SG11201606238PA - Integrated circuit (ic) test socket using kelvin bridge - Google Patents

Integrated circuit (ic) test socket using kelvin bridge

Info

Publication number
SG11201606238PA
SG11201606238PA SG11201606238PA SG11201606238PA SG11201606238PA SG 11201606238P A SG11201606238P A SG 11201606238PA SG 11201606238P A SG11201606238P A SG 11201606238PA SG 11201606238P A SG11201606238P A SG 11201606238PA SG 11201606238P A SG11201606238P A SG 11201606238PA
Authority
SG
Singapore
Prior art keywords
integrated circuit
test socket
kelvin bridge
kelvin
bridge
Prior art date
Application number
SG11201606238PA
Inventor
Pongsak Tiengtum
Victor Landa
Original Assignee
Xcerra Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xcerra Corp filed Critical Xcerra Corp
Publication of SG11201606238PA publication Critical patent/SG11201606238PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
SG11201606238PA 2014-02-25 2015-02-24 Integrated circuit (ic) test socket using kelvin bridge SG11201606238PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/189,787 US9354251B2 (en) 2014-02-25 2014-02-25 Integrated circuit (IC) test socket using Kelvin bridge
PCT/US2015/017380 WO2015130708A1 (en) 2014-02-25 2015-02-24 Integrated circuit (ic) test socket using kelvin bridge

Publications (1)

Publication Number Publication Date
SG11201606238PA true SG11201606238PA (en) 2016-09-29

Family

ID=53881970

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606238PA SG11201606238PA (en) 2014-02-25 2015-02-24 Integrated circuit (ic) test socket using kelvin bridge

Country Status (8)

Country Link
US (1) US9354251B2 (en)
EP (1) EP3111241A4 (en)
JP (1) JP6096995B1 (en)
KR (1) KR101770394B1 (en)
CN (1) CN106104279B (en)
PH (1) PH12016501480A1 (en)
SG (1) SG11201606238PA (en)
WO (1) WO2015130708A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link
MY193023A (en) 2016-09-08 2022-09-22 Multitest Elektronische Systeme Gmbh Socket for testing electronic components and test site arrangement
CN106375925B (en) * 2016-09-12 2019-02-26 歌尔股份有限公司 Earphone testboard, earphone test device and earphone test method
US11002760B1 (en) * 2017-02-06 2021-05-11 Johnstech International Corporation High isolation housing for testing integrated circuits
MY185304A (en) * 2017-05-18 2021-04-30 Jf Microtechnology Sdn Bhd High precision vertical motion kelvin contact assembly
PH12018050194A1 (en) * 2017-05-18 2019-02-04 Jf Microtechnology Sdn Bhd Manufacturing process for kelvin contact assembly housing
CN108469583B (en) * 2018-05-28 2024-03-22 格力电器（郑州）有限公司 ICT tester
CN109243993A (en) * 2018-09-06 2019-01-18 长鑫存储技术有限公司 Semiconductor chip, semiconductor chip electrical testing circuit and method
WO2020048385A1 (en) * 2018-09-06 2020-03-12 Changxin Memory Technologies, Inc. Semiconductor chip and circuit and method for electrically testing semiconductor chip
CN109103121B (en) * 2018-10-09 2024-05-28 深圳斯普瑞溙科技有限公司 Test seat for flat pin-free packaged chip
CN110376511A (en) * 2019-08-17 2019-10-25 深圳斯普瑞溙科技有限公司 Test the golden finger of minimum spacing and contact chip
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) * 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5634801A (en) * 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
US5069629A (en) * 1991-01-09 1991-12-03 Johnson David A Electrical interconnect contact system
US5947749A (en) * 1996-07-02 1999-09-07 Johnstech International Corporation Electrical interconnect contact system
US6409521B1 (en) 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
WO2004109301A1 (en) * 2003-06-11 2004-12-16 Ismeca Semiconductor Holding Sa Connector
WO2005011060A2 (en) * 2003-07-16 2005-02-03 Gryphics, Inc. Electrical interconnect assembly with interlocking contact system
US7074049B2 (en) * 2004-03-22 2006-07-11 Johnstech International Corporation Kelvin contact module for a microcircuit test system
CN1940574A (en) * 2005-07-08 2007-04-04 约翰国际有限公司 Test socket
KR100963498B1 (en) * 2005-10-31 2010-06-17 가부시키가이샤 니혼 마이크로닉스 Electrical Connector
US7737708B2 (en) 2006-05-11 2010-06-15 Johnstech International Corporation Contact for use in testing integrated circuits
US8354854B2 (en) * 2007-01-02 2013-01-15 Johnstech International Corporation Microcircuit testing interface having kelvin and signal contacts within a single slot
CN101424702B (en) * 2007-10-29 2010-07-28 京元电子股份有限公司 Probe, test socket and tester thereof
US8988090B2 (en) * 2009-04-21 2015-03-24 Johnstech International Corporation Electrically conductive kelvin contacts for microcircuit tester
US9329204B2 (en) 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
US8441275B1 (en) * 2010-01-14 2013-05-14 Tapt Interconnect, LLC Electronic device test fixture
US7918669B1 (en) 2010-07-22 2011-04-05 Titan Semiconductor Tool, LLC Integrated circuit socket with a two-piece connector with a rocker arm
TWI534432B (en) 2010-09-07 2016-05-21 瓊斯科技國際公司 Electrically conductive pins for microcircuit tester
MY175570A (en) * 2012-03-20 2020-07-01 Jf Microtechnology Sdn Bhd Multiple rigid contact solution for ic testing

Also Published As

Publication number Publication date
JP6096995B1 (en) 2017-03-15
CN106104279B (en) 2017-11-21
CN106104279A (en) 2016-11-09
KR20160128303A (en) 2016-11-07
PH12016501480B1 (en) 2016-08-22
EP3111241A4 (en) 2017-11-01
PH12016501480A1 (en) 2016-08-22
EP3111241A1 (en) 2017-01-04
JP2017508959A (en) 2017-03-30
WO2015130708A1 (en) 2015-09-03
KR101770394B1 (en) 2017-08-22
US9354251B2 (en) 2016-05-31
US20150241474A1 (en) 2015-08-27

Similar Documents

Publication Publication Date Title
SG11201606238PA (en) Integrated circuit (ic) test socket using kelvin bridge
SG11201510255QA (en) Testing apparatus for wafer level ic testing
GB2506825B (en) Functional testing of an integrated circuit chip
HK1244591A1 (en) Integrated circuit devices and methods
EP3789871C0 (en) Integrated circuit chip device
SG11201702957SA (en) Assembling devices for probe card testing
ZA201802189B (en) Method for embedding integrated circuit flip chip
GB2506826B (en) Monitoring functional testing of an integrated circuit chip
SG11201608514UA (en) Alignment fixtures for integrated circuit packages
KR101769882B9 (en) Test Socket
TWI561839B (en) Integrated circuit testing interface and automatic test equipment
EP3491406C0 (en) Test system for testing electronic connections
SG10201501865PA (en) Device For Testing Electronic Components
GB201522432D0 (en) Automated test system for integrated circuits
FR3018953B1 (en) INTEGRATED CIRCUIT CHIP MOUNTED ON AN INTERPOSER
EP3633355C0 (en) Semiconductor inspection device
SG10201503577VA (en) Contact Module For Electronic Components Measurement
SG11201610470RA (en) Integrated circuit chip tester with an anti-rotation link
GB201607589D0 (en) Integrated circuit device
SG11201801519PA (en) Ic test system
TWI560453B (en) Circuit board and testing method
DE112014001826A5 (en) Holding pin and circuit board tester
GB201413960D0 (en) Integrated circuit chip inductor configuration
TWI560795B (en) Wafer probing device
TWI562159B (en) Integrated circuit and method for establishing scah test architecture in integrated circuit