IN2014CN04854A - - Google Patents
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- Publication number
- IN2014CN04854A IN2014CN04854A IN4854CHN2014A IN2014CN04854A IN 2014CN04854 A IN2014CN04854 A IN 2014CN04854A IN 4854CHN2014 A IN4854CHN2014 A IN 4854CHN2014A IN 2014CN04854 A IN2014CN04854 A IN 2014CN04854A
- Authority
- IN
- India
- Prior art keywords
- epoxy
- group
- anhydride
- reactive group
- functional
- Prior art date
Links
- 239000004593 Epoxy Substances 0.000 abstract 4
- 150000008064 anhydrides Chemical class 0.000 abstract 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- -1 polysiloxane Polymers 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 229910000077 silane Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2011/085080 WO2013097197A1 (en) | 2011-12-30 | 2011-12-30 | Functional silane-compatibilized epoxy compositions for insulation applications |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014CN04854A true IN2014CN04854A (ru) | 2015-09-18 |
Family
ID=48696260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN4854CHN2014 IN2014CN04854A (ru) | 2011-12-30 | 2011-12-30 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9127116B2 (ru) |
| EP (1) | EP2797980B1 (ru) |
| CN (1) | CN104144964B (ru) |
| BR (1) | BR112014015810A8 (ru) |
| IN (1) | IN2014CN04854A (ru) |
| PL (1) | PL2797980T3 (ru) |
| WO (1) | WO2013097197A1 (ru) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150344698A1 (en) * | 2014-06-03 | 2015-12-03 | Corning Incorporated | Adhesion primer for glass and ceramics |
| CN104151681B (zh) * | 2014-08-29 | 2017-01-11 | 上海至正道化高分子材料股份有限公司 | 一种高耐电痕adss光缆护套料 |
| WO2016093822A1 (en) * | 2014-12-10 | 2016-06-16 | Halliburton Energy Services, Inc. | Curable composition and resin for treatment of a subterranean formation |
| JP6779476B2 (ja) * | 2015-03-19 | 2020-11-04 | ナガセケムテックス株式会社 | 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材 |
| CN106317894B (zh) * | 2015-06-30 | 2019-03-29 | 比亚迪股份有限公司 | 有机硅组合物、反光涂层及其制备方法与包括其的光伏组件 |
| TWI557177B (zh) | 2015-12-16 | 2016-11-11 | 財團法人工業技術研究院 | 低介電無溶劑型樹脂組成物及基板結構 |
| JP7218604B2 (ja) * | 2018-02-26 | 2023-02-07 | 三菱ケミカル株式会社 | エポキシ基含有ポリオルガノシロキサンを含む硬化性樹脂組成物及びその硬化物 |
| DE102018218866A1 (de) * | 2018-11-06 | 2020-05-07 | Siemens Aktiengesellschaft | Elektrisches Betriebsmittel mit Isolationssystem, sowie Verfahren zur Herstellung des Isolationssystems |
| CN109593432A (zh) * | 2018-11-24 | 2019-04-09 | 上海凯虹特种材料科技有限公司 | 铁红环氧铝粉防锈漆 |
| CN110746576B (zh) * | 2019-09-20 | 2022-10-28 | 宏昌电子材料股份有限公司 | 一种改性的环氧树脂及其制备方法 |
| CN111234655A (zh) * | 2020-03-30 | 2020-06-05 | 南通福美新材料有限公司 | 一种纳米微孔绝热保温材料表面超疏水处理方法 |
| CN117683412B (zh) * | 2024-02-04 | 2024-04-19 | 湖南旗滨光能科技有限公司 | 一种无氟自清洁涂层及其制备方法与应用 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5212218A (en) | 1991-10-15 | 1993-05-18 | A. B. Chance Company | Hydrophobic, erodiable synthetic resin composition for electrical insulators |
| US5755608A (en) | 1996-07-18 | 1998-05-26 | Connector Set Limited Partnership | Top spindle for use with construction toy |
| EP0899304B1 (de) | 1997-08-27 | 2005-03-16 | Huntsman Advanced Materials (Switzerland) GmbH | Hydrophobes Epoxidharzsystem |
| US6764616B1 (en) | 1999-11-29 | 2004-07-20 | Huntsman Advanced Materials Americas Inc. | Hydrophobic epoxide resin system |
| JP2002020587A (ja) * | 2000-07-05 | 2002-01-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| TWI229929B (en) * | 2001-01-29 | 2005-03-21 | Ube Industries | Underfill material for COF mounting and electronic components |
| CN1670109A (zh) * | 2005-05-11 | 2005-09-21 | 李洁华 | 一种改性环氧树脂胶粘剂及其制备方法 |
| WO2008009560A1 (en) * | 2006-07-20 | 2008-01-24 | Abb Research Ltd | Hardenable epoxy resin composition |
| CN100577766C (zh) * | 2007-08-22 | 2010-01-06 | 中山大学 | 自催化交联型有机硅-环氧复合密封胶及其制备方法 |
| ATE500597T1 (de) | 2007-10-08 | 2011-03-15 | Abb Research Ltd | Oberflächenmodifiziertes elektrisches isolationssystem mit verbessertem tracking und erosionswiderstand |
| EP2222807A2 (en) | 2007-12-05 | 2010-09-01 | Corinne Jean Greyling | A polymeric high voltage insulator with a hard, hydrophobic surface |
| CN101999151A (zh) | 2008-02-12 | 2011-03-30 | Abb研究有限公司 | 表面改性的电绝缘系统 |
| WO2010127693A1 (en) | 2009-05-05 | 2010-11-11 | Abb Research Ltd | Curable sol-gel composition |
| CN102532809A (zh) * | 2011-11-17 | 2012-07-04 | 杭州师范大学 | 有机硅-环氧树脂组合物及其制备方法 |
-
2011
- 2011-12-30 US US14/359,386 patent/US9127116B2/en not_active Expired - Fee Related
- 2011-12-30 EP EP11879010.4A patent/EP2797980B1/en not_active Not-in-force
- 2011-12-30 PL PL11879010T patent/PL2797980T3/pl unknown
- 2011-12-30 IN IN4854CHN2014 patent/IN2014CN04854A/en unknown
- 2011-12-30 CN CN201180076218.XA patent/CN104144964B/zh active Active
- 2011-12-30 WO PCT/CN2011/085080 patent/WO2013097197A1/en active Application Filing
- 2011-12-30 BR BR112014015810A patent/BR112014015810A8/pt active Search and Examination
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014015810A2 (pt) | 2017-06-13 |
| BR112014015810A8 (pt) | 2017-07-04 |
| US20140378625A1 (en) | 2014-12-25 |
| PL2797980T3 (pl) | 2017-07-31 |
| US9127116B2 (en) | 2015-09-08 |
| CN104144964B (zh) | 2016-11-09 |
| WO2013097197A1 (en) | 2013-07-04 |
| EP2797980A1 (en) | 2014-11-05 |
| EP2797980B1 (en) | 2017-02-01 |
| CN104144964A (zh) | 2014-11-12 |
| EP2797980A4 (en) | 2015-09-30 |
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