IT201700121768A1 - Un perfezionamento di un dispositivo scaldante per effettuare test in temperatura su componenti elettronici riposti entro un socket - Google Patents
Un perfezionamento di un dispositivo scaldante per effettuare test in temperatura su componenti elettronici riposti entro un socketInfo
- Publication number
- IT201700121768A1 IT201700121768A1 IT102017000121768A IT201700121768A IT201700121768A1 IT 201700121768 A1 IT201700121768 A1 IT 201700121768A1 IT 102017000121768 A IT102017000121768 A IT 102017000121768A IT 201700121768 A IT201700121768 A IT 201700121768A IT 201700121768 A1 IT201700121768 A1 IT 201700121768A1
- Authority
- IT
- Italy
- Prior art keywords
- socket
- improvement
- heating device
- electronic components
- components stored
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000121768A IT201700121768A1 (it) | 2017-10-26 | 2017-10-26 | Un perfezionamento di un dispositivo scaldante per effettuare test in temperatura su componenti elettronici riposti entro un socket |
US16/958,305 US11448665B2 (en) | 2017-10-26 | 2018-10-12 | Heating device for carrying out temperature-dependent tests on electronic components arranged in a socket |
EP18793018.5A EP3701275A1 (en) | 2017-10-26 | 2018-10-12 | Improvement of a heating device for carrying out temperature-dependent tests on electronic components arranged in a socket |
PCT/IB2018/057916 WO2019082014A1 (en) | 2017-10-26 | 2018-10-12 | IMPROVING A HEATING DEVICE FOR PERFORMING TEMPERATURE-DETAILED TESTS ON ELECTRONIC COMPONENTS ARRANGED IN A SLEEVE |
SG11202003575SA SG11202003575SA (en) | 2017-10-26 | 2018-10-12 | Improvement of a heating device for carrying out temperature-dependent tests on electronic components arranged in a socket |
CN201880084795.5A CN111527414A (zh) | 2017-10-26 | 2018-10-12 | 用于对布置在插座中的电子部件进行与温度相关的测试的加热设备的改进 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000121768A IT201700121768A1 (it) | 2017-10-26 | 2017-10-26 | Un perfezionamento di un dispositivo scaldante per effettuare test in temperatura su componenti elettronici riposti entro un socket |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201700121768A1 true IT201700121768A1 (it) | 2019-04-26 |
Family
ID=61581433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102017000121768A IT201700121768A1 (it) | 2017-10-26 | 2017-10-26 | Un perfezionamento di un dispositivo scaldante per effettuare test in temperatura su componenti elettronici riposti entro un socket |
Country Status (6)
Country | Link |
---|---|
US (1) | US11448665B2 (it) |
EP (1) | EP3701275A1 (it) |
CN (1) | CN111527414A (it) |
IT (1) | IT201700121768A1 (it) |
SG (1) | SG11202003575SA (it) |
WO (1) | WO2019082014A1 (it) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4607220A (en) * | 1984-05-07 | 1986-08-19 | The Micromanipulator Co., Inc. | Method and apparatus for low temperature testing of electronic components |
US20150084657A1 (en) * | 2012-04-26 | 2015-03-26 | Freescale Semiconductor, Inc. | Heating system and method of testing a semiconductor device using a heating system |
EP3173798A1 (en) * | 2015-11-27 | 2017-05-31 | Microtest S.r.l. | Heating device for temperature-dependent test on electronic components placed inside socket |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4874924A (en) * | 1987-04-21 | 1989-10-17 | Tdk Corporation | PTC heating device |
US5911897A (en) * | 1997-01-13 | 1999-06-15 | Micro Control Company | Temperature control for high power burn-in for integrated circuits |
US7042240B2 (en) * | 2004-02-27 | 2006-05-09 | Wells-Cti, Llc | Burn-in testing apparatus and method |
WO2014001528A1 (en) * | 2012-06-29 | 2014-01-03 | Eles Semiconductor Equipment S.P.A. | Test board with local thermal conditioning elements |
KR20140080750A (ko) | 2012-12-14 | 2014-07-01 | 한국전자통신연구원 | 반도체 소자 테스트 장치 |
-
2017
- 2017-10-26 IT IT102017000121768A patent/IT201700121768A1/it unknown
-
2018
- 2018-10-12 CN CN201880084795.5A patent/CN111527414A/zh active Pending
- 2018-10-12 WO PCT/IB2018/057916 patent/WO2019082014A1/en unknown
- 2018-10-12 SG SG11202003575SA patent/SG11202003575SA/en unknown
- 2018-10-12 US US16/958,305 patent/US11448665B2/en active Active
- 2018-10-12 EP EP18793018.5A patent/EP3701275A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4607220A (en) * | 1984-05-07 | 1986-08-19 | The Micromanipulator Co., Inc. | Method and apparatus for low temperature testing of electronic components |
US20150084657A1 (en) * | 2012-04-26 | 2015-03-26 | Freescale Semiconductor, Inc. | Heating system and method of testing a semiconductor device using a heating system |
EP3173798A1 (en) * | 2015-11-27 | 2017-05-31 | Microtest S.r.l. | Heating device for temperature-dependent test on electronic components placed inside socket |
Also Published As
Publication number | Publication date |
---|---|
EP3701275A1 (en) | 2020-09-02 |
US11448665B2 (en) | 2022-09-20 |
CN111527414A (zh) | 2020-08-11 |
US20210096156A1 (en) | 2021-04-01 |
SG11202003575SA (en) | 2020-05-28 |
WO2019082014A1 (en) | 2019-05-02 |
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