IT1236657B - Apparecchiatura per impedire l'annebbiamento di un wafer di semi-conduttore - Google Patents

Apparecchiatura per impedire l'annebbiamento di un wafer di semi-conduttore

Info

Publication number
IT1236657B
IT1236657B IT02226889A IT2226889A IT1236657B IT 1236657 B IT1236657 B IT 1236657B IT 02226889 A IT02226889 A IT 02226889A IT 2226889 A IT2226889 A IT 2226889A IT 1236657 B IT1236657 B IT 1236657B
Authority
IT
Italy
Prior art keywords
foging
semi
equipment
prevent
conductor wafer
Prior art date
Application number
IT02226889A
Other languages
English (en)
Other versions
IT8922268A0 (it
IT8922268A1 (it
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of IT8922268A0 publication Critical patent/IT8922268A0/it
Publication of IT8922268A1 publication Critical patent/IT8922268A1/it
Application granted granted Critical
Publication of IT1236657B publication Critical patent/IT1236657B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/46—Removing components of defined structure
    • B01D53/60—Simultaneously removing sulfur oxides and nitrogen oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
    • Y02A50/20—Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Treating Waste Gases (AREA)
  • Filtering Materials (AREA)
  • Elimination Of Static Electricity (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
IT02226889A 1988-11-04 1989-11-03 Apparecchiatura per impedire l'annebbiamento di un wafer di semi-conduttore IT1236657B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63278587A JP2736662B2 (ja) 1988-11-04 1988-11-04 半導体ウェーハの曇防止装置

Publications (3)

Publication Number Publication Date
IT8922268A0 IT8922268A0 (it) 1989-11-03
IT8922268A1 IT8922268A1 (it) 1991-05-03
IT1236657B true IT1236657B (it) 1993-03-25

Family

ID=17599340

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02226889A IT1236657B (it) 1988-11-04 1989-11-03 Apparecchiatura per impedire l'annebbiamento di un wafer di semi-conduttore

Country Status (5)

Country Link
US (2) US5039321A (it)
JP (1) JP2736662B2 (it)
KR (1) KR950011558B1 (it)
DE (1) DE3936540A1 (it)
IT (1) IT1236657B (it)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626820A (en) * 1988-12-12 1997-05-06 Kinkead; Devon A. Clean room air filtering
US6340381B1 (en) * 1991-12-02 2002-01-22 Ebara Research Co., Ltd. Method and apparatus for the preparation of clean gases
US5922105A (en) * 1992-12-02 1999-07-13 Ebara Research Co., Ltd. Method and apparatus for the preparation of clean gases
US6733570B2 (en) 1992-12-02 2004-05-11 Ebara Research Co., Ltd. Method and apparatus for the preparation of clean gases
JP3334929B2 (ja) * 1993-02-04 2002-10-15 東京エレクトロン株式会社 熱処理装置
US5514196A (en) * 1993-02-04 1996-05-07 Tokyo Electron Limited Air cleaning apparatus
US5685895A (en) * 1994-08-10 1997-11-11 Nikon Corporation Air cleaning apparatus used for an exposure apparatus
US5833726A (en) * 1995-05-26 1998-11-10 Extraction System, Inc. Storing substrates between process steps within a processing facility
TW363903B (en) * 1996-03-11 1999-07-11 Memc Electronic Materials Spa Apparatus for use in automatically cleaning semiconductor wafers and methods for drying a semiconductor wafer in the automatic drying machine
GB9614849D0 (en) * 1996-07-15 1996-09-04 Boc Group Plc Processes for the scubbing of noxious substances
JP3405439B2 (ja) 1996-11-05 2003-05-12 株式会社荏原製作所 固体表面の清浄化方法
JP3991375B2 (ja) * 1996-11-13 2007-10-17 東京エレクトロン株式会社 トラップ装置
US6156107A (en) * 1996-11-13 2000-12-05 Tokyo Electron Limited Trap apparatus
JP3559133B2 (ja) * 1997-01-31 2004-08-25 大日本スクリーン製造株式会社 熱処理装置および基板処理装置
US5972078A (en) * 1997-07-31 1999-10-26 Fsi International, Inc. Exhaust rinse manifold for use with a coating apparatus
KR19990027844A (ko) * 1997-09-30 1999-04-15 윤종용 반도체장비의 공기유입장치 및 이를 이용한 화학물 오염 제거방법
CA2296477A1 (en) * 1998-08-05 2000-02-05 Toray Industries, Inc. Chemical filter unit and gas cleaning system
DE19835538A1 (de) * 1998-08-06 2000-02-10 Meissner & Wurst Reinraum
KR100639280B1 (ko) 1998-08-20 2006-10-30 엔테그리스, 아이엔씨. 다공성의 강산성 중합체를 채용한 필터
US6273100B1 (en) 1998-08-27 2001-08-14 Micron Technology, Inc. Surface cleaning apparatus and method
US6572457B2 (en) 1998-09-09 2003-06-03 Applied Surface Technologies System and method for controlling humidity in a cryogenic aerosol spray cleaning system
US6123617A (en) * 1998-11-02 2000-09-26 Seh-America, Inc. Clean room air filtering system
JP2001141274A (ja) * 1999-11-12 2001-05-25 Daikin Ind Ltd クリーンルーム
WO2001085308A2 (en) 2000-05-05 2001-11-15 Extraction Systems, Inc. Filters employing both acidic polymers and physical-absorption media
US7540901B2 (en) * 2000-05-05 2009-06-02 Entegris, Inc. Filters employing both acidic polymers and physical-adsorption media
US6897165B2 (en) * 2001-06-06 2005-05-24 Matsushita Electric Industrial Co., Ltd. Environmental control equipment/method of developing apparatus for developing light-exposed resist film with developer in wafer treating chamber
DE10143628A1 (de) * 2001-09-06 2003-03-27 M & W Zander Facility Eng Gmbh Anlage und Verfahren zur Abluftaufbereitung, insbesondere bei Reinraumanlagen
TW509097U (en) * 2002-01-18 2002-11-01 Ritdisplay Corp Transporting device for evaporation
EP1505937A1 (en) * 2002-04-22 2005-02-16 Jane Homan Modular biosafety containment apparatus and system
US7077843B2 (en) * 2002-06-24 2006-07-18 Lanx, Llc Cervical plate
KR100474577B1 (ko) * 2002-07-06 2005-03-08 삼성전자주식회사 청정 공기 덕트 및 청정실용 공기 제공 장치
US6843833B2 (en) * 2003-06-16 2005-01-18 Powerchip Semiconductor Corp. Front opening unified pod and associated method for preventing outgassing pollution
US20050089455A1 (en) * 2003-10-24 2005-04-28 Marganski Paul J. Gas-using facility including portable dry scrubber system and/or over-pressure control arrangement
TWI417130B (zh) * 2006-07-13 2013-12-01 Entegris Inc 過濾系統

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111471A (en) * 1975-03-24 1976-10-01 Fmc Corp Method and apparatus for purifying nitrogen dioxide
JPS5213473A (en) * 1975-07-24 1977-02-01 Mitsubishi Heavy Ind Ltd Treatment process for exhaust gases
US4059504A (en) * 1976-07-21 1977-11-22 The Lummus Company Hydrotreating of pyrolysis gasoline
JPS5383171A (en) * 1976-12-28 1978-07-22 Nippon Kokan Kk <Nkk> Air purifying apparatus
JPS5833013B2 (ja) * 1978-05-24 1983-07-16 大成建設株式会社 大気汚染物質の除去方法
JPS5539224A (en) * 1978-09-11 1980-03-19 Ono Gijutsu Kenkyusho:Kk Air cleaner with connector
US4374813A (en) * 1980-05-14 1983-02-22 Koch Engineering Company, Inc. Reverse-jet scrubber apparatus and method
JPS6071830A (ja) * 1983-09-29 1985-04-23 Hitachi Plant Eng & Constr Co Ltd 組替式局所環境制御室
JPS60125233A (ja) * 1983-12-08 1985-07-04 Mitsui Toatsu Chem Inc 排ガスの高度処理方法
US4630530A (en) * 1984-05-09 1986-12-23 Travel-Aire, Inc. Filtering systems for buses
JPS62131131A (ja) * 1985-12-03 1987-06-13 Hitachi Plant Eng & Constr Co Ltd トンネルクリ−ンル−ムの緊急安全装置
US4684510A (en) * 1985-12-20 1987-08-04 Hewlett-Packard Company Method and apparatus for prevention of atmospheric corrosion of electronic equipment
US4737173A (en) * 1986-07-03 1988-04-12 Amway Corporation Room air treatment system
JPS63256116A (ja) * 1987-04-13 1988-10-24 Ii L:Kk 超純度エア−の製造方法
JPH01224022A (ja) * 1988-03-04 1989-09-07 Kanebo Ltd 多孔質濾材

Also Published As

Publication number Publication date
US5039321A (en) 1991-08-13
IT8922268A0 (it) 1989-11-03
KR950011558B1 (ko) 1995-10-06
IT8922268A1 (it) 1991-05-03
JP2736662B2 (ja) 1998-04-02
KR900008635A (ko) 1990-06-03
US5122170A (en) 1992-06-16
DE3936540A1 (de) 1990-05-23
JPH02125413A (ja) 1990-05-14

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971129