IT1091341B - Procedimento per la produzione di materiali thinclad per circuiti stampati - Google Patents

Procedimento per la produzione di materiali thinclad per circuiti stampati

Info

Publication number
IT1091341B
IT1091341B IT52423/77A IT5242377A IT1091341B IT 1091341 B IT1091341 B IT 1091341B IT 52423/77 A IT52423/77 A IT 52423/77A IT 5242377 A IT5242377 A IT 5242377A IT 1091341 B IT1091341 B IT 1091341B
Authority
IT
Italy
Prior art keywords
thinclad
procedure
materials
production
printed circuits
Prior art date
Application number
IT52423/77A
Other languages
English (en)
Italian (it)
Original Assignee
Ferrozell Sachs & Co Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferrozell Sachs & Co Gmbh filed Critical Ferrozell Sachs & Co Gmbh
Application granted granted Critical
Publication of IT1091341B publication Critical patent/IT1091341B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulating Bodies (AREA)
  • Physical Vapour Deposition (AREA)
IT52423/77A 1976-12-30 1977-12-29 Procedimento per la produzione di materiali thinclad per circuiti stampati IT1091341B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2659625A DE2659625C3 (de) 1976-12-30 1976-12-30 Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen

Publications (1)

Publication Number Publication Date
IT1091341B true IT1091341B (it) 1985-07-06

Family

ID=5997078

Family Applications (1)

Application Number Title Priority Date Filing Date
IT52423/77A IT1091341B (it) 1976-12-30 1977-12-29 Procedimento per la produzione di materiali thinclad per circuiti stampati

Country Status (11)

Country Link
JP (1) JPS53111480A (de)
BE (1) BE862476A (de)
BR (1) BR7708768A (de)
CH (1) CH627405A5 (de)
DE (1) DE2659625C3 (de)
ES (1) ES466030A1 (de)
FR (1) FR2376593A1 (de)
GB (1) GB1595245A (de)
IT (1) IT1091341B (de)
NL (1) NL7714506A (de)
SE (1) SE7714867L (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486875A1 (fr) * 1980-07-17 1982-01-22 Dassault Avions Procede pour metalliser au moins partiellement la surface d'une piece stratifiee
DE3631055C1 (de) * 1986-09-12 1987-05-21 Deutsche Automobilgesellsch Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung
JPH0648384Y2 (ja) * 1988-06-28 1994-12-12 株式会社千代田製作所 標本整理用スライドガラスアダプタ
CN107529293B (zh) * 2017-09-18 2019-05-28 Oppo广东移动通信有限公司 一种移动终端、多层pcb电路板及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL135706C (de) * 1966-07-29 1900-01-01
DE1646064C3 (de) * 1966-12-29 1978-05-24 Politechnika Slaska Im. Wincentego Pstrowskiego, Gleiwitz (Polen) Verfahren zur Herstellung von mit Polyesterharzen beschichteten Metallfolien für elektro- und radiotechnische sowie elektronische Zwecke
DE1690025B2 (de) * 1967-08-09 1976-10-07 Schering Ag, 1000 Berlin Und 4619 Bergkamen Vorbehandlungsverfahren fuer duenne isolierfolien aus polyaethylenterephthalat
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes
DE2413932C2 (de) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise
JPS5143571A (ja) * 1974-10-09 1976-04-14 Hiroki Katsuki Keesuisosochi

Also Published As

Publication number Publication date
SE7714867L (sv) 1978-07-01
BE862476A (fr) 1978-04-14
DE2659625B2 (de) 1979-01-11
BR7708768A (pt) 1978-09-05
ES466030A1 (es) 1978-10-01
NL7714506A (nl) 1978-07-04
DE2659625A1 (de) 1978-07-06
GB1595245A (en) 1981-08-12
FR2376593B1 (de) 1980-07-04
CH627405A5 (en) 1982-01-15
DE2659625C3 (de) 1981-07-02
JPS53111480A (en) 1978-09-29
FR2376593A1 (fr) 1978-07-28
JPS5731675B2 (de) 1982-07-06

Similar Documents

Publication Publication Date Title
IT1064451B (it) Procedimento per la fabbricazione di pannelli di circuiti stampati
IT1079559B (it) Apparecchiatura automatizzata per la fabbricazione di circuiti integrati
IT1115712B (it) Apparecchiatura perfezionata per la fabbricazione di circuiti integrati
IT1063394B (it) Procedimento perfezionato per la fabbricazione di circuiti integrati
FR2336801A1 (fr) Circuit integre
IT1063554B (it) Procedimento per la fabbricazione di circuiti integrati
IT1091374B (it) Procedimento per la fabbricazione di piastre conduttici rigido flessibili particolarmente per circuiti stampati
IT1206367B (it) Struttura perfezionata di circuiti multistrato.
IT1064171B (it) Procedimento per la fabbricazione di circuiti integrati
FR2319236A1 (fr) Circuit redresseur
FR2335052A1 (fr) Circuit integre
IT1130622B (it) Processo per la fabbricazione di circuiti stampati
FR2375955B1 (fr) Machine pour la fabrication de micro-assemblages electroniques
FI773455A (fi) Anordning foer avskiljande av en vaetska ur en uppslamning
IT1063602B (it) Procedimento perfezionato per la fabbricazione di circuiti integrati
IT1080135B (it) Apparecchiatura per trasporto di materiali
IT1090820B (it) Procedimento per la produzione di circuiti integrati e prodotto ottenuto
IT1143594B (it) Procedimento per la produzione di piridine sostituite
IT1077233B (it) Procedimento per la metallofobizzazione di oggetti,in particolare di materiali isolanti per circuiti stampati
IT1035743B (it) Prucedimento per la produzione di circuiti stampati e prodtto ottnuto
IT1091341B (it) Procedimento per la produzione di materiali thinclad per circuiti stampati
IT1059604B (it) Procedimento per la fabbricazione di circuiti stampati con contatti passanti
SE428658B (sv) Anordning for framstellning av rorformade halkroppar
IT1025191B (it) Procedimento perfezionato per la fabbricazione di circuiti integrati
IT1131716B (it) Procedimento di fabbricazione di circuiti stampati