IN2012DE00766A - - Google Patents
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- Publication number
- IN2012DE00766A IN2012DE00766A IN766DE2012A IN2012DE00766A IN 2012DE00766 A IN2012DE00766 A IN 2012DE00766A IN 766DE2012 A IN766DE2012 A IN 766DE2012A IN 2012DE00766 A IN2012DE00766 A IN 2012DE00766A
- Authority
- IN
- India
- Prior art keywords
- light
- wiring pattern
- emitting element
- circuit unit
- mounting layer
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011064582A JP2012204370A (ja) | 2011-03-23 | 2011-03-23 | 光源回路ユニットおよび照明装置、並びに表示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2012DE00766A true IN2012DE00766A (ja) | 2015-08-21 |
Family
ID=46859450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN766DE2012 IN2012DE00766A (ja) | 2011-03-23 | 2012-03-16 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8829776B2 (ja) |
JP (1) | JP2012204370A (ja) |
CN (2) | CN102694106A (ja) |
BR (1) | BR102012005930B1 (ja) |
IN (1) | IN2012DE00766A (ja) |
RU (1) | RU2595298C2 (ja) |
Families Citing this family (56)
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JP2013004815A (ja) | 2011-06-17 | 2013-01-07 | Sony Corp | 光源回路ユニットおよび照明装置、並びに表示装置 |
US9350980B2 (en) * | 2012-05-18 | 2016-05-24 | Reald Inc. | Crosstalk suppression in a directional backlight |
US9235057B2 (en) | 2012-05-18 | 2016-01-12 | Reald Inc. | Polarization recovery in a directional display device |
TWI636283B (zh) | 2012-05-18 | 2018-09-21 | 美商瑞爾D斯帕克有限責任公司 | 定向背光源、定向顯示裝置及其光源陣列的控制方法 |
US9678267B2 (en) | 2012-05-18 | 2017-06-13 | Reald Spark, Llc | Wide angle imaging directional backlights |
US9188731B2 (en) | 2012-05-18 | 2015-11-17 | Reald Inc. | Directional backlight |
KR20140020446A (ko) * | 2012-08-08 | 2014-02-19 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 갖는 표시 장치 |
CN105474633B (zh) | 2013-06-17 | 2019-07-09 | 瑞尔D斯帕克有限责任公司 | 控制定向背光的光源 |
DE102013211640A1 (de) * | 2013-06-20 | 2014-12-24 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
US9739928B2 (en) | 2013-10-14 | 2017-08-22 | Reald Spark, Llc | Light input for directional backlight |
EP3058562A4 (en) | 2013-10-14 | 2017-07-26 | RealD Spark, LLC | Control of directional display |
US20160230955A1 (en) * | 2014-05-27 | 2016-08-11 | El Lighting Co., LTD. | Optical module |
WO2015200814A1 (en) | 2014-06-26 | 2015-12-30 | Reald Inc. | Directional privacy display |
WO2016057690A1 (en) | 2014-10-08 | 2016-04-14 | Reald Inc. | Directional backlight |
WO2016105541A1 (en) | 2014-12-24 | 2016-06-30 | Reald Inc. | Adjustment of perceived roundness in stereoscopic image of a head |
JP6414485B2 (ja) * | 2015-02-27 | 2018-10-31 | 日亜化学工業株式会社 | 発光装置 |
JP2016162971A (ja) | 2015-03-04 | 2016-09-05 | パナソニックIpマネジメント株式会社 | Ledモジュール |
RU2596062C1 (ru) | 2015-03-20 | 2016-08-27 | Автономная Некоммерческая Образовательная Организация Высшего Профессионального Образования "Сколковский Институт Науки И Технологий" | Способ коррекции изображения глаз с использованием машинного обучения и способ машинного обучения |
EP3779527A1 (en) | 2015-04-13 | 2021-02-17 | RealD Spark, LLC | Wide angle imaging directional backlights |
KR101694702B1 (ko) * | 2015-04-21 | 2017-01-11 | 우리이앤엘 주식회사 | Led 광원 유닛 및 이를 이용한 백라이트 어셈블리 |
EP3304188B1 (en) | 2015-05-27 | 2020-10-07 | RealD Spark, LLC | Wide angle imaging directional backlights |
JP6506899B2 (ja) * | 2015-10-08 | 2019-04-24 | 日亜化学工業株式会社 | 発光装置、集積型発光装置および発光モジュール |
EP3369034B1 (en) | 2015-10-26 | 2023-07-05 | RealD Spark, LLC | Intelligent privacy system, apparatus, and method thereof |
WO2017083526A1 (en) | 2015-11-10 | 2017-05-18 | Reald Inc. | Distortion matching polarization conversion systems and methods thereof |
EP3374692B1 (en) | 2015-11-13 | 2021-02-24 | RealD Spark, LLC | Wide angle imaging directional backlights |
EP4293417A3 (en) | 2015-11-13 | 2024-01-24 | RealD Spark, LLC | Surface features for imaging directional backlights |
CN108463787B (zh) | 2016-01-05 | 2021-11-30 | 瑞尔D斯帕克有限责任公司 | 多视角图像的注视校正 |
JP2017152450A (ja) * | 2016-02-22 | 2017-08-31 | 大日本印刷株式会社 | Led表示装置 |
WO2017200950A1 (en) | 2016-05-19 | 2017-11-23 | Reald Spark, Llc | Wide angle imaging directional backlights |
CN109496258A (zh) | 2016-05-23 | 2019-03-19 | 瑞尔D斯帕克有限责任公司 | 广角成像定向背光源 |
US10401638B2 (en) | 2017-01-04 | 2019-09-03 | Reald Spark, Llc | Optical stack for imaging directional backlights |
US10408992B2 (en) | 2017-04-03 | 2019-09-10 | Reald Spark, Llc | Segmented imaging directional backlights |
CN109031774B (zh) * | 2017-06-12 | 2021-06-11 | 群创光电股份有限公司 | 显示器 |
WO2019032604A1 (en) | 2017-08-08 | 2019-02-14 | Reald Spark, Llc | ADJUSTING A DIGITAL REPRESENTATION OF A HEADQUARTERS |
US11109014B2 (en) | 2017-11-06 | 2021-08-31 | Reald Spark, Llc | Privacy display apparatus |
CN107966853A (zh) * | 2017-11-17 | 2018-04-27 | 武汉华星光电技术有限公司 | 液晶显示器及其背光模组 |
WO2019147771A1 (en) | 2018-01-25 | 2019-08-01 | Reald Spark, Llc | Touch screen for privacy display |
EP3810980A1 (en) * | 2018-06-21 | 2021-04-28 | Signify Holding B.V. | A lighting module |
CN110908180A (zh) * | 2018-09-17 | 2020-03-24 | 夏普株式会社 | 照明装置、显示装置及照明装置的制造方法 |
JP7282620B2 (ja) | 2019-07-04 | 2023-05-29 | シャープ福山レーザー株式会社 | 画像表示素子 |
US11430921B2 (en) * | 2019-12-17 | 2022-08-30 | Intel Corporation | Micro LED apparatus including color conversion structures and methods of manufacturing the same |
CN113270437A (zh) * | 2020-02-17 | 2021-08-17 | 京东方科技集团股份有限公司 | 背板及其制备方法、显示装置 |
CN111293148B (zh) * | 2020-02-20 | 2022-08-19 | 绵阳京东方光电科技有限公司 | 显示装置、显示面板及其制造方法 |
WO2021190414A1 (zh) | 2020-03-25 | 2021-09-30 | 海信视像科技股份有限公司 | 一种显示装置 |
WO2021190399A1 (zh) | 2020-03-25 | 2021-09-30 | 海信视像科技股份有限公司 | 一种显示装置 |
CN114428421B (zh) * | 2020-10-29 | 2023-04-18 | 海信视像科技股份有限公司 | 一种显示装置 |
WO2021218478A1 (zh) | 2020-04-28 | 2021-11-04 | 海信视像科技股份有限公司 | 一种显示装置 |
WO2022060673A1 (en) | 2020-09-16 | 2022-03-24 | Reald Spark, Llc | Vehicle external illumination device |
CN114520281A (zh) | 2020-11-20 | 2022-05-20 | 隆达电子股份有限公司 | 发光装置、背光板及显示面板 |
KR20220081577A (ko) * | 2020-12-09 | 2022-06-16 | 삼성전자주식회사 | 디스플레이 장치 및 그 광원 장치 |
EP4191691A4 (en) | 2021-01-04 | 2024-03-20 | Samsung Electronics Co Ltd | DISPLAY DEVICE AND ASSOCIATED LIGHT SOURCE DEVICE |
CN115720644A (zh) * | 2021-05-27 | 2023-02-28 | 京东方科技集团股份有限公司 | 背光模组、其制作方法及显示装置 |
KR20230116519A (ko) * | 2022-01-28 | 2023-08-04 | 삼성전자주식회사 | 디스플레이 장치 및 그 광원 장치 |
CN114994980B (zh) * | 2022-06-01 | 2024-01-26 | Tcl华星光电技术有限公司 | 背光板及其制备方法、显示装置 |
CN117642688A (zh) * | 2022-06-30 | 2024-03-01 | 京东方科技集团股份有限公司 | 发光基板及其制备方法、背光模组及显示装置 |
WO2024030274A1 (en) | 2022-08-02 | 2024-02-08 | Reald Spark, Llc | Pupil tracking near-eye display |
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JP4983347B2 (ja) * | 2007-04-03 | 2012-07-25 | ソニー株式会社 | 発光装置及び光源装置 |
JP4521013B2 (ja) * | 2007-05-15 | 2010-08-11 | 株式会社日立製作所 | 照明装置および該照明装置を用いた液晶表示装置 |
JP2009267289A (ja) * | 2008-04-30 | 2009-11-12 | Citizen Electronics Co Ltd | 発光装置 |
JP5345363B2 (ja) * | 2008-06-24 | 2013-11-20 | シャープ株式会社 | 発光装置 |
JP2010103355A (ja) * | 2008-10-24 | 2010-05-06 | Alpine Electronics Inc | バックライト用ledモジュール |
JP2010165572A (ja) * | 2009-01-16 | 2010-07-29 | Sony Corp | 平面発光装置、パネル、および表示装置 |
KR20100094246A (ko) * | 2009-02-18 | 2010-08-26 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
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2011
- 2011-03-23 JP JP2011064582A patent/JP2012204370A/ja active Pending
-
2012
- 2012-03-16 IN IN766DE2012 patent/IN2012DE00766A/en unknown
- 2012-03-16 BR BR102012005930-4A patent/BR102012005930B1/pt active IP Right Grant
- 2012-03-16 CN CN2012100708393A patent/CN102694106A/zh active Pending
- 2012-03-16 RU RU2012110241/28A patent/RU2595298C2/ru active
- 2012-03-16 CN CN201810269811.XA patent/CN108493313A/zh active Pending
- 2012-03-23 US US13/428,351 patent/US8829776B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN102694106A (zh) | 2012-09-26 |
US20120243261A1 (en) | 2012-09-27 |
RU2595298C2 (ru) | 2016-08-27 |
BR102012005930B1 (pt) | 2020-09-24 |
CN108493313A (zh) | 2018-09-04 |
US8829776B2 (en) | 2014-09-09 |
BR102012005930A2 (pt) | 2015-07-28 |
RU2012110241A (ru) | 2013-09-27 |
JP2012204370A (ja) | 2012-10-22 |
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