IT1163693B - Processo ed apparecchiatura di attacco mediante plasma - Google Patents

Processo ed apparecchiatura di attacco mediante plasma

Info

Publication number
IT1163693B
IT1163693B IT25046/79A IT2504679A IT1163693B IT 1163693 B IT1163693 B IT 1163693B IT 25046/79 A IT25046/79 A IT 25046/79A IT 2504679 A IT2504679 A IT 2504679A IT 1163693 B IT1163693 B IT 1163693B
Authority
IT
Italy
Prior art keywords
plasma
attachment equipment
attachment
equipment
Prior art date
Application number
IT25046/79A
Other languages
English (en)
Other versions
IT7925046A0 (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7925046A0 publication Critical patent/IT7925046A0/it
Application granted granted Critical
Publication of IT1163693B publication Critical patent/IT1163693B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/517—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S422/00—Chemical apparatus and process disinfecting, deodorizing, preserving, or sterilizing
    • Y10S422/906—Plasma or ion generation means

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Vapour Deposition (AREA)
IT25046/79A 1978-08-21 1979-08-10 Processo ed apparecchiatura di attacco mediante plasma IT1163693B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/934,733 US4183780A (en) 1978-08-21 1978-08-21 Photon enhanced reactive ion etching

Publications (2)

Publication Number Publication Date
IT7925046A0 IT7925046A0 (it) 1979-08-10
IT1163693B true IT1163693B (it) 1987-04-08

Family

ID=25465975

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25046/79A IT1163693B (it) 1978-08-21 1979-08-10 Processo ed apparecchiatura di attacco mediante plasma

Country Status (5)

Country Link
US (1) US4183780A (it)
EP (1) EP0009558B1 (it)
JP (1) JPS5528390A (it)
DE (1) DE2962446D1 (it)
IT (1) IT1163693B (it)

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US4246296A (en) * 1979-02-14 1981-01-20 Bell Telephone Laboratories, Incorporated Controlling the properties of native films using selective growth chemistry
US4340461A (en) * 1980-09-10 1982-07-20 International Business Machines Corp. Modified RIE chamber for uniform silicon etching
JPS6034085B2 (ja) 1981-04-20 1985-08-07 松下電器産業株式会社 カラ−フイルタの製造方法
US4331504A (en) * 1981-06-25 1982-05-25 International Business Machines Corporation Etching process with vibrationally excited SF6
US4454835A (en) * 1982-09-13 1984-06-19 The United States Of America As Represented By The Secretary Of The Navy Internal photolysis reactor
JPS59135730A (ja) * 1983-01-24 1984-08-04 Hitachi Ltd 表面改質装置
JPS59207631A (ja) * 1983-05-11 1984-11-24 Semiconductor Res Found 光化学を用いたドライプロセス装置
JPH0622212B2 (ja) * 1983-05-31 1994-03-23 株式会社東芝 ドライエッチング方法
US4496448A (en) * 1983-10-13 1985-01-29 At&T Bell Laboratories Method for fabricating devices with DC bias-controlled reactive ion etching
US6784033B1 (en) 1984-02-15 2004-08-31 Semiconductor Energy Laboratory Co., Ltd. Method for the manufacture of an insulated gate field effect semiconductor device
US4505949A (en) * 1984-04-25 1985-03-19 Texas Instruments Incorporated Thin film deposition using plasma-generated source gas
KR920004171B1 (ko) * 1984-07-11 1992-05-30 가부시기가이샤 히다찌세이사꾸쇼 드라이에칭장치
EP0169485B1 (en) * 1984-07-17 1991-12-04 Nec Corporation Method and apparatus for inducing photochemical reaction
US4624736A (en) * 1984-07-24 1986-11-25 The United States Of America As Represented By The United States Department Of Energy Laser/plasma chemical processing of substrates
JPS6175529A (ja) * 1984-09-21 1986-04-17 Toshiba Corp ドライエツチング方法及び装置
US6786997B1 (en) 1984-11-26 2004-09-07 Semiconductor Energy Laboratory Co., Ltd. Plasma processing apparatus
JPH0752718B2 (ja) 1984-11-26 1995-06-05 株式会社半導体エネルギー研究所 薄膜形成方法
US6113701A (en) 1985-02-14 2000-09-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method, and system
US4668304A (en) * 1985-04-10 1987-05-26 Eaton Corporation Dopant gettering semiconductor processing by excimer laser
US4687544A (en) * 1985-05-17 1987-08-18 Emergent Technologies Corporation Method and apparatus for dry processing of substrates
US5769950A (en) * 1985-07-23 1998-06-23 Canon Kabushiki Kaisha Device for forming deposited film
US6077718A (en) * 1985-07-23 2000-06-20 Canon Kabushiki Kaisha Method for forming deposited film
US5261961A (en) * 1985-07-23 1993-11-16 Canon Kabushiki Kaisha Device for forming deposited film
US5512102A (en) * 1985-10-14 1996-04-30 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD system under magnetic field
US6673722B1 (en) 1985-10-14 2004-01-06 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD system under magnetic field
US6230650B1 (en) 1985-10-14 2001-05-15 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD system under magnetic field
JPS6314434A (ja) * 1986-07-04 1988-01-21 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
US4974542A (en) * 1986-09-26 1990-12-04 Semiconductor Energy Laboratory Co., Ltd. Photochemical vapor reaction apparatus
US4916091A (en) * 1987-11-05 1990-04-10 Texas Instruments Incorporated Plasma and plasma UV deposition of SiO2
US4843030A (en) * 1987-11-30 1989-06-27 Eaton Corporation Semiconductor processing by a combination of photolytic, pyrolytic and catalytic processes
US4913789A (en) * 1988-04-18 1990-04-03 Aung David K Sputter etching and coating process
US5174881A (en) * 1988-05-12 1992-12-29 Mitsubishi Denki Kabushiki Kaisha Apparatus for forming a thin film on surface of semiconductor substrate
US5407867A (en) * 1988-05-12 1995-04-18 Mitsubishki Denki Kabushiki Kaisha Method of forming a thin film on surface of semiconductor substrate
JPH0622218B2 (ja) * 1988-08-06 1994-03-23 富士通株式会社 エッチング方法
KR930011413B1 (ko) * 1990-09-25 1993-12-06 가부시키가이샤 한도오따이 에네루기 겐큐쇼 펄스형 전자파를 사용한 플라즈마 cvd 법
US5380503A (en) * 1992-03-13 1995-01-10 Ebara Research Co., Ltd. Stocker
US5565036A (en) * 1994-01-19 1996-10-15 Tel America, Inc. Apparatus and method for igniting plasma in a process module
US5580421A (en) * 1994-06-14 1996-12-03 Fsi International Apparatus for surface conditioning
JPH0864559A (ja) * 1994-06-14 1996-03-08 Fsi Internatl Inc 基板面から不要な物質を除去する方法
US6015503A (en) * 1994-06-14 2000-01-18 Fsi International, Inc. Method and apparatus for surface conditioning
US6124211A (en) * 1994-06-14 2000-09-26 Fsi International, Inc. Cleaning method
US5534107A (en) * 1994-06-14 1996-07-09 Fsi International UV-enhanced dry stripping of silicon nitride films
US5635102A (en) 1994-09-28 1997-06-03 Fsi International Highly selective silicon oxide etching method
US8653213B2 (en) 1997-02-03 2014-02-18 Cytonix, Llc Hydrophobic coating compositions and articles coated with said compositions
US5853894A (en) * 1997-02-03 1998-12-29 Cytonix Corporation Laboratory vessel having hydrophobic coating and process for manufacturing same
US6495624B1 (en) 1997-02-03 2002-12-17 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US6156389A (en) * 1997-02-03 2000-12-05 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US7268179B2 (en) * 1997-02-03 2007-09-11 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US6165273A (en) 1997-10-21 2000-12-26 Fsi International Inc. Equipment for UV wafer heating and photochemistry
US6265033B1 (en) 1998-09-11 2001-07-24 Donald Bennett Hilliard Method for optically coupled vapor deposition
US6136210A (en) * 1998-11-02 2000-10-24 Xerox Corporation Photoetching of acoustic lenses for acoustic ink printing
US6569775B1 (en) 1999-03-30 2003-05-27 Applied Materials, Inc. Method for enhancing plasma processing performance
US6515785B1 (en) * 1999-04-22 2003-02-04 3M Innovative Properties Company Optical devices using reflecting polarizing materials
US20090155487A1 (en) * 2007-12-13 2009-06-18 International Business Machines Corporation Ultraviolet uv photo processing or curing of thin films with surface treatment
US20140335695A1 (en) * 2013-05-10 2014-11-13 Applied Materials, Inc. External uv light sources to minimize asymmetric resist pattern trimming rate for three dimensional semiconductor chip manufacture
US11230766B2 (en) * 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
NL275192A (it) * 1961-06-30
US3095341A (en) * 1961-06-30 1963-06-25 Bell Telephone Labor Inc Photosensitive gas phase etching of semiconductors by selective radiation
DE1298851B (de) * 1963-12-02 1969-07-03 Steigerwald Verfahren zur Materialbearbeitung mittels Strahlungsenergie
DD63253A3 (it) * 1966-12-05 1968-08-05
US3536547A (en) * 1968-03-25 1970-10-27 Bell Telephone Labor Inc Plasma deposition of oxide coatings on silicon and electron bombardment of portions thereof to be etched selectively
US3551213A (en) * 1968-09-04 1970-12-29 Bell Telephone Labor Inc Geometrically selective ion bombardment by means of the photoelectric effect
US3738926A (en) * 1972-03-28 1973-06-12 Bell Canada Method and apparatus for controlling the electrical properties of sputtered films
US3791952A (en) * 1972-07-24 1974-02-12 Bell Telephone Labor Inc Method for neutralizing charge in semiconductor bodies and dielectric coatings induced by cathodic etching
GB1417085A (en) * 1973-05-17 1975-12-10 Standard Telephones Cables Ltd Plasma etching
US3880684A (en) * 1973-08-03 1975-04-29 Mitsubishi Electric Corp Process for preparing semiconductor
US3918383A (en) * 1974-04-18 1975-11-11 Richard Brown Anti-noise device for the masts of sailing vessels and the like and methods for preventing noise
US4123663A (en) * 1975-01-22 1978-10-31 Tokyo Shibaura Electric Co., Ltd. Gas-etching device
FR2308200A1 (fr) * 1975-04-18 1976-11-12 Burroughs Corp Installation de fabrication de semi-conducteurs et procede pour une telle fabrication
DE2536718C3 (de) * 1975-08-18 1978-04-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung geätzter Strukturen in Festkörperoberflächen durch Ionenätzung und Bestrahlungsmaske zur Verwendung in diesem Verfahren
GB1498459A (en) * 1975-12-23 1978-01-18 Phizi I Im P N Lebedeva An Sss Growing semiconductor epitaxial films
NL7607298A (nl) * 1976-07-02 1978-01-04 Philips Nv Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd volgens de werkwijze.
DE2716592C3 (de) * 1976-04-15 1979-11-08 Hitachi, Ltd., Tokio Plasma-Ätzvorrichtung
JPS53112066A (en) * 1977-03-11 1978-09-30 Fujitsu Ltd Plasma treatment apparatus

Also Published As

Publication number Publication date
JPS5614749B2 (it) 1981-04-06
US4183780A (en) 1980-01-15
IT7925046A0 (it) 1979-08-10
EP0009558B1 (de) 1982-04-07
JPS5528390A (en) 1980-02-28
EP0009558A1 (de) 1980-04-16
DE2962446D1 (en) 1982-05-19

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