IT1091341B - PROCEDURE FOR THE PRODUCTION OF THINCLAD MATERIALS FOR PRINTED CIRCUITS - Google Patents

PROCEDURE FOR THE PRODUCTION OF THINCLAD MATERIALS FOR PRINTED CIRCUITS

Info

Publication number
IT1091341B
IT1091341B IT52423/77A IT5242377A IT1091341B IT 1091341 B IT1091341 B IT 1091341B IT 52423/77 A IT52423/77 A IT 52423/77A IT 5242377 A IT5242377 A IT 5242377A IT 1091341 B IT1091341 B IT 1091341B
Authority
IT
Italy
Prior art keywords
thinclad
procedure
materials
production
printed circuits
Prior art date
Application number
IT52423/77A
Other languages
Italian (it)
Original Assignee
Ferrozell Sachs & Co Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferrozell Sachs & Co Gmbh filed Critical Ferrozell Sachs & Co Gmbh
Application granted granted Critical
Publication of IT1091341B publication Critical patent/IT1091341B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
IT52423/77A 1976-12-30 1977-12-29 PROCEDURE FOR THE PRODUCTION OF THINCLAD MATERIALS FOR PRINTED CIRCUITS IT1091341B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2659625A DE2659625C3 (en) 1976-12-30 1976-12-30 Process for the production of base material for the production of printed circuits

Publications (1)

Publication Number Publication Date
IT1091341B true IT1091341B (en) 1985-07-06

Family

ID=5997078

Family Applications (1)

Application Number Title Priority Date Filing Date
IT52423/77A IT1091341B (en) 1976-12-30 1977-12-29 PROCEDURE FOR THE PRODUCTION OF THINCLAD MATERIALS FOR PRINTED CIRCUITS

Country Status (11)

Country Link
JP (1) JPS53111480A (en)
BE (1) BE862476A (en)
BR (1) BR7708768A (en)
CH (1) CH627405A5 (en)
DE (1) DE2659625C3 (en)
ES (1) ES466030A1 (en)
FR (1) FR2376593A1 (en)
GB (1) GB1595245A (en)
IT (1) IT1091341B (en)
NL (1) NL7714506A (en)
SE (1) SE7714867L (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486875A1 (en) * 1980-07-17 1982-01-22 Dassault Avions PROCESS FOR METALLIZING AT LEAST PARTIALLY THE SURFACE OF A LAMINATED PIECE
DE3631055C1 (en) * 1986-09-12 1987-05-21 Deutsche Automobilgesellsch Process for the continuous draining of nonwoven or needle felt webs with an activation solution
JPH0648384Y2 (en) * 1988-06-28 1994-12-12 株式会社千代田製作所 Slide glass adapter for specimen organization
CN107529293B (en) * 2017-09-18 2019-05-28 Oppo广东移动通信有限公司 A kind of mobile terminal, multilayer PCB circuit board and its manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL135706C (en) * 1966-07-29 1900-01-01
DE1646064C3 (en) * 1966-12-29 1978-05-24 Politechnika Slaska Im. Wincentego Pstrowskiego, Gleiwitz (Polen) Process for the production of metal foils coated with polyester resins for electrical, radio and electronic purposes
DE1690025B2 (en) * 1967-08-09 1976-10-07 Schering Ag, 1000 Berlin Und 4619 Bergkamen PRE-TREATMENT PROCESS FOR THIN INSULATING FILMS MADE OF POLYAETHYLENE TEREPHTHALATE
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
DE2413932C2 (en) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Process for the manufacture of a composite film for the formation of printed circuits
JPS5143571A (en) * 1974-10-09 1976-04-14 Hiroki Katsuki KEESUISOSOCHI

Also Published As

Publication number Publication date
DE2659625C3 (en) 1981-07-02
SE7714867L (en) 1978-07-01
CH627405A5 (en) 1982-01-15
FR2376593A1 (en) 1978-07-28
ES466030A1 (en) 1978-10-01
DE2659625A1 (en) 1978-07-06
BE862476A (en) 1978-04-14
GB1595245A (en) 1981-08-12
JPS5731675B2 (en) 1982-07-06
FR2376593B1 (en) 1980-07-04
NL7714506A (en) 1978-07-04
DE2659625B2 (en) 1979-01-11
JPS53111480A (en) 1978-09-29
BR7708768A (en) 1978-09-05

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