IN2014DN08365A - - Google Patents

Info

Publication number
IN2014DN08365A
IN2014DN08365A IN8365DEN2014A IN2014DN08365A IN 2014DN08365 A IN2014DN08365 A IN 2014DN08365A IN 8365DEN2014 A IN8365DEN2014 A IN 8365DEN2014A IN 2014DN08365 A IN2014DN08365 A IN 2014DN08365A
Authority
IN
India
Prior art keywords
substrate
electrically conductive
conductive track
adhered
track
Prior art date
Application number
Other languages
English (en)
Inventor
Van Der Frank Peter Theodorus Johannes Burgt
Christiaan Schröder
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Publication of IN2014DN08365A publication Critical patent/IN2014DN08365A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Conductive Materials (AREA)
IN8365DEN2014 2012-04-27 2013-04-26 IN2014DN08365A (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12165949 2012-04-27
PCT/EP2013/058749 WO2013160454A2 (en) 2012-04-27 2013-04-26 Electrically conductive polyamide substrate

Publications (1)

Publication Number Publication Date
IN2014DN08365A true IN2014DN08365A (enrdf_load_stackoverflow) 2015-05-08

Family

ID=48227279

Family Applications (1)

Application Number Title Priority Date Filing Date
IN8365DEN2014 IN2014DN08365A (enrdf_load_stackoverflow) 2012-04-27 2013-04-26

Country Status (8)

Country Link
US (2) US20150107877A1 (enrdf_load_stackoverflow)
EP (1) EP2841503B1 (enrdf_load_stackoverflow)
JP (1) JP6146723B2 (enrdf_load_stackoverflow)
KR (1) KR102066304B1 (enrdf_load_stackoverflow)
CN (1) CN104254572B (enrdf_load_stackoverflow)
IN (1) IN2014DN08365A (enrdf_load_stackoverflow)
TW (1) TWI592079B (enrdf_load_stackoverflow)
WO (1) WO2013160454A2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015059190A1 (en) * 2013-10-25 2015-04-30 Dsm Ip Assets B.V. Electrically conductive polyamide substrate
WO2017074397A1 (en) 2015-10-29 2017-05-04 Hewlett-Packard Development Company, L.P. Forming three-dimensional (3d) printed electronics
DE102017129625B3 (de) * 2017-12-12 2019-05-23 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zur Bestückung einer Antennenstruktur mit einem elektronischen Bauelement
JP7657237B2 (ja) * 2020-03-13 2025-04-04 インヴィスタ テキスタイルズ（ユー．ケー．）リミテッド ネットワーク用途のための熱可塑性樹脂

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4355436B2 (ja) * 2000-10-25 2009-11-04 森村ケミカル株式会社 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
JP3998993B2 (ja) * 2002-02-14 2007-10-31 大日本印刷株式会社 ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体
KR100994399B1 (ko) * 2002-10-31 2010-11-16 도레이 카부시키가이샤 폴리아미드 및 폴리아미드 필름
JP4630542B2 (ja) * 2003-12-22 2011-02-09 キヤノン株式会社 配線形成方法
US20060258136A1 (en) * 2005-05-11 2006-11-16 Guangjin Li Method of forming a metal trace
WO2007038950A1 (en) * 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
US20070076021A1 (en) * 2005-09-30 2007-04-05 Stancik Edward J Processes for inkjet printing
BRPI0707219B1 (pt) 2006-01-26 2018-01-23 Dsm Ip Assets B.V. Poliamida semi-aromática semicristalina, seu processo de preparação, composição de polímero, uso da referida poliamida ou da composição de polímero, parte moldada e seu uso
EP2410824A3 (en) * 2006-02-20 2012-10-31 Daicel Chemical Industries, Ltd. Porous film and layered product including porous film
US9615463B2 (en) * 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
EP2078738A4 (en) * 2006-11-02 2011-07-20 Toyo Ink Mfg Co CONDUCTIVE INK, CONDUCTIVE CIRCUIT AND CONTACT-FREE MEDIA
US20080171181A1 (en) * 2007-01-11 2008-07-17 Molex Incorporated High-current traces on plated molded interconnect device
WO2009012936A1 (en) * 2007-07-23 2009-01-29 Dsm Ip Assets B.V. E/e connector and polymer composition used therein
CN101765627B (zh) * 2007-07-23 2012-12-05 帝斯曼知识产权资产管理有限公司 用于照明系统的塑料构件
JP4706690B2 (ja) * 2007-11-05 2011-06-22 パナソニック電工株式会社 回路基板及びその製造方法
CN102318450B (zh) * 2008-02-05 2016-10-19 普林斯顿大学理事会 印刷电子设备
JP5129077B2 (ja) * 2008-09-30 2013-01-23 富士フイルム株式会社 配線形成方法
US20100113669A1 (en) * 2008-10-30 2010-05-06 E.I. Du Pont De Nemours And Company Thermoplastic composition including hyperbranched aromatic polyamide
US8778247B2 (en) * 2009-01-16 2014-07-15 Dsm Ip Assets B.V. Polyamide films for flexible printed circuit boards
CN102686777A (zh) * 2009-03-24 2012-09-19 耶路撒冷希伯来大学伊森姆研究发展公司 低温烧结纳米颗粒的方法
US20110015328A1 (en) * 2009-07-17 2011-01-20 E.I.Du Pont De Nemours And Company Semi aromatic polyamide resin compositions, processes for their manufacture, and articles thereof
US8765025B2 (en) * 2010-06-09 2014-07-01 Xerox Corporation Silver nanoparticle composition comprising solvents with specific hansen solubility parameters
EP2410020B1 (de) * 2010-07-23 2013-01-30 Ems-Patent Ag Teilaromatische Polyamid-Formmassen und deren Verwendungen
WO2012058348A1 (en) * 2010-10-29 2012-05-03 E. I. Du Pont De Nemours And Company Overmolded polyamide composite structures and processes for their preparation
US8906479B2 (en) * 2011-12-30 2014-12-09 E I Du Pont De Nemours And Company Compositions of polyamide and ionomer

Also Published As

Publication number Publication date
CN104254572B (zh) 2017-04-05
US20150107877A1 (en) 2015-04-23
EP2841503A2 (en) 2015-03-04
WO2013160454A2 (en) 2013-10-31
JP2015520800A (ja) 2015-07-23
US20180371242A1 (en) 2018-12-27
TWI592079B (zh) 2017-07-11
CN104254572A (zh) 2014-12-31
KR20150004354A (ko) 2015-01-12
KR102066304B1 (ko) 2020-01-14
WO2013160454A3 (en) 2013-12-19
EP2841503B1 (en) 2018-08-29
JP6146723B2 (ja) 2017-06-14
TW201349968A (zh) 2013-12-01

Similar Documents

Publication Publication Date Title
MY167622A (en) An electrically operated aerosol generating system having aerosol production control
MX2012008415A (es) Metodo para la aplicacion de un nanorrevestimiento conformable por medio de un procedimiento de plasma de baja presion.
EP3064556A4 (en) Electrically conductive composition for thin film printing, and method for forming thin film conductive pattern
EP3042951A4 (en) New method for inducing dopamine-producing neural precursor cells
EP2620814A4 (en) METHOD FOR FORMING A CONDUCTIVE PATTERN, SUBSTRATE WITH THE CONDUCTIVE PATTERN, AND TOUCH SCREEN SENSOR
PL3038481T3 (pl) Węglowe podłoże przewodzące dla elektronicznego produktu dla osób palących
EP2915857A4 (en) CONDUCTIVE ADHESIVE FOR VECTOR PRINTED, CONNECTED BODY OF INORGANIC MATERIAL AND METHOD FOR THE PRODUCTION THEREOF
EP2692762A4 (en) ELECTRICALLY CONDUCTIVE COMPOSITION, ELECTRICALLY CONDUCTIVE FILM WITH THIS COMPOSITION, AND METHOD OF MANUFACTURING THEREOF
EP3052630A4 (en) Recombinant microorganism for improved production of fine chemicals
PL2994229T3 (pl) Sposób wytwarzania 1,3-butadienu
KR20180085069A (ko) 도전 패턴의 제조방법 및 도전 패턴 형성 기판
EP3080273A4 (en) Recombinant microorganism for improved production of fine chemicals
EP3086378A4 (en) Composite substrate for light-emitting element and production method therefor
HK1204421A1 (en) Method and system for producing a multilayer element and multilayer element
GB2502753B (en) A non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
GB2510294A (en) Method of manufacturing a resistive touch sensor circuit by flexographic printing
WO2013009030A3 (en) Touch panel and method for electrode
EP3056551A4 (en) Photocationic curable inkjet ink, production method for photocationic curable inkjet ink, printed article, and production method for printed article
NZ720017A (en) Photovoltaic systems and spray coating processes for producing photovoltaic systems
IN2014DN08365A (enrdf_load_stackoverflow)
EP3052609A4 (en) Assembly for forming microchamber for inverted substrate
EP3039121A4 (en) Modified microorganism for improved production of alanine
EP3000612A4 (en) Structure and stencil printing plate which have been subjected to wettability-improving surface modification, and processes for producing both
MY166125A (en) Rfid antenna
IN2014DN06613A (enrdf_load_stackoverflow)