IN2015DN02361A - - Google Patents

Info

Publication number
IN2015DN02361A
IN2015DN02361A IN2361DEN2015A IN2015DN02361A IN 2015DN02361 A IN2015DN02361 A IN 2015DN02361A IN 2361DEN2015 A IN2361DEN2015 A IN 2361DEN2015A IN 2015DN02361 A IN2015DN02361 A IN 2015DN02361A
Authority
IN
India
Prior art keywords
copper
aluminum
intermetallic
bonding
interface
Prior art date
Application number
Other languages
English (en)
Inventor
Nobuyuki Terasaki
Yosliiyuki NAGATOMO
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2015DN02361A publication Critical patent/IN2015DN02361A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334Auxiliary members in encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266O, S, or organic compound in metal component
    • Y10T428/12667Oxide of transition metal or Al

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IN2361DEN2015 2012-09-21 2013-09-18 IN2015DN02361A (en:Method)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012208578 2012-09-21
PCT/JP2013/075158 WO2014046130A1 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Publications (1)

Publication Number Publication Date
IN2015DN02361A true IN2015DN02361A (en:Method) 2015-09-04

Family

ID=50341440

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2361DEN2015 IN2015DN02361A (en:Method) 2012-09-21 2013-09-18

Country Status (8)

Country Link
US (1) US10011093B2 (en:Method)
EP (1) EP2898979B1 (en:Method)
JP (1) JP5549958B2 (en:Method)
KR (1) KR102051697B1 (en:Method)
CN (1) CN104661785B (en:Method)
IN (1) IN2015DN02361A (en:Method)
TW (1) TWI589382B (en:Method)
WO (1) WO2014046130A1 (en:Method)

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US10011093B2 (en) 2012-09-21 2018-07-03 Mitsubishi Materials Corporation Bonding structure of aluminum member and copper member
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JP6428327B2 (ja) * 2015-02-04 2018-11-28 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、パワーモジュール、及び、ヒートシンク付パワーモジュール用基板の製造方法
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US10242932B2 (en) 2016-06-24 2019-03-26 Infineon Technologies Ag LDMOS transistor and method
US9960229B2 (en) 2016-06-24 2018-05-01 Infineon Technologies Ag Semiconductor device including a LDMOS transistor
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JP6819385B2 (ja) * 2017-03-17 2021-01-27 三菱マテリアル株式会社 半導体装置の製造方法
WO2018180159A1 (ja) 2017-03-29 2018-10-04 三菱マテリアル株式会社 ヒートシンク付き絶縁回路基板の製造方法
JP6972627B2 (ja) * 2017-04-05 2021-11-24 株式会社アイシン カーボンナノチューブ複合体の製造方法及び積層体
EP3780085A4 (en) * 2018-03-28 2021-12-29 Mitsubishi Materials Corporation Insulated circuit board with heat sink
JP7342371B2 (ja) * 2019-02-14 2023-09-12 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
KR20210127009A (ko) 2020-04-13 2021-10-21 주식회사 엘지에너지솔루션 전지 모듈 및 그 제조 방법
JP7643163B2 (ja) * 2021-04-27 2025-03-11 三菱マテリアル株式会社 ヒートシンク、および、ヒートシンク一体型絶縁回路基板
TWI800244B (zh) * 2022-01-28 2023-04-21 奇鋐科技股份有限公司 具有熱管之散熱器總成

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Also Published As

Publication number Publication date
EP2898979A1 (en) 2015-07-29
KR20150056534A (ko) 2015-05-26
TWI589382B (zh) 2017-07-01
TW201433392A (zh) 2014-09-01
EP2898979B1 (en) 2019-03-06
EP2898979A4 (en) 2016-06-08
US20150251382A1 (en) 2015-09-10
JP5549958B2 (ja) 2014-07-16
WO2014046130A1 (ja) 2014-03-27
CN104661785B (zh) 2017-05-03
CN104661785A (zh) 2015-05-27
JP2014076486A (ja) 2014-05-01
US10011093B2 (en) 2018-07-03
KR102051697B1 (ko) 2019-12-03

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