IT1064051B - Nastro elettroconduttore - Google Patents

Nastro elettroconduttore

Info

Publication number
IT1064051B
IT1064051B IT24540/76A IT2454076A IT1064051B IT 1064051 B IT1064051 B IT 1064051B IT 24540/76 A IT24540/76 A IT 24540/76A IT 2454076 A IT2454076 A IT 2454076A IT 1064051 B IT1064051 B IT 1064051B
Authority
IT
Italy
Prior art keywords
electroconductive tape
electroconductive
tape
Prior art date
Application number
IT24540/76A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1064051B publication Critical patent/IT1064051B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
IT24540/76A 1975-06-24 1976-06-22 Nastro elettroconduttore IT1064051B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752528119 DE2528119A1 (de) 1975-06-24 1975-06-24 Elektrisch leitendes band

Publications (1)

Publication Number Publication Date
IT1064051B true IT1064051B (it) 1985-02-18

Family

ID=5949834

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24540/76A IT1064051B (it) 1975-06-24 1976-06-22 Nastro elettroconduttore

Country Status (5)

Country Link
JP (1) JPS523384A (ref)
DE (1) DE2528119A1 (ref)
FR (1) FR2315770A1 (ref)
GB (1) GB1511415A (ref)
IT (1) IT1064051B (ref)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
JPS5793559A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS57117265A (en) * 1981-01-13 1982-07-21 Nec Corp Semiconductor device
JPS57134941A (en) * 1981-02-13 1982-08-20 Nec Corp Semiconductor device
JPS57145356A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor device
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
JPS59128736U (ja) * 1984-01-17 1984-08-30 日本電気株式会社 半導体集積回路装置
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
AU2003216033A1 (en) * 2003-02-24 2004-09-17 Infineon Technologies Ag A plastics leadframe and an integrated circuit package fabricated using the leadframe
JP5737966B2 (ja) * 2011-01-25 2015-06-17 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193519A (en) * 1967-08-31 1970-06-03 Texas Instruments Ltd Semiconductor Devices
GB1306031A (ref) * 1971-01-01 1973-02-07
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process

Also Published As

Publication number Publication date
DE2528119A1 (de) 1977-01-20
FR2315770A1 (fr) 1977-01-21
GB1511415A (en) 1978-05-17
JPS523384A (en) 1977-01-11
FR2315770B1 (ref) 1982-10-22

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