IL86514A0 - - Google Patents

Info

Publication number
IL86514A0
IL86514A0 IL86514A IL8651488A IL86514A0 IL 86514 A0 IL86514 A0 IL 86514A0 IL 86514 A IL86514 A IL 86514A IL 8651488 A IL8651488 A IL 8651488A IL 86514 A0 IL86514 A0 IL 86514A0
Authority
IL
Israel
Application number
IL86514A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to IL86514A priority Critical patent/IL86514A0/xx
Publication of IL86514A0 publication Critical patent/IL86514A0/xx
Priority to GB8912064A priority patent/GB2220100A/en
Priority to US07/356,701 priority patent/US5105147A/en
Priority to JP1134444A priority patent/JPH02236149A/ja
Priority to DE3917260A priority patent/DE3917260A1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
IL86514A 1988-05-26 1988-05-26 IL86514A0 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IL86514A IL86514A0 (ja) 1988-05-26 1988-05-26
GB8912064A GB2220100A (en) 1988-05-26 1989-05-25 Wafer inspection system
US07/356,701 US5105147A (en) 1988-05-26 1989-05-25 Wafer inspection system
JP1134444A JPH02236149A (ja) 1988-05-26 1989-05-26 印刷回路検査システム
DE3917260A DE3917260A1 (de) 1988-05-26 1989-05-26 Waferinspektionseinrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL86514A IL86514A0 (ja) 1988-05-26 1988-05-26

Publications (1)

Publication Number Publication Date
IL86514A0 true IL86514A0 (ja) 1988-11-15

Family

ID=11058873

Family Applications (1)

Application Number Title Priority Date Filing Date
IL86514A IL86514A0 (ja) 1988-05-26 1988-05-26

Country Status (5)

Country Link
US (1) US5105147A (ja)
JP (1) JPH02236149A (ja)
DE (1) DE3917260A1 (ja)
GB (1) GB2220100A (ja)
IL (1) IL86514A0 (ja)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
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CH680275A5 (ja) * 1990-03-05 1992-07-31 Tet Techno Investment Trust
JP2821046B2 (ja) * 1991-09-05 1998-11-05 三菱電機エンジニアリング株式会社 半導体素子用特性検査装置
KR100291110B1 (ko) * 1993-06-19 2001-06-01 히가시 데쓰로 프로우브장치 및 그것을 사용한 피검사체의 검사방법
US5421889A (en) * 1993-06-29 1995-06-06 Tokyo Electron Limited Method and apparatus for inverting samples in a process
DE4412202C2 (de) * 1994-04-08 1996-04-18 Ludwig Dr Koester Verfahren zur berührungslosen Bestimmung des Leitungstyps von Halbleitermaterialien und Meßkopf zur Durchführung des Verfahrens
KR100192961B1 (ko) * 1995-12-29 1999-06-15 윤종용 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그작동방법
JPH09321102A (ja) * 1996-05-31 1997-12-12 Tokyo Electron Ltd 検査装置
US6392190B1 (en) 1998-01-23 2002-05-21 Smith International Automated hardfacing system
US6167322A (en) 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6113056A (en) * 1998-08-04 2000-09-05 Micrion Corporation Workpiece vibration damper
US6156580A (en) * 1998-11-18 2000-12-05 Advanced Micro Devices, Inc. Semiconductor wafer analysis system and method
US6401008B1 (en) 1998-11-18 2002-06-04 Advanced Micro Devices, Inc. Semiconductor wafer review system and method
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
WO2000058188A1 (en) * 1999-03-25 2000-10-05 N & K Technology, Inc. Wafer handling robot having x-y stage for wafer handling and positioning
US6341259B1 (en) 1999-06-04 2002-01-22 Interscience, Inc. Microsystems integrated testing and characterization system and method
AU2727401A (en) 1999-12-15 2001-06-25 Introbotics Corporation Automated domain reflectometry testing system
US6356337B1 (en) * 2000-03-08 2002-03-12 Anvik Corporation Two-sided substrate imaging using single-approach projection optics
US6798229B2 (en) * 2000-05-11 2004-09-28 Brian D. Butler Wide-bandwidth coaxial probe
US6708132B1 (en) 2000-06-02 2004-03-16 Interscience, Inc. Microsystems integrated testing and characterization system and method
US6612590B2 (en) 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
US7294317B2 (en) * 2001-02-08 2007-11-13 Sd Lizenzverwertungsgesellschaft Mbh & Co. Exothermic reaction system
DE10117167B4 (de) * 2001-04-06 2004-06-03 Leica Microsystems Wetzlar Gmbh Inspektionsmikroskop und Objektiv für ein Inspektionsmikroskop
US6695572B2 (en) * 2001-09-28 2004-02-24 Agere Systems Inc. Method and apparatus for minimizing semiconductor wafer contamination
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US7230441B2 (en) * 2002-07-18 2007-06-12 Rudolph Technologies, Inc. Wafer staging platform for a wafer inspection system
DE10303459A1 (de) * 2003-01-29 2004-08-19 Infineon Technologies Ag Verfahren und Vorrichtung zum Kontrollieren des Randes eines scheibenförmigen Gegenstandes
US7323888B1 (en) * 2003-11-01 2008-01-29 Colvin James B System and method for use in functional failure analysis by induced stimulus
US7872485B2 (en) * 2004-10-18 2011-01-18 Colvin James B System and method for use in functional failure analysis by induced stimulus
DE102004008289B4 (de) * 2004-02-20 2006-07-27 Integrated Dynamics Engineering Gmbh Roboterführungseinheit zur Bereitstellung einer Präzisionsbewegung eines Gegenstands
DE102004017114B4 (de) * 2004-04-07 2012-03-15 Integrated Dynamics Engineering Gmbh Vorrichtung zur Handhabung eines scheibenartigen Elements, insbesondere zur Handhabung eines Wafers
JP4915897B2 (ja) * 2005-07-19 2012-04-11 東京エレクトロン株式会社 脈動軽減装置及び検査装置
TWI478272B (zh) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
US20100175926A1 (en) * 2009-01-15 2010-07-15 Baker Hughes Incorporated Roller cones having non-integral cutting structures, drill bits including such cones, and methods of forming same
KR101711193B1 (ko) * 2010-06-04 2017-02-28 삼성전자 주식회사 웨이퍼 검사 방법 및 웨이퍼 검사 시스템
JP5333408B2 (ja) * 2010-10-22 2013-11-06 東京エレクトロン株式会社 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体
US9431282B2 (en) * 2011-12-27 2016-08-30 Rudolph Technologies, Inc. Wafer inversion mechanism
DE112014003220T5 (de) * 2013-07-11 2016-04-28 Kla-Tencor Corporation Konfigurationen für einen Metrologietisch und Verfahren zum Betreiben des Metrologietisches
US10840121B2 (en) 2016-10-31 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for unpacking semiconductor wafer container

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1044379A (en) * 1974-12-28 1978-12-12 Sony Corporation Wafer transfer device
US4516253A (en) * 1983-03-15 1985-05-07 Micronix Partners Lithography system
US4507078A (en) * 1983-03-28 1985-03-26 Silicon Valley Group, Inc. Wafer handling apparatus and method
GB2157078B (en) * 1984-03-30 1987-09-30 Perkin Elmer Corp Wafer alignment apparatus
JPS60239037A (ja) * 1984-05-12 1985-11-27 Yoshie Hasegawa 半導体ウエハプロ−バ
US4604715A (en) * 1984-10-19 1986-08-05 General Electric Company Robotic inspection system
JPS61105411A (ja) * 1984-10-29 1986-05-23 Mitsutoyo Mfg Co Ltd 多次元測定機の測定方法
US4656358A (en) * 1985-03-12 1987-04-07 Optoscan Corporation Laser-based wafer measuring system
US4755746A (en) * 1985-04-24 1988-07-05 Prometrix Corporation Apparatus and methods for semiconductor wafer testing
EP0219826B1 (en) * 1985-10-24 1994-09-07 Texas Instruments Incorporated Vacuum processing system
US4694243A (en) * 1986-05-28 1987-09-15 Westinghouse Electric Corp. Optical measurement using polarized and unpolarized light
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
JPH0669056B2 (ja) * 1986-09-11 1994-08-31 東京エレクトロン株式会社 プロ−ブ装置
US4772846A (en) * 1986-12-29 1988-09-20 Hughes Aircraft Company Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy

Also Published As

Publication number Publication date
GB2220100A (en) 1989-12-28
JPH02236149A (ja) 1990-09-19
DE3917260A1 (de) 1989-12-07
US5105147A (en) 1992-04-14
GB8912064D0 (en) 1989-07-12

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