GB2168340B - Contacting an integrated circuit with a metallisation pattern - Google Patents
Contacting an integrated circuit with a metallisation patternInfo
- Publication number
- GB2168340B GB2168340B GB08529383A GB8529383A GB2168340B GB 2168340 B GB2168340 B GB 2168340B GB 08529383 A GB08529383 A GB 08529383A GB 8529383 A GB8529383 A GB 8529383A GB 2168340 B GB2168340 B GB 2168340B
- Authority
- GB
- United Kingdom
- Prior art keywords
- contacting
- integrated circuit
- metallisation pattern
- metallisation
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001465 metallisation Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
- C23D13/00—After-treatment of the enamelled articles
- C23D13/02—Removing defects by local re-melting of the enamel; Adjusting the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08529383A GB2168340B (en) | 1984-12-13 | 1985-11-29 | Contacting an integrated circuit with a metallisation pattern |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB848431525A GB8431525D0 (en) | 1984-12-13 | 1984-12-13 | Forming glass layers |
GB08529383A GB2168340B (en) | 1984-12-13 | 1985-11-29 | Contacting an integrated circuit with a metallisation pattern |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8529383D0 GB8529383D0 (en) | 1986-01-08 |
GB2168340A GB2168340A (en) | 1986-06-18 |
GB2168340B true GB2168340B (en) | 1988-11-02 |
Family
ID=26288570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08529383A Expired GB2168340B (en) | 1984-12-13 | 1985-11-29 | Contacting an integrated circuit with a metallisation pattern |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2168340B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6514876B1 (en) * | 1999-09-07 | 2003-02-04 | Steag Rtp Systems, Inc. | Pre-metal dielectric rapid thermal processing for sub-micron technology |
GB0123744D0 (en) | 2001-10-03 | 2001-11-21 | Qinetiq Ltd | Coated optical components |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4349584A (en) * | 1981-04-28 | 1982-09-14 | Rca Corporation | Process for tapering openings in ternary glass coatings |
-
1985
- 1985-11-29 GB GB08529383A patent/GB2168340B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB8529383D0 (en) | 1986-01-08 |
GB2168340A (en) | 1986-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19991129 |