IT993367B - Circuito integrato a semiconduttori e metodo per la fabbricazione dello stesso - Google Patents
Circuito integrato a semiconduttori e metodo per la fabbricazione dello stessoInfo
- Publication number
- IT993367B IT993367B IT29246/73A IT2924673A IT993367B IT 993367 B IT993367 B IT 993367B IT 29246/73 A IT29246/73 A IT 29246/73A IT 2924673 A IT2924673 A IT 2924673A IT 993367 B IT993367 B IT 993367B
- Authority
- IT
- Italy
- Prior art keywords
- manufacturing
- same
- integrated circuit
- semiconductor integrated
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/761—PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8222—Bipolar technology
- H01L21/8228—Complementary devices, e.g. complementary transistors
- H01L21/82285—Complementary vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
- H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
- H01L27/0826—Combination of vertical complementary transistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/037—Diffusion-deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/098—Layer conversion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/145—Shaped junctions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/151—Simultaneous diffusion
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47095341A JPS5942463B2 (ja) | 1972-09-22 | 1972-09-22 | 半導体集積回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT993367B true IT993367B (it) | 1975-09-30 |
Family
ID=14134981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT29246/73A IT993367B (it) | 1972-09-22 | 1973-09-21 | Circuito integrato a semiconduttori e metodo per la fabbricazione dello stesso |
Country Status (8)
Country | Link |
---|---|
US (1) | US3912555A (it) |
JP (1) | JPS5942463B2 (it) |
CA (1) | CA1011467A (it) |
DE (1) | DE2347745A1 (it) |
FR (1) | FR2200635B1 (it) |
GB (1) | GB1444633A (it) |
IT (1) | IT993367B (it) |
NL (1) | NL7313144A (it) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4146905A (en) * | 1974-06-18 | 1979-03-27 | U.S. Philips Corporation | Semiconductor device having complementary transistor structures and method of manufacturing same |
JPS51123577A (en) * | 1975-04-22 | 1976-10-28 | Toshiba Corp | Semiconductor integrating circuit including epitaxial base typ vertica l directional transistor |
CA1047652A (en) * | 1975-07-31 | 1979-01-30 | National Semiconductor Corporation | Monolithic integrated circuit transistor having very low collector resistance |
US4013484A (en) * | 1976-02-25 | 1977-03-22 | Intel Corporation | High density CMOS process |
US4168997A (en) * | 1978-10-10 | 1979-09-25 | National Semiconductor Corporation | Method for making integrated circuit transistors with isolation and substrate connected collectors utilizing simultaneous outdiffusion to convert an epitaxial layer |
JPS55153365A (en) * | 1979-05-17 | 1980-11-29 | Toshiba Corp | Manufacturing method of semiconductor device |
US4274891A (en) * | 1979-06-29 | 1981-06-23 | International Business Machines Corporation | Method of fabricating buried injector memory cell formed from vertical complementary bipolar transistor circuits utilizing mono-poly deposition |
JPS5750473A (en) * | 1980-09-11 | 1982-03-24 | Nec Corp | Semiconductor integrated circuit device |
KR900001267B1 (ko) * | 1983-11-30 | 1990-03-05 | 후지쓰 가부시끼가이샤 | Soi형 반도체 장치의 제조방법 |
IT1218471B (it) * | 1985-05-09 | 1990-04-19 | Ates Componenti Elettron | Circuito integrato bipolare comprendente transistori pnp verticali con collettore sul substrato |
US4936928A (en) * | 1985-11-27 | 1990-06-26 | Raytheon Company | Semiconductor device |
US5014107A (en) * | 1987-07-29 | 1991-05-07 | Fairchild Semiconductor Corporation | Process for fabricating complementary contactless vertical bipolar transistors |
US5023194A (en) * | 1988-02-11 | 1991-06-11 | Exar Corporation | Method of making a multicollector vertical pnp transistor |
US4902633A (en) * | 1988-05-09 | 1990-02-20 | Motorola, Inc. | Process for making a bipolar integrated circuit |
US5061652A (en) * | 1990-01-23 | 1991-10-29 | International Business Machines Corporation | Method of manufacturing a semiconductor device structure employing a multi-level epitaxial structure |
US5159429A (en) * | 1990-01-23 | 1992-10-27 | International Business Machines Corporation | Semiconductor device structure employing a multi-level epitaxial structure and method of manufacturing same |
EP0534632B1 (en) * | 1991-09-24 | 2002-01-16 | Matsushita Electronics Corporation, Ltd. | Semiconductor integrated circuit device and method of fabricating the same |
US5623159A (en) * | 1994-10-03 | 1997-04-22 | Motorola, Inc. | Integrated circuit isolation structure for suppressing high-frequency cross-talk |
US5633180A (en) * | 1995-06-01 | 1997-05-27 | Harris Corporation | Method of forming P-type islands over P-type buried layer |
JP5048242B2 (ja) * | 2005-11-30 | 2012-10-17 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3449643A (en) * | 1966-09-09 | 1969-06-10 | Hitachi Ltd | Semiconductor integrated circuit device |
FR1559608A (it) * | 1967-06-30 | 1969-03-14 | ||
US3638079A (en) * | 1970-01-28 | 1972-01-25 | Sylvania Electric Prod | Complementary semiconductor devices in monolithic integrated circuits |
-
1972
- 1972-09-22 JP JP47095341A patent/JPS5942463B2/ja not_active Expired
-
1973
- 1973-09-18 US US398398A patent/US3912555A/en not_active Expired - Lifetime
- 1973-09-19 GB GB4392273A patent/GB1444633A/en not_active Expired
- 1973-09-21 CA CA181,671A patent/CA1011467A/en not_active Expired
- 1973-09-21 IT IT29246/73A patent/IT993367B/it active
- 1973-09-21 DE DE19732347745 patent/DE2347745A1/de active Pending
- 1973-09-24 FR FR7334157A patent/FR2200635B1/fr not_active Expired
- 1973-09-24 NL NL7313144A patent/NL7313144A/xx not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
FR2200635B1 (it) | 1978-11-10 |
NL7313144A (it) | 1974-03-26 |
GB1444633A (en) | 1976-08-04 |
FR2200635A1 (it) | 1974-04-19 |
DE2347745A1 (de) | 1974-04-04 |
JPS5942463B2 (ja) | 1984-10-15 |
JPS4952987A (it) | 1974-05-23 |
US3912555A (en) | 1975-10-14 |
CA1011467A (en) | 1977-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT983948B (it) | Metodo per la fabbricazione di strutture a circuito integrato e struttura risultante | |
IT993367B (it) | Circuito integrato a semiconduttori e metodo per la fabbricazione dello stesso | |
IT1009579B (it) | Struttura a circuito integrato perfezionata e metodo per fab bricarla | |
AT361042B (de) | Integrierte halbleiterschaltung | |
SE7509474L (sv) | Halvledardon och sett att tillverka det | |
SE386541B (sv) | Monolitisk integrerad halvledarkrets | |
IT955649B (it) | Metodo per la fabbricazione di un dispositivo semiconduttore | |
IT955675B (it) | Dispositivo semiconduttore e metodo per la fabbricazione dello stesso | |
IT953757B (it) | Struttura di contatto a circuiti integrati e procedimento per la sua fabbricazione | |
PL200127A1 (pl) | Sposob wytwarzania przyrzadu polprzewodnikowego | |
IT948581B (it) | Dispositivo di guranizione a tenuta e metodo per fabbricarlo | |
IT1012351B (it) | Circuito integrato semiconduttore | |
IT1001593B (it) | Struttura a circuito integrato perfezionata e metodo per fabbri carla | |
AT376844B (de) | Halbleiterbauteil | |
AT334662B (de) | Hochintegrierter halbleiterspeicher | |
IT981508B (it) | Struttura semiconduttrice a circuito integrato | |
IT978033B (it) | Circuito integrato | |
IT1001702B (it) | Struttura a circuito integrato perfezionata | |
DK138248C (da) | Halvlederelement | |
IT995885B (it) | Componente a semiconduttore e meto do per la fabbricazione dello stesso | |
IT994704B (it) | Procedimento per la fabbricazione di un dispositivo comprendente un semiconduttore | |
IT994322B (it) | Circuito integrato a semiconduttore | |
CH541869A (de) | Halbleiterbauelement | |
IT987932B (it) | Dispositivo semiconduttore integrato | |
IT963314B (it) | Metodo per la fabbricazione di un dispositivo semiconduttore |