GB2246471B - Cooling semiconductor devices - Google Patents

Cooling semiconductor devices

Info

Publication number
GB2246471B
GB2246471B GB9117666A GB9117666A GB2246471B GB 2246471 B GB2246471 B GB 2246471B GB 9117666 A GB9117666 A GB 9117666A GB 9117666 A GB9117666 A GB 9117666A GB 2246471 B GB2246471 B GB 2246471B
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
cooling semiconductor
cooling
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9117666A
Other versions
GB2246471A (en
GB9117666D0 (en
Inventor
Nobuo Mikoshiba
Kazuo Tsubouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP20976488A external-priority patent/JPH0258254A/en
Priority claimed from JP63209765A external-priority patent/JPH07120735B2/en
Application filed by Individual filed Critical Individual
Priority to GB9117666A priority Critical patent/GB2246471B/en
Publication of GB9117666D0 publication Critical patent/GB9117666D0/en
Publication of GB2246471A publication Critical patent/GB2246471A/en
Application granted granted Critical
Publication of GB2246471B publication Critical patent/GB2246471B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9117666A 1988-08-23 1991-08-15 Cooling semiconductor devices Expired - Fee Related GB2246471B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9117666A GB2246471B (en) 1988-08-23 1991-08-15 Cooling semiconductor devices

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP20976488A JPH0258254A (en) 1988-08-23 1988-08-23 Semiconductor element
JP63209765A JPH07120735B2 (en) 1988-08-23 1988-08-23 Semiconductor chip
GB9117666A GB2246471B (en) 1988-08-23 1991-08-15 Cooling semiconductor devices

Publications (3)

Publication Number Publication Date
GB9117666D0 GB9117666D0 (en) 1991-10-02
GB2246471A GB2246471A (en) 1992-01-29
GB2246471B true GB2246471B (en) 1993-07-28

Family

ID=27265826

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9117666A Expired - Fee Related GB2246471B (en) 1988-08-23 1991-08-15 Cooling semiconductor devices

Country Status (1)

Country Link
GB (1) GB2246471B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2276032B (en) * 1993-03-08 1997-04-16 Prp Optoelectronics Limited High intensity light source
US7067406B2 (en) 1997-03-31 2006-06-27 Intel Corporation Thermal conducting trench in a semiconductor structure and method for forming the same
US6222254B1 (en) * 1997-03-31 2001-04-24 Intel Corporation Thermal conducting trench in a semiconductor structure and method for forming the same
US6785137B2 (en) 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3567506A (en) * 1968-03-22 1971-03-02 Hughes Aircraft Co Method for providing a planar transistor with heat-dissipating top base and emitter contacts
US3609474A (en) * 1969-11-10 1971-09-28 Texas Instruments Inc Semiconductor with improved heat dissipation characteristics
GB1587865A (en) * 1976-12-06 1981-04-08 Ibm Electrical components
WO1983002527A1 (en) * 1982-01-07 1983-07-21 Ncr Co Holding device for an integrated circuit chip
EP0201170A1 (en) * 1985-04-12 1986-11-12 Raymonde Gene Clifford Artus Heat sink
EP0224141A2 (en) * 1985-11-21 1987-06-03 General Electric Company Improved semiconductor power devices
US4715430A (en) * 1986-10-27 1987-12-29 International Business Machines Corporation Environmentally secure and thermally efficient heat sink assembly
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
GB2214719A (en) * 1988-01-26 1989-09-06 Gen Electric Co Plc Housing for electronic devices
EP0368743A2 (en) * 1988-11-10 1990-05-16 Mcnc High performance integrated circuit chip package and method of making same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3567506A (en) * 1968-03-22 1971-03-02 Hughes Aircraft Co Method for providing a planar transistor with heat-dissipating top base and emitter contacts
US3609474A (en) * 1969-11-10 1971-09-28 Texas Instruments Inc Semiconductor with improved heat dissipation characteristics
GB1587865A (en) * 1976-12-06 1981-04-08 Ibm Electrical components
WO1983002527A1 (en) * 1982-01-07 1983-07-21 Ncr Co Holding device for an integrated circuit chip
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
EP0201170A1 (en) * 1985-04-12 1986-11-12 Raymonde Gene Clifford Artus Heat sink
EP0224141A2 (en) * 1985-11-21 1987-06-03 General Electric Company Improved semiconductor power devices
US4715430A (en) * 1986-10-27 1987-12-29 International Business Machines Corporation Environmentally secure and thermally efficient heat sink assembly
GB2214719A (en) * 1988-01-26 1989-09-06 Gen Electric Co Plc Housing for electronic devices
EP0368743A2 (en) * 1988-11-10 1990-05-16 Mcnc High performance integrated circuit chip package and method of making same

Also Published As

Publication number Publication date
GB2246471A (en) 1992-01-29
GB9117666D0 (en) 1991-10-02

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040818