IN2014DN09175A - - Google Patents
Info
- Publication number
- IN2014DN09175A IN2014DN09175A IN9175DEN2014A IN2014DN09175A IN 2014DN09175 A IN2014DN09175 A IN 2014DN09175A IN 9175DEN2014 A IN9175DEN2014 A IN 9175DEN2014A IN 2014DN09175 A IN2014DN09175 A IN 2014DN09175A
- Authority
- IN
- India
- Prior art keywords
- reflow oven
- contaminants
- intermediate layer
- foam material
- chamber housing
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/3077—Arrangements for treating electronic components, e.g. semiconductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/32—Casings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/32—Casings
- F27B9/34—Arrangements of linings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/16—Making or repairing linings increasing the durability of linings or breaking away linings
- F27D1/1678—Increasing the durability of linings; Means for protecting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D17/00—Arrangements for using waste heat; Arrangements for using, or disposing of, waste gases
- F27D17/008—Arrangements for using waste heat; Arrangements for using, or disposing of, waste gases cleaning gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/437,530 US9170051B2 (en) | 2012-04-02 | 2012-04-02 | Reflow oven and methods of treating surfaces of the reflow oven |
PCT/US2013/034234 WO2013151853A1 (en) | 2012-04-02 | 2013-03-28 | Reflow oven and methods of treating surfaces of the reflow oven |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DN09175A true IN2014DN09175A (ko) | 2015-07-10 |
Family
ID=48096295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN9175DEN2014 IN2014DN09175A (ko) | 2012-04-02 | 2013-03-28 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9170051B2 (ko) |
EP (1) | EP2834579B1 (ko) |
KR (1) | KR101993025B1 (ko) |
CN (1) | CN104321604B (ko) |
IN (1) | IN2014DN09175A (ko) |
SG (1) | SG11201407061RA (ko) |
TW (1) | TWI605235B (ko) |
WO (1) | WO2013151853A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9226407B2 (en) * | 2002-07-01 | 2015-12-29 | Semigear Inc | Reflow treating unit and substrate treating apparatus |
US8940099B2 (en) | 2012-04-02 | 2015-01-27 | Illinois Tool Works Inc. | Reflow oven and methods of treating surfaces of the reflow oven |
US9808891B2 (en) * | 2014-01-16 | 2017-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Tool and method of reflow |
US20160339486A1 (en) * | 2015-05-21 | 2016-11-24 | Illinois Tool Works Inc. | Reflow oven liner, system and method |
CN104942397B (zh) * | 2015-07-11 | 2018-03-16 | 哈尔滨工业大学(威海) | 真空多室表面活化辅助连接复合装备 |
USD821814S1 (en) * | 2016-11-30 | 2018-07-03 | Illinois Tool Works, Inc. | Convection airflow control plate |
CN110385497A (zh) * | 2018-04-20 | 2019-10-29 | 伊利诺斯工具制品有限公司 | 回流焊炉和回流焊炉中的调温单元 |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4775776A (en) | 1983-02-28 | 1988-10-04 | Electrovert Limited | Multi stage heater |
US5069380A (en) | 1990-06-13 | 1991-12-03 | Carlos Deambrosio | Inerted IR soldering system |
JP3375672B2 (ja) * | 1992-05-29 | 2003-02-10 | 千住金属工業株式会社 | フラックスの除去方法 |
JP3273195B2 (ja) | 1992-06-26 | 2002-04-08 | オキツモ株式会社 | 耐熱非粘着性皮膜 |
JP2634356B2 (ja) | 1992-07-08 | 1997-07-23 | 日本碍子株式会社 | ロータリーキルン |
US5193735A (en) | 1992-07-13 | 1993-03-16 | Knight Electronics, Inc. | Solder reflow oven |
NL9202279A (nl) | 1992-07-29 | 1994-02-16 | Soltec Bv | Reflow-soldeermachine. |
US5389138A (en) | 1993-03-31 | 1995-02-14 | Kay Chemical Company | Oven pretreatment and cleaning composition containing silicone |
US5271545A (en) | 1993-03-31 | 1993-12-21 | Seco/Warwick Corporation | Muffle convection brazing/annealing system |
US5440101A (en) | 1993-04-19 | 1995-08-08 | Research, Incorporated | Continuous oven with a plurality of heating zones |
US5347103A (en) | 1993-08-31 | 1994-09-13 | Btu International | Convection furnace using shimmed gas amplifier |
US6145734A (en) | 1996-04-16 | 2000-11-14 | Matsushita Electric Industrial Co., Ltd. | Reflow method and reflow device |
US5971246A (en) | 1996-05-08 | 1999-10-26 | Motorola, Inc. | Oven for reflowing circuit board assemblies and method therefor |
JP4023698B2 (ja) | 1996-11-15 | 2007-12-19 | シチズン電子株式会社 | 下面電極付き側面使用電子部品の製造方法 |
JPH10200253A (ja) | 1997-01-08 | 1998-07-31 | Sanyo Electric Co Ltd | リフロー炉 |
US5911486A (en) | 1997-02-26 | 1999-06-15 | Conceptronic, Inc. | Combination product cooling and flux management apparatus |
JPH1154903A (ja) | 1997-07-31 | 1999-02-26 | Fujitsu Ltd | リフローソルダリング方法及びリフロー炉 |
NL1009214C2 (nl) | 1998-05-19 | 1999-12-07 | Soltec Bv | Reflowoven. |
US6354481B1 (en) | 1999-02-18 | 2002-03-12 | Speedline Technologies, Inc. | Compact reflow and cleaning apparatus |
US6446855B1 (en) | 1999-02-18 | 2002-09-10 | Speedline Technologies, Inc. | Compact reflow and cleaning apparatus |
US6193774B1 (en) | 1999-02-19 | 2001-02-27 | Conceptronic, Inc. | Reflow solder convection oven with a passive gas decontamination subsystem |
TW516346B (en) | 1999-04-06 | 2003-01-01 | Eighttech Tectron Co Ltd | Device for heating printed-circuit board |
US20020033183A1 (en) | 1999-05-29 | 2002-03-21 | Sheng Sun | Method and apparatus for enhanced chamber cleaning |
JP2001170767A (ja) | 1999-12-10 | 2001-06-26 | Hitachi Ltd | はんだ付け装置 |
CN1302254C (zh) | 2000-02-02 | 2007-02-28 | Btu国际公司 | 模块式炉子系统 |
JP3515058B2 (ja) | 2000-08-14 | 2004-04-05 | 有限会社ヨコタテクニカ | リフロー半田付け装置 |
JP3581828B2 (ja) | 2000-12-25 | 2004-10-27 | 古河電気工業株式会社 | 半田付け用加熱炉 |
US6386422B1 (en) | 2001-05-03 | 2002-05-14 | Asm Assembly Automation Limited | Solder reflow oven |
GB2375975B (en) | 2001-05-30 | 2005-07-20 | Philip Arthur Mullins | Filtering apparatus |
US7159597B2 (en) | 2001-06-01 | 2007-01-09 | Applied Materials, Inc. | Multistep remote plasma clean process |
US6694637B2 (en) | 2002-01-18 | 2004-02-24 | Speedline Technologies, Inc. | Flux collection method and system |
US6749655B2 (en) | 2002-04-17 | 2004-06-15 | Speedline Technologies, Inc. | Filtration of flux contaminants |
DE10392640T5 (de) | 2002-05-16 | 2005-06-30 | Yokota Technica Limited Company | Aufschmelzlötvorrichtung |
US6780225B2 (en) | 2002-05-24 | 2004-08-24 | Vitronics Soltec, Inc. | Reflow oven gas management system and method |
JP2005079466A (ja) | 2003-09-02 | 2005-03-24 | Furukawa Electric Co Ltd:The | 冷却機構を備えたリフロー装置及び該リフロー装置を用いたリフロー炉 |
TW200524500A (en) | 2004-01-07 | 2005-07-16 | Senju Metal Industry Co | Reflow furnace and hot-air blowing-type heater |
US8042727B2 (en) | 2004-03-30 | 2011-10-25 | Tamura Corporation | Heater, reflow apparatus, and solder bump forming method and apparatus |
JP4834559B2 (ja) | 2005-01-17 | 2011-12-14 | 有限会社ヨコタテクニカ | リフロー炉 |
JP4319647B2 (ja) | 2005-06-30 | 2009-08-26 | 株式会社タムラ古河マシナリー | リフロー炉 |
JP2007109841A (ja) | 2005-10-13 | 2007-04-26 | Yokota Technica:Kk | リフロー半田付け装置の洗浄方法及びリフロー半田付け装置 |
JP4721352B2 (ja) | 2006-06-09 | 2011-07-13 | 株式会社タムラ製作所 | リフロー炉 |
WO2008047639A1 (en) | 2006-10-11 | 2008-04-24 | Nikki-Universal Co., Ltd. | Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace |
JP5264079B2 (ja) | 2007-01-12 | 2013-08-14 | 有限会社ヨコタテクニカ | 加熱装置 |
US8110015B2 (en) | 2007-05-30 | 2012-02-07 | Illinois Tool Works, Inc. | Method and apparatus for removing contaminants from a reflow apparatus |
US8372792B2 (en) | 2007-08-08 | 2013-02-12 | Arakawa Chemical Industries, Ltd. | Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux |
US7951244B2 (en) | 2008-01-11 | 2011-05-31 | Illinois Tool Works Inc. | Liquid cleaning apparatus for cleaning printed circuit boards |
US7708183B2 (en) | 2008-03-28 | 2010-05-04 | Illinois Tool Works Inc. | Reflow solder oven with cooling diffuser |
US7967913B2 (en) | 2008-10-22 | 2011-06-28 | Applied Materials, Inc. | Remote plasma clean process with cycled high and low pressure clean steps |
WO2010056543A1 (en) * | 2008-10-29 | 2010-05-20 | 3M Innovative Properties Company | Electron beam cured, nonfunctionalized silicone pressure sensitive adhesives |
JP5540817B2 (ja) | 2010-03-26 | 2014-07-02 | 千住金属工業株式会社 | はんだ付け装置及びフューム回収装置 |
US8196799B2 (en) | 2010-06-28 | 2012-06-12 | Illinois Tool Works Inc. | Compression box for reflow oven heating with a pressurizing plate |
-
2012
- 2012-04-02 US US13/437,530 patent/US9170051B2/en active Active
-
2013
- 2013-03-28 IN IN9175DEN2014 patent/IN2014DN09175A/en unknown
- 2013-03-28 WO PCT/US2013/034234 patent/WO2013151853A1/en active Application Filing
- 2013-03-28 EP EP13716632.8A patent/EP2834579B1/en not_active Not-in-force
- 2013-03-28 CN CN201380026404.1A patent/CN104321604B/zh not_active Expired - Fee Related
- 2013-03-28 KR KR1020147028749A patent/KR101993025B1/ko active IP Right Grant
- 2013-03-28 SG SG11201407061RA patent/SG11201407061RA/en unknown
- 2013-04-02 TW TW102111923A patent/TWI605235B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2834579B1 (en) | 2017-11-01 |
US9170051B2 (en) | 2015-10-27 |
WO2013151853A1 (en) | 2013-10-10 |
KR101993025B1 (ko) | 2019-06-25 |
TW201403014A (zh) | 2014-01-16 |
US20130256389A1 (en) | 2013-10-03 |
KR20140143186A (ko) | 2014-12-15 |
EP2834579A1 (en) | 2015-02-11 |
CN104321604B (zh) | 2017-02-22 |
SG11201407061RA (en) | 2014-11-27 |
TWI605235B (zh) | 2017-11-11 |
CN104321604A (zh) | 2015-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IN2014DN09175A (ko) | ||
PH12018500256A1 (en) | Article for use with apparatus for heating smokable material | |
EA202190239A3 (ru) | Половая панель и способ изготовления половой панели | |
EP3504730A4 (en) | ELECTRONIC POWER DEVICES INTEGRATED IN A TECHNICAL SUBSTRATE | |
EP2543086A4 (en) | SEMICONDUCTOR DEVICES COMPRISING ELECTRICALLY PERCOLATED SOURCE LAYER AND METHODS OF MAKING SAME | |
MY189817A (en) | Aerosol generating material and devices including the same | |
WO2013103948A3 (en) | Wireless power transfer through conductive materials | |
EP2595460A4 (en) | COMPOSITE MATERIAL AND HIGH FREQUENCY SWITCHING SUBSTRATE WITH COMPOSITE MATERIAL AND METHOD OF MANUFACTURING | |
IN2014DN08940A (ko) | ||
TW201615064A (en) | Double-sided circuit board suitable for high-frequency circuit | |
MX2015011602A (es) | Aparato de control electronico y metodo para conectar sustrato de aparato de control electronico. | |
MY177445A (en) | Method of making porous materials and porous materials prepared thereof | |
SG11201810798PA (en) | Resin composition, and sheet, laminate, power semiconductor device, and plasma processing apparatus including the same, and method of producing semiconductor using the same | |
EP2628176A4 (en) | RADIATION HEAT LIGHT BOARD, METHOD FOR THE PRODUCTION THEREOF, PACKAGE WITH A HEAT GENERATING DEVICE THEREFOR AND BACKGROUND LIGHTING | |
IL252916A0 (en) | Flame Retardant Composite Material, Resin Flame Retardant Compound, Metal Composite Material Sublayers, Flame Retardant Flame Retardant and Melastic Flame Retardant Engineering Design | |
GB201201806D0 (en) | Method of making a flexible circuit | |
HK1171901A1 (en) | Flexible printed circuit board and method of manufacturing the same | |
MX2017008582A (es) | Adhesion de tela a un aparato. | |
MX2017007234A (es) | Incorporacion directa de gas natural en combustibles liquidos de hidrocarburo. | |
AU342738S (en) | Electronic board | |
MX2017001463A (es) | Sistema integrado termico a base de espuma dura poliuretanica para fachadas de edificios. | |
MX2018004864A (es) | Estructura de tipo sandwich que incluye un vip y metodo para producir la misma. | |
WO2011116239A3 (en) | Ceramic heating device | |
MX2015010337A (es) | Fabricacion de un articulo que tiene una cubierta decorativa que recubre un substrato moldeado por inyeccion que tiene una estructura celular. | |
AU342739S (en) | Electronic board |