IN2014DN03368A - - Google Patents

Download PDF

Info

Publication number
IN2014DN03368A
IN2014DN03368A IN3368DEN2014A IN2014DN03368A IN 2014DN03368 A IN2014DN03368 A IN 2014DN03368A IN 3368DEN2014 A IN3368DEN2014 A IN 3368DEN2014A IN 2014DN03368 A IN2014DN03368 A IN 2014DN03368A
Authority
IN
India
Prior art keywords
less
deposit
satisfied
mass
particle size
Prior art date
Application number
Other languages
English (en)
Inventor
Kazunari Maki
Hiroyuki Mori
Original Assignee
Mitsubishi Materials Corp
Mitsubishi Shindo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp, Mitsubishi Shindo Kk filed Critical Mitsubishi Materials Corp
Publication of IN2014DN03368A publication Critical patent/IN2014DN03368A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02Single bars, rods, wires, or strips
IN3368DEN2014 2012-01-06 2013-01-04 IN2014DN03368A (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012001177 2012-01-06
JP2012203517 2012-09-14
PCT/JP2013/050004 WO2013103149A1 (fr) 2012-01-06 2013-01-04 Alliage de cuivre pour dispositif électronique/électrique, plaque mince en alliage de cuivre pour dispositif électronique/électrique, procédé de fabrication alliage de cuivre pour dispositif électronique/électrique, pièce conductrice et terminal pour dispositif électronique/électrique

Publications (1)

Publication Number Publication Date
IN2014DN03368A true IN2014DN03368A (fr) 2015-06-26

Family

ID=48745206

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3368DEN2014 IN2014DN03368A (fr) 2012-01-06 2013-01-04

Country Status (11)

Country Link
US (1) US8951369B2 (fr)
EP (2) EP3284835A3 (fr)
JP (1) JP5303678B1 (fr)
KR (1) KR101437307B1 (fr)
CN (2) CN105154713A (fr)
AU (1) AU2013207042B2 (fr)
CA (1) CA2852084A1 (fr)
IN (1) IN2014DN03368A (fr)
MX (1) MX352545B (fr)
TW (1) TWI452154B (fr)
WO (1) WO2013103149A1 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5303678B1 (ja) 2012-01-06 2013-10-02 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子
JP5572753B2 (ja) * 2012-12-26 2014-08-13 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5417523B1 (ja) * 2012-12-28 2014-02-19 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5572754B2 (ja) 2012-12-28 2014-08-13 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5417539B1 (ja) 2013-01-28 2014-02-19 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5501495B1 (ja) * 2013-03-18 2014-05-21 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP5604549B2 (ja) * 2013-03-18 2014-10-08 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
WO2015004940A1 (fr) * 2013-07-10 2015-01-15 三菱マテリアル株式会社 Alliage de cuivre pour équipement électronique/électrique, tôle fine en alliage de cuivre pour équipement électronique/électrique, composant conducteur pour équipement électronique/électrique et borne
JP5690979B1 (ja) * 2013-07-10 2015-03-25 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
EP3050982B1 (fr) * 2013-09-26 2019-03-20 Mitsubishi Shindoh Co., Ltd. Alliage de cuivre et feuille d'alliage de cuivre
JP6218325B2 (ja) * 2014-02-27 2017-10-25 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子
JP5783293B1 (ja) 2014-04-22 2015-09-24 三菱マテリアル株式会社 円筒型スパッタリングターゲット用素材
US10068829B2 (en) * 2014-04-25 2018-09-04 Mitsubishi Materials Corporation Power-module substrate unit and power module
US9791390B2 (en) * 2015-01-22 2017-10-17 EDAX, Incorporated Devices and systems for spatial averaging of electron backscatter diffraction patterns
JP2018070916A (ja) * 2016-10-26 2018-05-10 株式会社神戸製鋼所 銅合金
CN109338151B (zh) * 2018-12-14 2021-07-20 宁波博威合金材料股份有限公司 一种电子电气设备用铜合金及用途
KR20220041082A (ko) 2019-08-06 2022-03-31 미쓰비시 마테리알 가부시키가이샤 구리 합금판, 도금 피막이 형성된 구리 합금판 및 이것들의 제조 방법
JP7014211B2 (ja) 2019-09-27 2022-02-01 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7347402B2 (ja) * 2020-11-25 2023-09-20 ウシオ電機株式会社 回転式ホイルトラップおよび光源装置
CN113755715A (zh) * 2021-09-07 2021-12-07 大连理工大学 一种高性能铜合金及其制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124503A (en) 1976-04-09 1977-10-19 Hitachi Zosen Corp Composite boiler
JPH0533087A (ja) 1991-07-31 1993-02-09 Furukawa Electric Co Ltd:The 小型導電性部材用銅合金
JPH06184679A (ja) 1992-12-18 1994-07-05 Mitsui Mining & Smelting Co Ltd 電気部品用銅合金
US6695934B1 (en) 1997-09-16 2004-02-24 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
US5893953A (en) 1997-09-16 1999-04-13 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
US6679956B2 (en) 1997-09-16 2004-01-20 Waterbury Rolling Mills, Inc. Process for making copper-tin-zinc alloys
US7056396B2 (en) * 1998-10-09 2006-06-06 Sambo Copper Alloy Co., Ltd. Copper/zinc alloys having low levels of lead and good machinability
US6471792B1 (en) 1998-11-16 2002-10-29 Olin Corporation Stress relaxation resistant brass
JP3717321B2 (ja) * 1998-12-11 2005-11-16 古河電気工業株式会社 半導体リードフレーム用銅合金
JP4186095B2 (ja) 2000-04-27 2008-11-26 Dowaホールディングス株式会社 コネクタ用銅合金とその製造法
JP2002003966A (ja) 2000-06-20 2002-01-09 Furukawa Electric Co Ltd:The 半田接合性に優れる電子電気機器用銅合金
JP3953357B2 (ja) * 2002-04-17 2007-08-08 株式会社神戸製鋼所 電気、電子部品用銅合金
JP2005029826A (ja) * 2003-07-10 2005-02-03 Hitachi Cable Ltd 電子部品用銅合金箔の製造方法
JP2005060773A (ja) * 2003-08-12 2005-03-10 Mitsui Mining & Smelting Co Ltd 特殊黄銅及びその特殊黄銅の高力化方法
JP5050226B2 (ja) 2005-03-31 2012-10-17 Dowaメタルテック株式会社 銅合金材料の製造法
JP4804266B2 (ja) 2005-08-24 2011-11-02 Jx日鉱日石金属株式会社 電気電子機器用Cu−Zn−Sn合金及びその製造方法
KR101049655B1 (ko) * 2006-05-26 2011-07-14 가부시키가이샤 고베 세이코쇼 고강도, 고도전율 및 굽힘 가공성이 뛰어난 구리 합금
JP5466879B2 (ja) 2009-05-19 2014-04-09 Dowaメタルテック株式会社 銅合金板材およびその製造方法
JP5468423B2 (ja) * 2010-03-10 2014-04-09 株式会社神戸製鋼所 高強度高耐熱性銅合金材
JP5539055B2 (ja) * 2010-06-18 2014-07-02 株式会社Shカッパープロダクツ 電気・電子部品用銅合金材、及びその製造方法
KR101503208B1 (ko) 2010-08-27 2015-03-17 후루카와 덴키 고교 가부시키가이샤 구리합금 판재 및 그 제조방법
JP5088425B2 (ja) * 2011-01-13 2012-12-05 三菱マテリアル株式会社 電子・電気機器用銅合金、銅合金薄板および導電部材
JP5834528B2 (ja) 2011-06-22 2015-12-24 三菱マテリアル株式会社 電気・電子機器用銅合金
JP5303678B1 (ja) 2012-01-06 2013-10-02 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子

Also Published As

Publication number Publication date
EP2801630B1 (fr) 2017-11-01
EP3284835A3 (fr) 2018-02-28
MX352545B (es) 2017-11-29
MX2014006312A (es) 2014-06-23
KR20130128465A (ko) 2013-11-26
EP2801630A1 (fr) 2014-11-12
EP2801630A4 (fr) 2015-10-07
AU2013207042B2 (en) 2016-07-21
EP3284835A2 (fr) 2018-02-21
CN103502489B (zh) 2015-11-25
US20140087606A1 (en) 2014-03-27
JP5303678B1 (ja) 2013-10-02
KR101437307B1 (ko) 2014-09-03
CA2852084A1 (fr) 2013-07-11
US8951369B2 (en) 2015-02-10
CN103502489A (zh) 2014-01-08
AU2013207042A1 (en) 2014-05-29
CN105154713A (zh) 2015-12-16
TWI452154B (zh) 2014-09-11
AU2013207042A2 (en) 2014-09-11
WO2013103149A1 (fr) 2013-07-11
JP2014074220A (ja) 2014-04-24
TW201343937A (zh) 2013-11-01

Similar Documents

Publication Publication Date Title
IN2014DN03368A (fr)
MX2016003813A (es) Aleacion de cobre.
MY189251A (en) Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
MX363089B (es) Aleacion de cobre resistente a la presion y resistente a la corrosion de una estructura cobresoldada, y metodo para producir una estructura cobresoldada.
MX363092B (es) Aleacion de cobre y lamina de aleacion de cobre.
MY161774A (en) Fe-pt-c based sputtering target
IN2015DN00092A (fr)
MX2016001257A (es) Aleacion de cobre para equipo electronico y electrico, material de aleacion de cobre plasticamente trabajado para equipo electronico y electrico, y componente y terminal para equipo electronico y electrico.
JP2012028704A5 (fr)
EP2752857A3 (fr) Aimant fritté de terres rares R-T-B, alliage pour aimant fritté de terres rares R-T-B et son procédé de fabrication
MY158123A (en) Mixed alloy solder paste
MY164145A (en) Aluminum alloy material for heat exchanger fin, manufacturing method for same, and heat exchanger using the said aluminum alloy material
IN2014KN00840A (fr)
MX2014002319A (es) Chapa de aleacion de cobre y metodo para fabricar chapa de aleacion de cobre.
IN2014DN08291A (fr)
MY167861A (en) Leadless free-cutting copper alloy and method for producing the same
WO2014127014A3 (fr) Particules de silicium composite ou d'étain composite
MX2016000027A (es) Aleacion de cobre para equipo electronico y electrico, hoja delgada de aleacion de cobre para equipo electronico y/o electrico, y componente conductor para equipo electronico y electrico y terminal.
MY168936A (en) Adhesive composition and semiconductor device using same
MY158381A (en) Aluminum alloy plate for magnetic disk, aluminum alloy blank for magnetic disk, and aluminum alloy substrate for magnetic disk
EP2677007A8 (fr) Composition de résine antibactérienne
IN2015DN01192A (fr)
MY182025A (en) Copper alloy seamless tube
MY174127A (en) Fept-based sputtering target
JP2012229454A5 (fr)