JPS57186343A - Method of rounding opening edge of glass film - Google Patents

Method of rounding opening edge of glass film

Info

Publication number
JPS57186343A
JPS57186343A JP57071123A JP7112382A JPS57186343A JP S57186343 A JPS57186343 A JP S57186343A JP 57071123 A JP57071123 A JP 57071123A JP 7112382 A JP7112382 A JP 7112382A JP S57186343 A JPS57186343 A JP S57186343A
Authority
JP
Japan
Prior art keywords
opening edge
glass film
rounding
rounding opening
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57071123A
Other languages
English (en)
Inventor
Uinifuretsudo Furatorii Dorisu
Ten Suu Shien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22980524&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS57186343(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by RCA Corp filed Critical RCA Corp
Publication of JPS57186343A publication Critical patent/JPS57186343A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrodes Of Semiconductors (AREA)
JP57071123A 1981-04-28 1982-04-27 Method of rounding opening edge of glass film Pending JPS57186343A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/258,431 US4349584A (en) 1981-04-28 1981-04-28 Process for tapering openings in ternary glass coatings

Publications (1)

Publication Number Publication Date
JPS57186343A true JPS57186343A (en) 1982-11-16

Family

ID=22980524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57071123A Pending JPS57186343A (en) 1981-04-28 1982-04-27 Method of rounding opening edge of glass film

Country Status (9)

Country Link
US (1) US4349584A (ja)
JP (1) JPS57186343A (ja)
CA (1) CA1189426A (ja)
DE (1) DE3215101C2 (ja)
GB (1) GB2097582B (ja)
IN (1) IN155987B (ja)
IT (1) IT1218317B (ja)
SE (1) SE457179B (ja)
YU (1) YU44340B (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455325A (en) * 1981-03-16 1984-06-19 Fairchild Camera And Instrument Corporation Method of inducing flow or densification of phosphosilicate glass for integrated circuits
US4433008A (en) * 1982-05-11 1984-02-21 Rca Corporation Doped-oxide diffusion of phosphorus using borophosphosilicate glass
US4420503A (en) * 1982-05-17 1983-12-13 Rca Corporation Low temperature elevated pressure glass flow/re-flow process
US4476621A (en) * 1983-02-01 1984-10-16 Gte Communications Products Corporation Process for making transistors with doped oxide densification
US4528211A (en) * 1983-11-04 1985-07-09 General Motors Corporation Silicon nitride formation and use in self-aligned semiconductor device manufacturing method
US4575921A (en) * 1983-11-04 1986-03-18 General Motors Corporation Silicon nitride formation and use in self-aligned semiconductor device manufacturing method
US4582745A (en) * 1984-01-17 1986-04-15 Rca Corporation Dielectric layers in multilayer refractory metallization structure
DE3425531A1 (de) * 1984-07-11 1986-01-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum verfliessenlassen von dotierten sio(pfeil abwaerts)2(pfeil abwaerts)-schichten bei der herstellung von integrierten mos-halbleiterschaltungen
US4546016A (en) * 1984-08-06 1985-10-08 Rca Corporation Deposition of borophosphosilicate glass
GB2168340B (en) * 1984-12-13 1988-11-02 Stc Plc Contacting an integrated circuit with a metallisation pattern
US4743564A (en) * 1984-12-28 1988-05-10 Kabushiki Kaisha Toshiba Method for manufacturing a complementary MOS type semiconductor device
EP0204182B1 (de) * 1985-05-22 1991-06-05 Siemens Aktiengesellschaft Verfahren zum Herstellen von mit Bor und Phosphor dotierten Siliziumoxid-Schichten für integrierte Halbleiterschaltungen
GB8523373D0 (en) * 1985-09-21 1985-10-23 Stc Plc Via profiling in integrated circuits
US4755479A (en) * 1986-02-17 1988-07-05 Fujitsu Limited Manufacturing method of insulated gate field effect transistor using reflowable sidewall spacers
JPS6381948A (ja) * 1986-09-26 1988-04-12 Toshiba Corp 多層配線半導体装置
EP0369336A3 (en) * 1988-11-14 1990-08-22 National Semiconductor Corporation Process for fabricating bipolar and cmos transistors on a common substrate
JPH0793354B2 (ja) * 1988-11-28 1995-10-09 株式会社東芝 半導体装置の製造方法
US5747389A (en) * 1991-04-30 1998-05-05 Intel Corporation Crack resistant passivation layer
US5424570A (en) * 1992-01-31 1995-06-13 Sgs-Thomson Microelectronics, Inc. Contact structure for improving photoresist adhesion on a dielectric layer
DE69311184T2 (de) * 1992-03-27 1997-09-18 Matsushita Electric Ind Co Ltd Halbleitervorrichtung samt Herstellungsverfahren
US6239017B1 (en) 1998-09-18 2001-05-29 Industrial Technology Research Institute Dual damascene CMP process with BPSG reflowed contact hole

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5221784A (en) * 1975-08-13 1977-02-18 Toshiba Corp Production system for semiconductor unit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3925572A (en) * 1972-10-12 1975-12-09 Ncr Co Multilevel conductor structure and method
US3833919A (en) * 1972-10-12 1974-09-03 Ncr Multilevel conductor structure and method
US4091407A (en) * 1976-11-01 1978-05-23 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4097889A (en) * 1976-11-01 1978-06-27 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4273805A (en) * 1978-06-19 1981-06-16 Rca Corporation Passivating composite for a semiconductor device comprising a silicon nitride (Si1 3N4) layer and phosphosilicate glass (PSG) layer
GB2031225B (en) * 1978-09-15 1983-07-20 Westinghouse Electric Corp Glass-sealed thyristor junctions
CA1174285A (en) * 1980-04-28 1984-09-11 Michelangelo Delfino Laser induced flow of integrated circuit structure materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5221784A (en) * 1975-08-13 1977-02-18 Toshiba Corp Production system for semiconductor unit

Also Published As

Publication number Publication date
SE8202597L (sv) 1982-10-29
GB2097582A (en) 1982-11-03
IT8220463A0 (it) 1982-03-29
YU91382A (en) 1985-04-30
CA1189426A (en) 1985-06-25
IN155987B (ja) 1985-04-20
IT1218317B (it) 1990-04-12
US4349584A (en) 1982-09-14
YU44340B (en) 1990-06-30
DE3215101C2 (de) 1995-06-22
DE3215101A1 (de) 1982-11-11
SE457179B (sv) 1988-12-05
GB2097582B (en) 1985-10-30

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