices, Inc. Test structure for electrically measuring the degree of misalignment between successive layers of conductors
US6226781B1 (en) 1998-08-12 2001-05-01 Advanced Micro Devices, Inc. Modifying a design layer of an integrated circuit using overlying and underlying design layers
US6452412B1 (en) 1999-03-04 2002-09-17 Advanced Micro Devices, Inc. Drop-in test structure and methodology for characterizing an integrated circuit process flow and topography
US6268717B1 (en) 1999-03-04 2001-07-31 Advanced Micro Devices, Inc. Semiconductor test structure with intentional partial defects and method of use
US6294397B1 (en) 1999-03-04 2001-09-25 Advanced Micro Devices, Inc. Drop-in test structure and abbreviated integrated circuit process flow for characterizing production integrated circuit process flow, topography, and equipment
US6297644B1 (en) 1999-03-04 2001-10-02 Advanced Micro Devices, Inc. Multipurpose defect test structure with switchable voltage contrast capability and method of use
US6258437B1 (en) 1999-03-31 2001-07-10 Advanced Micro Devices, Inc. Test structure and methodology for characterizing etching in an integrated circuit fabrication process
US6496958B1 (en) * 1999-04-27 2002-12-17 Infineon Technologies Richmond, Lp Yield prediction and statistical process control using predicted defect related yield loss
US6834262B1 (en) 1999-07-02 2004-12-21 Cypress Semiconductor Corporation Scheme for improving the simulation accuracy of integrated circuit patterns by simulation of the mask
US6556959B1 (en) * 1999-07-12 2003-04-29 Advanced Micro Devices, Inc. Method and apparatus for updating a manufacturing model based upon fault data relating to processing of semiconductor wafers
US6429452B1 (en) 1999-08-17 2002-08-06 Advanced Micro Devices, Inc. Test structure and methodology for characterizing ion implantation in an integrated circuit fabrication process
US6449577B1 (en) * 1999-08-19 2002-09-10 Agere Systems Guardian Corp. Self-optimizing adjustment algorithm
US6248602B1 (en) * 1999-11-01 2001-06-19 Amd, Inc. Method and apparatus for automated rework within run-to-run control semiconductor manufacturing
JP4070998B2 (ja) * 1999-11-18 2008-04-02 ピー・デイ・エフ ソリユーシヨンズ インコーポレイテツド テスト・ダイ
US6978229B1 (en) 1999-11-18 2005-12-20 Pdf Solutions, Inc. Efficient method for modeling and simulation of the impact of local and global variation on integrated circuits
US6449749B1 (en) * 1999-11-18 2002-09-10 Pdf Solutions, Inc. System and method for product yield prediction
WO2001036992A1 (en) 1999-11-18 2001-05-25 Pdf Solutions, Inc. The passive multiplexor test structure for intergrated circuit manufacturing
US6622059B1 (en) * 2000-04-13 2003-09-16 Advanced Micro Devices, Inc. Automated process monitoring and analysis system for semiconductor processing
JP2002043200A (ja) * 2000-07-24 2002-02-08 Mitsubishi Electric Corp 異常原因検出装置及び異常原因検出方法
US6751765B1 (en) * 2000-11-27 2004-06-15 International Business Machines Corporation Method and system for determining repeatable yield detractors of integrated circuits
EP1253497B1 (en) * 2001-04-27 2008-04-02 Qimonda Dresden GmbH & Co. oHG Method for adjusting processing parameters of plate-like objects in a processing tool
US6681376B1 (en) * 2001-10-17 2004-01-20 Cypress Semiconductor Corporation Integrated scheme for semiconductor device verification
AU2002343545A1 (en) * 2001-10-19 2003-06-10 Auburn University Estimating reliability of components for testing and quality optimization
US6918101B1 (en) 2001-10-25 2005-07-12 Kla -Tencor Technologies Corporation Apparatus and methods for determining critical area of semiconductor design data
US6948141B1 (en) 2001-10-25 2005-09-20 Kla-Tencor Technologies Corporation Apparatus and methods for determining critical area of semiconductor design data
US6751519B1 (en) * 2001-10-25 2004-06-15 Kla-Tencor Technologies Corporation Methods and systems for predicting IC chip yield
US6610550B1 (en) * 2002-04-03 2003-08-26 Advanced Micro Devices Method and apparatus for correlating error model with defect data
JP4126189B2 (ja) * 2002-04-10 2008-07-30 株式会社日立ハイテクノロジーズ 検査条件設定プログラム、検査装置および検査システム
US6823496B2 (en) 2002-04-23 2004-11-23 International Business Machines Corporation Physical design characterization system
US20040073879A1 (en) * 2002-05-15 2004-04-15 Ping Chen Modeling devices in consideration of process fluctuations
US7069103B1 (en) * 2002-06-28 2006-06-27 Advanced Micro Devices, Inc. Controlling cumulative wafer effects
US7024338B2 (en) * 2003-01-31 2006-04-04 Yieldboost Tech, Inc. System and method for improving TFT-array manufacturing yields
US6853873B1 (en) * 2003-02-21 2005-02-08 Nanometrics Incorporated Enhanced throughput of a metrology tool
US7251743B2 (en) * 2003-11-20 2007-07-31 International Business Machines Corporation Method, system, and program for transmitting input/output requests from a primary controller to a secondary controller
US7251793B1 (en) * 2004-02-02 2007-07-31 Advanced Micro Devices, Inc. Predicting defect future effects in integrated circuit technology development to facilitate semiconductor wafer lot disposition
US7849366B1 (en) * 2004-03-26 2010-12-07 Advanced Micro Devices, Inc. Method and apparatus for predicting yield parameters based on fault classification
US7136776B2 (en) * 2004-10-29 2006-11-14 Hitachi Global Storage Technologies Netherlands B.V. Method for evaluating processes for manufacturing components
US7356787B2 (en) * 2005-04-06 2008-04-08 Taiwan Semiconductor Manufacturing Co., Ltd. Alternative methodology for defect simulation and system
US7389480B2 (en) * 2005-05-09 2008-06-17 International Business Machines Corporation Content based yield prediction of VLSI designs
US7174233B1 (en) * 2005-08-29 2007-02-06 International Business Machines Corporation Quality/reliability system and method in multilevel manufacturing environment
US7218984B1 (en) 2005-12-16 2007-05-15 International Business Machines Corporation Dynamically determining yield expectation
US8302036B2 (en) * 2007-01-05 2012-10-30 Freescale Semiconductor, Inc. Method and apparatus for designing an integrated circuit
US20080319568A1 (en) * 2007-06-22 2008-12-25 International Business Machines Corporation Method and system for creating array defect paretos using electrical overlay of bitfail maps, photo limited yield, yield, and auto pattern recognition code data
JP5159373B2 (ja) * 2008-03-06 2013-03-06 オリンパス株式会社 基板検査方法
WO2012057008A1 (en) * 2010-10-27 2012-05-03 Nikon Corporation Profile measuring apparatus, method for manufacturing structure, and structure manufacturing system
US8701057B2 (en) * 2011-04-11 2014-04-15 Nvidia Corporation Design, layout, and manufacturing techniques for multivariant integrated circuits
US9129076B2 (en) 2011-09-05 2015-09-08 United Microelectronics Corp. Hierarchical wafer yield prediction method and hierarchical lifetime prediction method
JP2014041976A (ja) * 2012-08-23 2014-03-06 Toshiba Corp レシピ管理装置
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US20160148850A1 (en) 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US11029673B2 (en) 2017-06-13 2021-06-08 Pdf Solutions, Inc. Generating robust machine learning predictions for semiconductor manufacturing processes
US11022642B2 (en) 2017-08-25 2021-06-01 Pdf Solutions, Inc. Semiconductor yield prediction
TWI805564B (zh) * 2018-01-25 2023-06-21 晶元光電股份有限公司 晶粒轉移方法及其裝置
US11029359B2 (en) 2018-03-09 2021-06-08 Pdf Solutions, Inc. Failure detection and classsification using sensor data and/or measurement data
US11775714B2 (en) 2018-03-09 2023-10-03 Pdf Solutions, Inc. Rational decision-making tool for semiconductor processes
US10777470B2 (en) 2018-03-27 2020-09-15 Pdf Solutions, Inc. Selective inclusion/exclusion of semiconductor chips in accelerated failure tests

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH374407A (de) * 1957-07-30 1964-01-15 Hrabak Jaroslav Verfahren und Einrichtung zur Regelung einer die Güte von Erzeugnissen bestimmenden Grösse unter Verwendung einer statischen Methode
US3222504A (en) * 1961-06-23 1965-12-07 Western Electric Co Monitoring system for controlling a component fabricating machine
US3260838A (en) * 1963-01-22 1966-07-12 Gen Time Corp Deviation control system
US3515860A (en) * 1967-11-06 1970-06-02 Industrial Nucleonics Corp Process controller with dynamic set-point adjustment responsive to the statistical variance of the controlled property
US3615463A (en) * 1968-11-19 1971-10-26 Ibm Process of producing an array of integrated circuits on semiconductor substrate
US3618199A (en) * 1969-06-30 1971-11-09 Texas Instruments Inc Automated method and system for fabricating semiconductor devices

Also Published As

Publication number Publication date
US3751647A (en) 1973-08-07
CA969658A (en) 1975-06-17
DE2240653A1 (de) 1973-03-29
JPS575057B2 (it) 1982-01-28
JPS4839172A (it) 1973-06-08

Similar Documents

Publication Publication Date Title
IT967608B (it) Processo perfezionato per la fab bricazione di dispositivi semicon duttori e a circuito integrato
BR7104397D0 (pt) Processo de fabricacao de um dispositivo semicondutor
BR7203232D0 (pt) Um dispositivo semicondutor e processo de fabricacao do mesmo
JPS51139269A (en) Method of manufacturing semiconductor element
AT361042B (de) Integrierte halbleiterschaltung
BR7303088D0 (pt) Um processo de fabricar um dispositivo semicondutor
IT953757B (it) Struttura di contatto a circuiti integrati e procedimento per la sua fabbricazione
IT993367B (it) Circuito integrato a semiconduttori e metodo per la fabbricazione dello stesso
BR6915650D0 (pt) Processo de fabricacao de um dispositivo semicondutor
BR7200528D0 (pt) Um processo de fabricar um dispositivo semicondutor tendo um diodo de capacitancia semicondutor
IT975127B (it) Procedimento per la fabbricazione di un dispositivo semiconduttore e dispositivo semiconduttore ot tenuto col procedimento
IT976112B (it) Procedimento per la fabbricazione di dispositivi semiconduttori
BR7202321D0 (pt) Um dispositivo semicondutor e processo de fabricacao do dispositivo
BR7406340D0 (pt) Dispositivo semi-condutor e seu processo de fabricacao
IT968105B (it) Procedimento e dispositivo di fabbricazione di cablaggi piatti e cablaggio piatto ottenuto
BR7503777A (pt) Dispositivo semicondutor e processo de fabricacao do mesm
BE777392A (fr) Procede de fabrication d&#39;un composant a semiconducteurs
BR6912979D0 (pt) Processo de fabricacao de dispositivo semicondutor dispositivo semicondutor fabricado pelo mesmo
IT987430B (it) Processo perfezionato per la fabbricazione di dispositivi semiconduttori
BR7105887D0 (pt) Processo para a fabricacao de um dispositivo semicondutor
IT995885B (it) Componente a semiconduttore e meto do per la fabbricazione dello stesso
BR7400752D0 (pt) Um dispositivo semicondutor e processo de fabricacao do dispositivo
IT964138B (it) Processo perfezionato per la fab bricazione di dispositivi semicon duttori
ZA724729B (en) Method for the manufacturing of a semiconductor device
AU4728572A (en) Manufacturing semiconductor devices