BR7406340D0 - Dispositivo semi-condutor e seu processo de fabricacao - Google Patents

Dispositivo semi-condutor e seu processo de fabricacao

Info

Publication number
BR7406340D0
BR7406340D0 BR6340/74A BR634074A BR7406340D0 BR 7406340 D0 BR7406340 D0 BR 7406340D0 BR 6340/74 A BR6340/74 A BR 6340/74A BR 634074 A BR634074 A BR 634074A BR 7406340 D0 BR7406340 D0 BR 7406340D0
Authority
BR
Brazil
Prior art keywords
semi
manufacturing process
conductor device
conductor
manufacturing
Prior art date
Application number
BR6340/74A
Other languages
English (en)
Inventor
A Dingwall
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BR7406340D0 publication Critical patent/BR7406340D0/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
BR6340/74A 1973-08-06 1974-08-02 Dispositivo semi-condutor e seu processo de fabricacao BR7406340D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38566973A 1973-08-06 1973-08-06

Publications (1)

Publication Number Publication Date
BR7406340D0 true BR7406340D0 (pt) 1975-09-09

Family

ID=23522380

Family Applications (1)

Application Number Title Priority Date Filing Date
BR6340/74A BR7406340D0 (pt) 1973-08-06 1974-08-02 Dispositivo semi-condutor e seu processo de fabricacao

Country Status (12)

Country Link
US (1) US4069577A (pt)
JP (1) JPS5051276A (pt)
BE (1) BE818547A (pt)
BR (1) BR7406340D0 (pt)
CA (1) CA1012658A (pt)
DE (1) DE2436517A1 (pt)
FR (1) FR2240532B1 (pt)
GB (1) GB1476790A (pt)
IN (1) IN140846B (pt)
IT (1) IT1015392B (pt)
NL (1) NL7410214A (pt)
SE (1) SE7409993L (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075775A (pt) * 1973-11-06 1975-06-21
JPS5918872B2 (ja) * 1973-12-07 1984-05-01 日本電気株式会社 絶縁ゲ−ト型電界効果半導体装置の製法
JPS5293278A (en) * 1976-01-30 1977-08-05 Matsushita Electronics Corp Manufacture for mos type semiconductor intergrated circuit
JPS52117079A (en) * 1976-03-29 1977-10-01 Oki Electric Ind Co Ltd Preparation of semiconductor device
FR2351502A1 (fr) * 1976-05-14 1977-12-09 Ibm Procede de fabrication de transistors a effet de champ a porte en silicium polycristallin auto-alignee avec les regions source et drain ainsi qu'avec les regions d'isolation de champ encastrees
US4035198A (en) * 1976-06-30 1977-07-12 International Business Machines Corporation Method of fabricating field effect transistors having self-registering electrical connections between gate electrodes and metallic interconnection lines, and fabrication of integrated circuits containing the transistors
US4095251A (en) * 1976-08-19 1978-06-13 International Business Machines Corporation Field effect transistors and fabrication of integrated circuits containing the transistors
JPS5464480A (en) * 1977-10-31 1979-05-24 Nec Corp Semiconductor device
JPS54109784A (en) * 1978-02-16 1979-08-28 Nec Corp Manufacture of semiconductor device
JPS5848936A (ja) * 1981-09-10 1983-03-23 Fujitsu Ltd 半導体装置の製造方法
JPS59123266A (ja) * 1982-12-28 1984-07-17 Toshiba Corp Ｍｉｓトランジスタ及びその製造方法
US5798291A (en) * 1995-03-20 1998-08-25 Lg Semicon Co., Ltd. Method of making a semiconductor device with recessed source and drain

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3691627A (en) * 1970-02-03 1972-09-19 Gen Electric Method of fabricating buried metallic film devices
US3673471A (en) * 1970-10-08 1972-06-27 Fairchild Camera Instr Co Doped semiconductor electrodes for mos type devices
US3761327A (en) * 1971-03-19 1973-09-25 Itt Planar silicon gate mos process
NL7113561A (pt) * 1971-10-02 1973-04-04
CA1001771A (en) * 1973-01-15 1976-12-14 Fairchild Camera And Instrument Corporation Method of mos transistor manufacture and resulting structure

Also Published As

Publication number Publication date
US4069577A (en) 1978-01-24
IT1015392B (it) 1977-05-10
DE2436517A1 (de) 1975-03-06
BE818547A (fr) 1974-12-02
JPS5051276A (pt) 1975-05-08
FR2240532B1 (pt) 1978-08-11
IN140846B (pt) 1976-12-25
NL7410214A (nl) 1975-02-10
FR2240532A1 (pt) 1975-03-07
GB1476790A (en) 1977-06-16
CA1012658A (en) 1977-06-21
AU7206174A (en) 1976-02-12
SE7409993L (pt) 1975-02-07

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