IN155987B - - Google Patents

Info

Publication number
IN155987B
IN155987B IN816/CAL/81A IN816CA1981A IN155987B IN 155987 B IN155987 B IN 155987B IN 816CA1981 A IN816CA1981 A IN 816CA1981A IN 155987 B IN155987 B IN 155987B
Authority
IN
India
Application number
IN816/CAL/81A
Other languages
English (en)
Inventor
Doris Winifred Flatley
Sheng Teng Hsu
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22980524&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IN155987(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rca Corp filed Critical Rca Corp
Publication of IN155987B publication Critical patent/IN155987B/en

Links

Classifications

    • H10P95/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers
IN816/CAL/81A 1981-04-28 1981-07-20 IN155987B (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/258,431 US4349584A (en) 1981-04-28 1981-04-28 Process for tapering openings in ternary glass coatings

Publications (1)

Publication Number Publication Date
IN155987B true IN155987B (cg-RX-API-DMAC10.html) 1985-04-20

Family

ID=22980524

Family Applications (1)

Application Number Title Priority Date Filing Date
IN816/CAL/81A IN155987B (cg-RX-API-DMAC10.html) 1981-04-28 1981-07-20

Country Status (9)

Country Link
US (1) US4349584A (cg-RX-API-DMAC10.html)
JP (1) JPS57186343A (cg-RX-API-DMAC10.html)
CA (1) CA1189426A (cg-RX-API-DMAC10.html)
DE (1) DE3215101C2 (cg-RX-API-DMAC10.html)
GB (1) GB2097582B (cg-RX-API-DMAC10.html)
IN (1) IN155987B (cg-RX-API-DMAC10.html)
IT (1) IT1218317B (cg-RX-API-DMAC10.html)
SE (1) SE457179B (cg-RX-API-DMAC10.html)
YU (1) YU44340B (cg-RX-API-DMAC10.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455325A (en) * 1981-03-16 1984-06-19 Fairchild Camera And Instrument Corporation Method of inducing flow or densification of phosphosilicate glass for integrated circuits
US4433008A (en) * 1982-05-11 1984-02-21 Rca Corporation Doped-oxide diffusion of phosphorus using borophosphosilicate glass
US4420503A (en) * 1982-05-17 1983-12-13 Rca Corporation Low temperature elevated pressure glass flow/re-flow process
US4476621A (en) * 1983-02-01 1984-10-16 Gte Communications Products Corporation Process for making transistors with doped oxide densification
US4575921A (en) * 1983-11-04 1986-03-18 General Motors Corporation Silicon nitride formation and use in self-aligned semiconductor device manufacturing method
US4528211A (en) * 1983-11-04 1985-07-09 General Motors Corporation Silicon nitride formation and use in self-aligned semiconductor device manufacturing method
US4582745A (en) * 1984-01-17 1986-04-15 Rca Corporation Dielectric layers in multilayer refractory metallization structure
DE3425531A1 (de) * 1984-07-11 1986-01-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum verfliessenlassen von dotierten sio(pfeil abwaerts)2(pfeil abwaerts)-schichten bei der herstellung von integrierten mos-halbleiterschaltungen
US4546016A (en) * 1984-08-06 1985-10-08 Rca Corporation Deposition of borophosphosilicate glass
GB2168340B (en) * 1984-12-13 1988-11-02 Stc Plc Contacting an integrated circuit with a metallisation pattern
US4743564A (en) * 1984-12-28 1988-05-10 Kabushiki Kaisha Toshiba Method for manufacturing a complementary MOS type semiconductor device
ATE64237T1 (de) * 1985-05-22 1991-06-15 Siemens Ag Verfahren zum herstellen von mit bor und phosphor dotierten siliziumoxid-schichten fuer integrierte halbleiterschaltungen.
GB8523373D0 (en) * 1985-09-21 1985-10-23 Stc Plc Via profiling in integrated circuits
US4755479A (en) * 1986-02-17 1988-07-05 Fujitsu Limited Manufacturing method of insulated gate field effect transistor using reflowable sidewall spacers
JPS6381948A (ja) * 1986-09-26 1988-04-12 Toshiba Corp 多層配線半導体装置
EP0369336A3 (en) * 1988-11-14 1990-08-22 National Semiconductor Corporation Process for fabricating bipolar and cmos transistors on a common substrate
JPH0793354B2 (ja) * 1988-11-28 1995-10-09 株式会社東芝 半導体装置の製造方法
US5747389A (en) * 1991-04-30 1998-05-05 Intel Corporation Crack resistant passivation layer
US5424570A (en) * 1992-01-31 1995-06-13 Sgs-Thomson Microelectronics, Inc. Contact structure for improving photoresist adhesion on a dielectric layer
EP0562625B1 (en) * 1992-03-27 1997-06-04 Matsushita Electric Industrial Co., Ltd. A semiconductor device and process
US6239017B1 (en) 1998-09-18 2001-05-29 Industrial Technology Research Institute Dual damascene CMP process with BPSG reflowed contact hole

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3925572A (en) * 1972-10-12 1975-12-09 Ncr Co Multilevel conductor structure and method
US3833919A (en) * 1972-10-12 1974-09-03 Ncr Multilevel conductor structure and method
JPS5922378B2 (ja) * 1975-08-13 1984-05-26 株式会社東芝 半導体装置の製造方法
US4097889A (en) * 1976-11-01 1978-06-27 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4091407A (en) * 1976-11-01 1978-05-23 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4273805A (en) * 1978-06-19 1981-06-16 Rca Corporation Passivating composite for a semiconductor device comprising a silicon nitride (Si1 3N4) layer and phosphosilicate glass (PSG) layer
GB2031225B (en) * 1978-09-15 1983-07-20 Westinghouse Electric Corp Glass-sealed thyristor junctions
CA1174285A (en) * 1980-04-28 1984-09-11 Michelangelo Delfino Laser induced flow of integrated circuit structure materials

Also Published As

Publication number Publication date
CA1189426A (en) 1985-06-25
SE457179B (sv) 1988-12-05
GB2097582A (en) 1982-11-03
GB2097582B (en) 1985-10-30
YU44340B (en) 1990-06-30
DE3215101C2 (de) 1995-06-22
DE3215101A1 (de) 1982-11-11
IT8220463A0 (it) 1982-03-29
SE8202597L (sv) 1982-10-29
JPS57186343A (en) 1982-11-16
YU91382A (en) 1985-04-30
IT1218317B (it) 1990-04-12
US4349584A (en) 1982-09-14

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